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Selective Electroless Copper Deposition by Using Photolithographic Polymer/Ag Nanocomposite

IEEE transactions on electron devices, 2019-04, Vol.66 (4), p.1843-1848

2019

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Selective Metallization of 3D Printable Thermoplastic Polyurethanes

IEEE access, 2019-01, Vol.7, p.1-1

2019

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PEI/Ag as an Optical Gas Nano-Sensor for Intelligent Food Packaging

2018 IEEE 18th International Conference on Nanotechnology (IEEE-NANO), 2018, p.1-4

2018

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Hybrid Additive Manufacture of Conformal Antennas

2018 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP), 2018, p.1-3

2018

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Megasound acoustic surface treatment process in the Printed Circuit Board industry

2016 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2016, p.1-4

2016

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Process Management inside ATLAS DAQ

IEEE Transactions on Nuclear Science, 2002-10, Vol.49 (5), p.2459-2462

2002

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Use of statecharts in the modelling of dynamic behaviour in the ATLAS DAQ prototype-1

IEEE transactions on nuclear science, 1998-08, Vol.45 (4), p.1983-1988

1998

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Performance and scalability of the back-end sub-system in the ATLAS DAQ/EF prototype

IEEE Transactions on Nuclear Science, 2000-04, Vol.47 (2), p.244-249

2000

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Advanced electrical array interconnections for ultrasound probes integrated in surgical needles

2014 IEEE 16th Electronics Packaging Technology Conference (EPTC), 2014, p.88-93

2014

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A compact packaging technique for the integration of ultrasound probes in surgical needles

2015 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2015, p.1-5

2015

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Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation

2012 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, 2012, p.98-102

2012

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Ferroelectric nonvolatile memory technology: applications and integration challenges

IEEE transactions on components, packaging, and manufacturing technology. Part A, 1997-06, Vol.20 (2), p.175-181

1997

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Temperature dependence of the electrical performance of SrBi/sub 2/Ta/sub 2/O/sub 9/ for non-volatile memory applications

ISAF '96. Proceedings of the Tenth IEEE International Symposium on Applications of Ferroelectrics, 1996, Vol.1, p.55-58 vol.1

1996

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Process management inside ATLAS DAQ

2001 IEEE Nuclear Science Symposium Conference Record (Cat. No.01CH37310), 2001, Vol.1, p.511-514 vol.1

2001

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A new electrode technology for high-density nonvolatile ferroelectric (SrBi/sub 2/Ta/sub 2/O/sub 9/) memories

1996 Symposium on VLSI Technology. Digest of Technical Papers, 1996, p.26-27

1996

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Effects of film thickness and process parameters on the properties of SrBi/sub 2/Ta/sub 2/O/sub 9/ ferroelectric capacitors for non-volatile memory applications

ISAF '96. Proceedings of the Tenth IEEE International Symposium on Applications of Ferroelectrics, 1996, Vol.1, p.329-332 vol.1

1996

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Selective Electroless Copper Deposition by Using Photolithographic Polymer/Ag Nanocomposite

Selective Metallization of 3D Printable Thermoplastic Polyurethanes

PEI/Ag as an Optical Gas Nano-Sensor for Intelligent Food Packaging

Hybrid Additive Manufacture of Conformal Antennas

Megasound acoustic surface treatment process in the Printed Circuit Board industry

Process Management inside ATLAS DAQ

Use of statecharts in the modelling of dynamic behaviour in the ATLAS DAQ prototype-1

Performance and scalability of the back-end sub-system in the ATLAS DAQ/EF prototype

Advanced electrical array interconnections for ultrasound probes integrated in surgical needles

A compact packaging technique for the integration of ultrasound probes in surgical needles

Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation

Ferroelectric nonvolatile memory technology: applications and integration challenges

Temperature dependence of the electrical performance of SrBi/sub 2/Ta/sub 2/O/sub 9/ for non-volatile memory applications

Process management inside ATLAS DAQ

A new electrode technology for high-density nonvolatile ferroelectric (SrBi/sub 2/Ta/sub 2/O/sub 9/) memories

Effects of film thickness and process parameters on the properties of SrBi/sub 2/Ta/sub 2/O/sub 9/ ferroelectric capacitors for non-volatile memory applications

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