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Soft, comfortable polymer dry electrodes for high quality ECG and EEG recording

Sensors (Basel, Switzerland), 2014-12, Vol.14 (12), p.23758-23780

2014

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Effect of Pore Structure of Nanometer Scale Porous Films on the Measured Elastic Modulus

Langmuir, 2013-09, Vol.29 (38), p.12025-12035

2013

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Impact of the electrodeposition chemistry used for TSV filling on the microstructural and thermo-mechanical response of Cu

Journal of materials science, 2011-06, Vol.46 (11), p.3868-3882

2011

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Nanoindentation study of thin plasma enhanced chemical vapor deposition SiCOH low-k films modified in He/H2 downstream plasma

Journal of vacuum science and technology. B, Nanotechnology & microelectronics, 2010-01, Vol.28 (1), p.173-179

2010

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Metal-Organic Framework ZIF‑8 Films As Low‑κ Dielectrics in Microelectronics

Chemistry of materials, 2013-01, Vol.25 (1), p.27-33

2013

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Anodic electrodeposition of continuous metal-organic framework films with robust adhesion by pre-anchored strategy

Microporous and mesoporous materials, 2023-02, Vol.350, p.112443, Article 112443

2023

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Atomic Layer Deposition of Ruthenium with TiN Interface for Sub-10 nm Advanced Interconnects beyond Copper

ACS applied materials & interfaces, 2016-10, Vol.8 (39), p.26119-26125

2016

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Substrate Independent Elastic Modulus of Thin Low Dielectric Constant Materials

Advanced engineering materials, 2017-08, Vol.19 (8), p.n/a

2017

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Ruthenium metallization for advanced interconnects

2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC), 2016, p.34-36

2016

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Atomic Layer Deposition of Ruthenium Thin Films from (Ethylbenzyl) (1-Ethyl-1,4-cyclohexadienyl) Ru: Process Characteristics, Surface Chemistry, and Film Properties

Chemistry of materials, 2017-06, Vol.29 (11), p.4654-4666

2017

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Mechanical integrity of nano-interconnects as brittle-matrix nano-composites

Theoretical and applied fracture mechanics, 2018-06, Vol.95, p.194-207

2018

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Properties of ultrathin molybdenum films for interconnect applications

Materialia, 2022-08, Vol.24, p.101511, Article 101511

2022

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A Novel Method for Characterization of Ultralow Viscosity NCF Layers Using TCB for 3D Assembly

Journal of microelectronics and electronic packaging, 2021-01, Vol.18 (1), p.12-20

2021

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Ultra-low-k cyclic carbon-bridged PMO films with a high chemical resistance

Journal of materials chemistry, 2012-01, Vol.22 (17), p.8281

2012

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Investigation of Co Thin Film as Buffer Layer Applied to Cu/Sn Eutectic Bonding and UBM With Sn, SnCu, and SAC Solders Joints

IEEE transactions on components, packaging, and manufacturing technology (2011), 2017-11, Vol.7 (11), p.1899-1905

2017

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Increasing the mean grain size in copper films and features

Journal of materials research, 2008-03, Vol.23 (3), p.642-662

2008

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Mechanical stability of Cu/low-k BEOL interconnects

2014 IEEE International Reliability Physics Symposium, 2014, p.2F.2.1-2F.2.6

2014

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Measurement and Simulation of Mechanical Strength of Back-End-Of-Line Layer in Advanced CMOS Dies

IMAPSource Proceedings, 2024-03, Vol.2023 (EMPC)

2024

Volltextzugriff (PDF)

Evaluation of a New Advanced Low- k Material

Japanese Journal of Applied Physics, 2011-05, Vol.50 (5S1), p.5

2011

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Methodologies for Characterization of W2W Bonding Strength

2024 IEEE 74th Electronic Components and Technology Conference (ECTC), 2024, p.790-797

2024

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Measurement and Simulation of Mechanical Strength of Back-End-Of-Line Layer in Advanced CMOS Dies

2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC), 2023, p.1-5

2023

Volltextzugriff (PDF)

Influence of the UV Cure on Advanced Plasma Enhanced Chemical Vapour Deposition Low- k Materials

Japanese Journal of Applied Physics, 2011-05, Vol.50 (5S1), p.5

2011

Volltextzugriff (PDF)

Soft Conductive Polymer Dry Electrodes for High-Quality and Comfortable ECG/EEG Measurements

Advances in Science and Technology, 2014-10, Vol.96, p.102-107

2014

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Spacious and mechanically flexible mesoporous silica thin film composed of an open network of interlinked nanoslabs

Journal of materials chemistry, 2011-01, Vol.21 (21), p.7692-7699

2011

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Impact of Cu TSVs on BEOL metal and dielectric reliability

2014 IEEE International Reliability Physics Symposium, 2014, p.3E.1.1-3E.1.5

2014

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Soft, comfortable polymer dry electrodes for high quality ECG and EEG recording

Effect of Pore Structure of Nanometer Scale Porous Films on the Measured Elastic Modulus

Impact of the electrodeposition chemistry used for TSV filling on the microstructural and thermo-mechanical response of Cu

Nanoindentation study of thin plasma enhanced chemical vapor deposition SiCOH low-k films modified in He/H2 downstream plasma

Metal-Organic Framework ZIF‑8 Films As Low‑κ Dielectrics in Microelectronics

Anodic electrodeposition of continuous metal-organic framework films with robust adhesion by pre-anchored strategy

Atomic Layer Deposition of Ruthenium with TiN Interface for Sub-10 nm Advanced Interconnects beyond Copper

Substrate Independent Elastic Modulus of Thin Low Dielectric Constant Materials

Ruthenium metallization for advanced interconnects

Atomic Layer Deposition of Ruthenium Thin Films from (Ethylbenzyl) (1-Ethyl-1,4-cyclohexadienyl) Ru: Process Characteristics, Surface Chemistry, and Film Properties

Mechanical integrity of nano-interconnects as brittle-matrix nano-composites

Properties of ultrathin molybdenum films for interconnect applications

A Novel Method for Characterization of Ultralow Viscosity NCF Layers Using TCB for 3D Assembly

Ultra-low-k cyclic carbon-bridged PMO films with a high chemical resistance

Investigation of Co Thin Film as Buffer Layer Applied to Cu/Sn Eutectic Bonding and UBM With Sn, SnCu, and SAC Solders Joints

Increasing the mean grain size in copper films and features

Mechanical stability of Cu/low-k BEOL interconnects

Measurement and Simulation of Mechanical Strength of Back-End-Of-Line Layer in Advanced CMOS Dies

Evaluation of a New Advanced Low- k Material

Methodologies for Characterization of W2W Bonding Strength

Measurement and Simulation of Mechanical Strength of Back-End-Of-Line Layer in Advanced CMOS Dies

Influence of the UV Cure on Advanced Plasma Enhanced Chemical Vapour Deposition Low- k Materials

Soft Conductive Polymer Dry Electrodes for High-Quality and Comfortable ECG/EEG Measurements

Spacious and mechanically flexible mesoporous silica thin film composed of an open network of interlinked nanoslabs

Impact of Cu TSVs on BEOL metal and dielectric reliability

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