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Numerical simulation of the pneumatic conveying of dilute particulate flows in a diffuser using Euler-Euler approach
AIP Conference Proceedings, 2023, Vol.2685 (1)
2023
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Design and Development of an Interactive Chess Board for Quarto
2023 9th International Conference on Applied System Innovation (ICASI), 2023, p.226-228
2023
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Simple Industrial Cutting Machine Safety System Based on Computer Vision
2023 IEEE 3rd International Conference on Electronic Communications, Internet of Things and Big Data (ICEIB), 2023, p.487-490
2023
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Physical and reliability characteristics of Hf-based gate dielectrics on strained-Si/sub 1-x/Ge/sub x/ MOS devices
IEEE transactions on device and materials reliability, 2005-06, Vol.5 (2), p.168-176
2005
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Physical and reliability characteristics of Hf-based gate dielectrics on strained-Si1-xGex MOS devices
IEEE transactions on device and materials reliability, 2005-06, Vol.5 (2), p.168
2005
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Reaction of interfacial layer and trapping in HfO/sub 2/ gated MOS structures
Proceedings. 7th International Conference on Solid-State and Integrated Circuits Technology, 2004, 2004, Vol.1, p.399-402 vol.1
2004
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On the Design and Construction Assessments of a Permanent-Magnet-Assisted Synchronous Reluctance Motor
IEEE transactions on magnetics, 2017-11, Vol.53 (11), p.1-4
2017
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Management and Orchestration of Edge Computing for IoT: A Comprehensive Survey
IEEE internet of things journal, 2023-08, Vol.10 (16), p.1-1
2023
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Bio-Inspired Proximity Discovery and Synchronization for D2D Communications
IEEE communications letters, 2013-12, Vol.17 (12), p.2300-2303
2013
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Model-Based Development of Leaping in a Hexapod Robot
IEEE transactions on robotics, 2015-02, Vol.31 (1), p.40-54
2015
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Investigation of Low-Temperature Cu-Cu Direct Bonding With Pt Passivation Layer in 3-D Integration
IEEE transactions on components, packaging, and manufacturing technology (2011), 2021-04, Vol.11 (4), p.573-578
2021
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Dynamic Resource Allocation Framework for MooD (MBMS Operation On-Demand)
IEEE transactions on broadcasting, 2016-12, Vol.62 (4), p.903-917
2016
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Virtual Network Embedding With Dynamic Speed Switching Orchestration in Fog/Edge Network
IEEE access, 2020, Vol.8, p.84753-84768
2020
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Investigation of Pillar-Concave Structure for Low-Temperature Cu-Cu Direct Bonding in 3-D/2.5-D Heterogeneous Integration
IEEE transactions on components, packaging, and manufacturing technology (2011), 2020-08, Vol.10 (8), p.1296-1303
2020
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Low-Temperature Cu-Cu Direct Bonding Using Pillar-Concave Structure in Advanced 3-D Heterogeneous Integration
IEEE transactions on components, packaging, and manufacturing technology (2011), 2017-09, Vol.7 (9), p.1560-1566
2017
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Pentacene-Based Thin-Film Transistors With a Solution-Process Hafnium Oxide Insulator
IEEE electron device letters, 2009-10, Vol.30 (10), p.1039-1041
2009
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Enhancements of Substrate Deposition Rate and Target Erosion Profile in a DC Magnetron Sputtering System
IEEE transactions on magnetics, 2009-10, Vol.45 (10), p.4391-4394
2009
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Potentiometric Dopamine Sensor Based on Static and Dynamic Measurements
IEEE transactions on electron devices, 2024-07, p.1-8
2024
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An Efficient Graph-Based Algorithm for ESD Current Path Analysis
IEEE transactions on computer-aided design of integrated circuits and systems, 2008-08, Vol.27 (8), p.1363-1375
2008
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Research on pH Sensor Based on Cuprous Oxide Film Modified with Tungsten Trioxide Nanoparticles
IEEE sensors journal, 2024-07, p.1-1
2024
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Network Coding Based Data Distribution in WiMAX
2009 Tenth International Conference on Mobile Data Management: Systems, Services and Middleware, 2009, p.393-394
2009
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High-Performance Monolayer WSe2 p/n FETs via Antimony-Platinum Modulated Contact Technology towards 2D CMOS Electronics
2022 International Electron Devices Meeting (IEDM), 2022, p.7.2.1-7.2.4
2022
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Highly-Integrated Wideband 28 GHz and 39 GHz Array Antennas for 5G Mobile Phone Applications
2020 IEEE International Symposium on Antennas and Propagation and North American Radio Science Meeting, 2020, p.1581-1582
2020
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Process integration and 3D chip stacking for low cost backside illuminated CMOS image sensor
2015 International Symposium on VLSI Technology, Systems and Applications, 2015, p.1-2
2015
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Status and Performance of Integration Modules Toward Scaled CMOS with Transition Metal Dichalcogenide Channel
2023 International Electron Devices Meeting (IEDM), 2023, p.1-4
2023
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