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Processing and Dielectric Properties of Nanocomposite Thin Film "Supercapacitors" for High-Frequency Embedded Decoupling

IEEE transactions on components and packaging technologies, 2007-12, Vol.30 (4), p.569-578

2007

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Integrating High-k Ceramic Thin Film Capacitors into Organic Substrates Via Low-Cost Solution Processing

IEEE transactions on components and packaging technologies, 2007-12, Vol.30 (4), p.585-594

2007

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Lead-Free Solder Films Via Novel Solution Synthesis Routes

IEEE transactions on components and packaging technologies, 2007-09, Vol.30 (3), p.486-493

2007

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Sol-Gel Processing of Some Electroceramic Powders

Journal of sol-gel science and technology, 1999-09, Vol.15 (3), p.263-270

1999

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Processing, Properties and Electrical Reliability of Embedded Ultra-Thin Film Ceramic Capacitors in Organic Packages

2007 Proceedings 57th Electronic Components and Technology Conference, 2007, p.1014-1018

2007

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Electrostatically deposited surface seeding and promotion of crystallization of sol-gel derived LaAl11O18 coating on oxide fibers

Journal of the European Ceramic Society, 1999-01, Vol.19 (13-14), p.2427-2435

1999

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Electrostatically deposited surface seeding and promotion of crystallization of sol-gel derived LaAl 11O 18 coating on oxide fibers

Journal of the European Ceramic Society, 1999, Vol.19 (13), p.2427-2435

1999

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Processing of Pb(Zr{sub 0.52}Ti{sub 0.48})O{sub 3} (PZT) ceramics from microwave and conventional hydrothermal powders

Materials research bulletin, 1999-07, Vol.34 (9)

1999

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Dielectric Properties of Highly Oriented Lead Zirconium Titanate Thin Films Prepared by Reactive RF-Sputtering

MRS proceedings, 1999, Vol.604, Article 3

1999

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Fabrication and device design of bulk and thin film photostrictive materials

IMTC 2001. Proceedings of the 18th IEEE Instrumentation and Measurement Technology Conference. Rediscovering Measurement in the Age of Informatics (Cat. No.01CH 37188), 2001, Vol.1, p.443-447 vol.1

2001

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Variable embedded capacitor for active systems packaging

Proceedings Electronic Components and Technology, 2005. ECTC '05, 2005, p.1574-1577 Vol. 2

2005

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Embedded decoupling capacitor performance in high speed circuits

Proceedings Electronic Components and Technology, 2005. ECTC '05, 2005, p.1617-1622 Vol. 2

2005

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New paradigm in IC package interconnections by reworkable nano-interconnects

2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546), 2004, Vol.1, p.451-460 Vol.1

2004

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Integrating Solution-Derived 3D PZT Structures on Si Mems Platform for RF and Biomedical Applications

2006 11th International Symposium on Advanced Packaging Materials: Processes, Properties and Interface, 2006, p.122-122

2006

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Organic-Based RF Capacitors with Ceramic-Like Properties

2007 Proceedings 57th Electronic Components and Technology Conference, 2007, p.1866-1869

2007

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Design, fabrication, and reliability assessment of embedded resistors and capacitors on multilayered organic substrates

Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005, 2005, p.249-254

2005

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Tailoring the temperature coefficient of capacitance (TCC), dielectric loss and capacitance density with ceramic-polymer nanocomposites for RF applications

56th Electronic Components and Technology Conference 2006, 2006, p.5 pp.

2006

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Material synthesis routes for thin film bonding interfaces in reworkable and bumpless nano-interconnects

9th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces (IEEE Cat. No.04TH8742). 2004 Proceedings, 2004, p.69-73

2004

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Integration and high-frequency characterization of PWB-compatible pure barium titanate films synthesized by modified hydrothermal techniques (< 100/spl deg/C)

53rd Electronic Components and Technology Conference, 2003. Proceedings, 2003, p.1520-1527

2003

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Sol-gel derived and repairable nano-interconnects

Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003), 2003, p.385-389

2003

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Processing and Dielectric Properties of Nanocomposite Thin Film "Supercapacitors" for High-Frequency Embedded Decoupling

Integrating High-k Ceramic Thin Film Capacitors into Organic Substrates Via Low-Cost Solution Processing

Lead-Free Solder Films Via Novel Solution Synthesis Routes

Sol-Gel Processing of Some Electroceramic Powders

Processing, Properties and Electrical Reliability of Embedded Ultra-Thin Film Ceramic Capacitors in Organic Packages

Electrostatically deposited surface seeding and promotion of crystallization of sol-gel derived LaAl11O18 coating on oxide fibers

Electrostatically deposited surface seeding and promotion of crystallization of sol-gel derived LaAl 11O 18 coating on oxide fibers

Processing of Pb(Zr{sub 0.52}Ti{sub 0.48})O{sub 3} (PZT) ceramics from microwave and conventional hydrothermal powders

Dielectric Properties of Highly Oriented Lead Zirconium Titanate Thin Films Prepared by Reactive RF-Sputtering

Fabrication and device design of bulk and thin film photostrictive materials

Variable embedded capacitor for active systems packaging

Embedded decoupling capacitor performance in high speed circuits

New paradigm in IC package interconnections by reworkable nano-interconnects

Integrating Solution-Derived 3D PZT Structures on Si Mems Platform for RF and Biomedical Applications

Organic-Based RF Capacitors with Ceramic-Like Properties

Design, fabrication, and reliability assessment of embedded resistors and capacitors on multilayered organic substrates

Tailoring the temperature coefficient of capacitance (TCC), dielectric loss and capacitance density with ceramic-polymer nanocomposites for RF applications

Material synthesis routes for thin film bonding interfaces in reworkable and bumpless nano-interconnects

Integration and high-frequency characterization of PWB-compatible pure barium titanate films synthesized by modified hydrothermal techniques (< 100/spl deg/C)

Sol-gel derived and repairable nano-interconnects

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