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Reactive wetting, evolution of interfacial and bulk IMCs and their effect on mechanical properties of eutectic Sn–Cu solder alloy

Advances in colloid and interface science, 2011-08, Vol.166 (1), p.87-118

2011

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Distribution and Microstructure Analysis of Ceramic Particles in the Lead‐Free Solder Matrix

Crystal research and technology (1979), 2020-12, Vol.55 (12), p.n/a

2020

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Improving the performance of lead-free solder reinforced with multi-walled carbon nanotubes

Materials science & engineering. A, Structural materials : properties, microstructure and processing, 2006-05, Vol.423 (1), p.166-169

2006

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Obtaining and Characterization of New Materials

Sandu, Andrei Victor

2022

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Study of the Si-containing amorphous layer by electrical discharge coating: Wettability and Erosion Resistance of the Si-containing amorphous layer for Lead-free solder

Journal of the Japan Society for Precision Engineering, 2012/11/05, Vol.78(11), pp.970-974

2012

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Evolution of High-Temperature and Low-Temperature High Strain Rate Properties for SAC-R after Sustained Exposure to 50°C

2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), 2021, p.719-728

2021

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放電表面処理によるSi含有アモルファス層に関する研究: Si含有アモルファス層の鉛フリーはんだ濡れ性および耐侵食性

精密工学会誌, 2012/11/05, Vol.78(11), pp.970-974

2012

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Kinetic study of solid-state interfacial reactions of p-type (Bi,Sb)2Te3 thermoelectric materials with Sn and Sn–Ag–Cu solders

Journal of alloys and compounds, 2018-10, Vol.767, p.1133-1140

2018

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Study of the Effects of Zn Content on the Interfacial Reactions Between Sn-Zn Solders and Ni Substrates at 250°C

Journal of electronic materials, 2010-11, Vol.39 (11), p.2375-2381

2010

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Properties of Sn3.8Ag0.7Cu solder alloy with trace rare earth element Y additions

Journal of electronic materials, 2007-07, Vol.36 (7), p.766-774

2007

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Investigation of microstructure, corrosion and mechanical properties of iron and holmium modified Sn-3.0Ag0.5Cu solder alloy with ultrasonic treatment

Materials characterization, 2024-09, Vol.215, p.114141, Article 114141

2024

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Defects in electronics and their significance for structural integrity

Fatigue & fracture of engineering materials & structures, 2007-05, Vol.30 (5), p.432-442

PLUMBRIDGE, W. J.

2007

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Analysis of BGA Lead-Free solder joints failure behavior based on thermal shock testing

Engineering failure analysis, 2024-11, Vol.165, p.108813, Article 108813

2024

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A diffusion model and growth kinetics of interfacial intermetallic compounds in Sn-0.3Ag-0.7Cu and Sn-0.3Ag-0.7Cu-0.5CeO2 solder joints

Journal of alloys and compounds, 2020-03, Vol.818, p.152893, Article 152893

2020

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Effects of joint size and isothermal aging on interfacial IMC growth in Sn-3.0Ag-0.5Cu-0.1TiO2 solder joints

Journal of alloys and compounds, 2017-03, Vol.697, p.104-113

2017

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Effect of adding 0.5wt% ZnO nanoparticles, temperature and strain rate on tensile properties of Sn–5.0wt% Sb–0.5wt% Cu (SSC505) lead free solder alloy

Materials science & engineering. A, Structural materials : properties, microstructure and processing, 2016-03, Vol.657, p.104-114

2016

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Electrodeposition of ternary Sn-Cu-Ni alloys as lead-free solders using deep eutectic solvents

Electrochimica acta, 2021-12, Vol.398, p.139339, Article 139339

2021

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A Drop-In High-Temperature Pb-Free Solder Paste That Outperforms High-Pb Pastes in Power Discrete Applications

Journal of microelectronics and electronic packaging, 2023-06, Vol.20 (2)

2023

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Microstructural development and mechanical properties of hypereutectic Sn–Cu solderalloys

Materials science & engineering. A, Structural materials : properties, microstructure and processing, 2013-04, Vol.568, p.195-201

2013

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Analysis of Slip Behavior in a Single Shear Lap Lead-Free Solder Joint During Simple Shear at 25°C and 0.1/s

Journal of electronic materials, 2009-12, Vol.38 (12), p.2694-2701

2009

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Effect of Nano-TiO2 particles on growth of interfacial Cu6Sn5 and Cu3Sn layers in Sn 3.0Ag 0.5Cu xTiO2 solder joints

Journal of alloys and compounds, 2016-11, Vol.684, p.299-309

2016

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Comments and reconciliation of the Ni-Bi-system thermodynamic reassessments

Crystal research and technology (1979), 2009-01, Vol.44 (1), p.25-30

2009

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Effect of Bi content on the microstructure and mechanical properties of Sn-Bi-Zn-In alloy

QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY, 2023, Vol.41(4), pp.348-355

2023

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Study on interfacial reaction behavior of SnAg based lead-free solder with (111) single crystal copper substrate

Microelectronics and reliability, 2022-12, Vol.139, Article 114825

2022

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Effects of CeO2 nanoparticles addition on shear properties of low-silver Sn–0.3Ag–0.7Cu-xCeO2 solder alloys

Journal of alloys and compounds, 2019-06, Vol.789, p.150-162

2019

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Reactive wetting, evolution of interfacial and bulk IMCs and their effect on mechanical properties of eutectic Sn–Cu solder alloy

Distribution and Microstructure Analysis of Ceramic Particles in the Lead‐Free Solder Matrix

Improving the performance of lead-free solder reinforced with multi-walled carbon nanotubes

Obtaining and Characterization of New Materials

Study of the Si-containing amorphous layer by electrical discharge coating: Wettability and Erosion Resistance of the Si-containing amorphous layer for Lead-free solder

Evolution of High-Temperature and Low-Temperature High Strain Rate Properties for SAC-R after Sustained Exposure to 50°C

放電表面処理によるSi含有アモルファス層に関する研究: Si含有アモルファス層の鉛フリーはんだ濡れ性および耐侵食性

Kinetic study of solid-state interfacial reactions of p-type (Bi,Sb)2Te3 thermoelectric materials with Sn and Sn–Ag–Cu solders

Study of the Effects of Zn Content on the Interfacial Reactions Between Sn-Zn Solders and Ni Substrates at 250°C

Properties of Sn3.8Ag0.7Cu solder alloy with trace rare earth element Y additions

Investigation of microstructure, corrosion and mechanical properties of iron and holmium modified Sn-3.0Ag0.5Cu solder alloy with ultrasonic treatment

Defects in electronics and their significance for structural integrity

Analysis of BGA Lead-Free solder joints failure behavior based on thermal shock testing

A diffusion model and growth kinetics of interfacial intermetallic compounds in Sn-0.3Ag-0.7Cu and Sn-0.3Ag-0.7Cu-0.5CeO2 solder joints

Effects of joint size and isothermal aging on interfacial IMC growth in Sn-3.0Ag-0.5Cu-0.1TiO2 solder joints

Effect of adding 0.5wt% ZnO nanoparticles, temperature and strain rate on tensile properties of Sn–5.0wt% Sb–0.5wt% Cu (SSC505) lead free solder alloy

Electrodeposition of ternary Sn-Cu-Ni alloys as lead-free solders using deep eutectic solvents

A Drop-In High-Temperature Pb-Free Solder Paste That Outperforms High-Pb Pastes in Power Discrete Applications

Microstructural development and mechanical properties of hypereutectic Sn–Cu solderalloys

Analysis of Slip Behavior in a Single Shear Lap Lead-Free Solder Joint During Simple Shear at 25°C and 0.1/s

Effect of Nano-TiO2 particles on growth of interfacial Cu6Sn5 and Cu3Sn layers in Sn 3.0Ag 0.5Cu xTiO2 solder joints

Comments and reconciliation of the Ni-Bi-system thermodynamic reassessments

Effect of Bi content on the microstructure and mechanical properties of Sn-Bi-Zn-In alloy

Study on interfacial reaction behavior of SnAg based lead-free solder with (111) single crystal copper substrate

Effects of CeO2 nanoparticles addition on shear properties of low-silver Sn–0.3Ag–0.7Cu-xCeO2 solder alloys

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