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Computer methods in applied mechanics and engineering, 2015-01, Vol.283, p.1167-1188
2015
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Mechanical systems and signal processing, 2018-02, Vol.101, p.237-253
2018
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Biomaterials, 1998-10, Vol.19 (20), p.1861-1868
1998
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European cells & materials, 2019-05, Vol.37, p.402-419
2019
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European cells & materials, 2017-02, Vol.33, p.211-226
2017
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IEEE transactions on electron devices, 2023-12, Vol.70 (12), p.6658-6664
2023
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Materials, 2021-02, Vol.14 (5), p.1119
2021
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Additive manufacturing, 2020-03, Vol.32, p.100991, Article 100991
2020
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Physical review materials, 2022-06, Vol.6 (6), Article 064407
2022
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IEEE transactions on components, packaging, and manufacturing technology (2011), 2021-07, Vol.11 (7), p.1073-1080
2021
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Microelectronics and reliability, 2019-01, Vol.92, p.73-78
2019
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Procedia engineering, 2017, Vol.199, p.447-452
2017
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2018 IEEE Symposium on VLSI Circuits, 2018, p.81-82
2018
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Tissue engineering. Part C, Methods, 2017-11, Vol.23 (11), p.673
2017
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Journal of biomedical materials research, 1999-11, Vol.47 (2), p.204-212
1999
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2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 2020, p.1234-1240
2020
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Microelectronics and reliability, 2002-09, Vol.42 (9), p.1409-1413
2002
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2020 IEEE International Electron Devices Meeting (IEDM), 2020, p.32.2.1-32.2.4
- Tokei, Zs
- Vega, V.
- Murdoch, G.
- O'Toole, M.
- Croes, K.
- Baert, R.
- Veen, M. Van der
- Adelmann, C.
- Soulie, J. P.
- Boemmels, J.
- Wilson, C.
- Park, S. H.
- Sankaran, K.
- Pourtois, G.
- Sweerts, J.
- Paolillo, S.
- Decoster, S.
- Mao, M.
- Lazzarino, F.
- Versluijs, J.
- Blanco, V.
- Ercken, M.
- Kesters, E.
- Le, Q-T.
- Holsteyns, F.
- Heylen, N.
- Teugels, L.
- Devriendt, K.
- Struyf, H.
- Morin, P.
- Jourdan, N.
- Elshocht, S. Van
- Ciofi, I.
- Gupta, A.
- Zahedmanesh, H.
- Vanstreels, K.
- Na, M. H.
2020
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2017 IEEE International Electron Devices Meeting (IEDM), 2017, p.34.2.1-34.2.4
2017
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2019 IEEE International Electron Devices Meeting (IEDM), 2019, p.19.3.1-19.3.4
- Vega-Gonzalez, V.
- Bekaert, J.
- Kesters, E.
- Le, Q. T.
- Lorant, C.
- Varela P., O.
- Teugels, L.
- Heylen, N.
- El-Mekki, Z.
- van der Veen, M.
- Webers, T.
- Wilson, C. J.
- Vats, H.
- Rynders, L.
- Cupak, M.
- Uk-Lee, J.
- Drissi, Y.
- Halipre, L.
- Charley, A.-L.
- Verdonck, P.
- Witters, T.
- Gompel, S. V.
- Briggs, B.
- Kimura, Y.
- Jourdan, N.
- Ciofi, I.
- Gupta, A.
- Contino, A.
- Boccardi, G.
- Lariviere, S.
- Dupas, L.
- De-Wachter, B.
- Vancoille, E.
- Decoster, S.
- Lazzarino, F.
- Ercken, M
- Debacker, P.
- Kim, R.
- Trivkovic, D.
- Croes, K.
- Leray, P.
- Dillemans, L.
- Chen, Y.-F.
- Tokei, Z.
- Versluijs, J.
- Lesniewska, A.
- Paolillo, S.
- Baert, R.
- Puliyalil, H.
2019
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2020 IEEE International Electron Devices Meeting (IEDM), 2020, p.20.5.1-20.5.4
- Vega-Gonzalez, V.
- Puliyalil, H.
- Versluijs, J.
- Lesniewska, A.
- Varela-Pereira, O.
- Baert, R.
- Paolillo, S.
- Decoster, S.
- Schleicher, F.
- Montero, D.
- Bekaert, J.
- Kesters, E.
- Le, Q. T.
- Lorant, C.
- Teugels, L.
- Heylen, N.
- Jourdan, N.
- El-Mekki, Z.
- van der Veen, M.
- Ciofi, I.
- Briggs, B.
- Heijlen, J.
- Dupas, L.
- De-Wachter, B.
- Vancoille, E.
- Webers, T.
- Vats, H.
- Rynders, L.
- Cupak, M.
- Uk-Lee, J.
- Drissi, Y.
- Halipre, L.
- Charley, A.-L.
- Verdonck, P.
- Witters, T.
- Gompel, S. V.
- Kimura, Y.
- Demonie, I.
- Lazzarino, F.
- Ercken, M
- Kim, R.
- Trivkovic, D.
- Croes, K.
- Leray, P.
- Jaysankar, M.
- Wilson, C.
- Muroch, G.
- Tokei, Z.
2020
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2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC), 2016, p.21-23
2016
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Advances in Condition Monitoring of Machinery in Non-Stationary Operations, p.77-89
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2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM), 2015, p.91-94
2015
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2017 IEEE International Interconnect Technology Conference (IITC), 2017, p.1-3
2017
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