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Approaches toward ultralarge FPDs

Proceedings of the IEEE, 2002-04, Vol.90 (4), p.559-580

2002

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Dynamic response of high-speed PIN and Schottky-barrier photodiode layers to nonuniform optical illumination

Journal of lightwave technology, 1994-08, Vol.12 (8), p.1387-1393

1994

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Modeling and simulation of integrated capacitors for high frequency chip power decoupling

IEEE transactions on components and packaging technologies, 2000-12, Vol.23 (4), p.611-619

2000

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Low-resistance bandgap-engineered W/Si/sub 1-x/Ge/sub x//Si contacts

IEEE electron device letters, 1996-07, Vol.17 (7), p.360-362

1996

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Inversion channel edge in trench-isolated sub-1/4-/spl mu/m MOSFET's

IEEE transactions on electron devices, 1996-08, Vol.43 (8), p.1274-1280

1996

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2-GHz 150-µW self-aligned Si MESFET logic

IEEE electron device letters, 1984-05, Vol.5 (5), p.159-161

1984

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Conditions for space-charge reversal at thermionic heterojunctions designed for ballistic electron injection

IEEE electron device letters, 1988-02, Vol.9 (2), p.81-83

1988

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Technology Independent Device Modeling for Simulation of Integrated Circuits for FET Technologies

IEEE transactions on computer-aided design of integrated circuits and systems, 1985-01, Vol.4 (1), p.99-110

1985

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Radiative coupling in BGA packaging for mixed-signal and high-speed digital

2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220), 2001, p.511-517

2001

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Hot electrons cathodes in high speed three-terminal devices: do they really make a difference?

[1991] Proceedings IEEE/Cornell Conference on Advanced Concepts in High Speed Semiconductor Devices and Circuits, 1991, p.357-365

1991

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Optical Interconnects and Interfaces for Electronic Subsystems

MRS proceedings, 1992, Vol.264, Article 319

1992

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Analysis of materials and structure tradeoffs in thin and thick film multi-chip packages

Proceedings., 39th Electronic Components Conference, 1989, p.641-646

1989

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Optimization of the design of the heterojunction vertical field effect transistor using a two-dimensional self-consistent Monte Carlo method

Proceedings., IEEE/Cornell Conference on Advanced Concepts in High Speed Semiconductor Devices and Circuits, 1989, p.237-245

1989

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Potential of low temperature CMOS with normal and superconductive interconnect

Proceedings., Sixth International IEEE VLSI Multilevel Interconnection Conference, 1989, p.233-240

1989

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Analysis of resonant tunneling structures for high frequency oscillator applications via time-dependent solution of Schrodinger's equation

Proceedings., IEEE/Cornell Conference on Advanced Concepts in High Speed Semiconductor Devices and Circuits, 1989, p.284-292

1989

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IIIB-1 performance of MOS devices and integrated circuits with gate oxides grown by rapid thermal oxidation

IEEE transactions on electron devices, 1986-11, Vol.33 (11), p.1846-1847

1986

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Dopant Implantation and Activation in Polycrystalline-SiGe

MRS proceedings, 1994, Vol.343, Article 685

1994

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Probabilistic prediction of wireability and routing requirements for high density interconnect substrates

1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206), 1998, p.1265-1269

1998

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Smart packages and interconnect substrates-computing functions using signal line coupling

1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206), 1998, p.632-637

1998

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Design, simulation, fabrication, and characterization of package level micro shielding for EMI/EMC management in BGA environment

2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070), 2000, p.793-798

2000

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Package and chip-level EMI/EMC structure design, modeling and simulation

1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299), 1999, p.873-878

1999

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Fabrication and analysis of 1/2µm Silicon logic MESFET's

IEEE transactions on electron devices, 1983-10, Vol.30 (10), p.1395-1401

1983

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Probabilistic prediction of wiring demand and routing requirements for high density interconnect substrates

IEEE transactions on advanced packaging, 1999-11, Vol.22 (4), p.642-648

1999

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Physical basis of short-channel MESFET operation II: Transient behavior

IEEE transactions on electron devices, 1982-03, Vol.29 (3), p.377-388

1982

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Transient thermal management in electronic packaging using dynamic control of power dissipation and heat transfer

1996 Proceedings 46th Electronic Components and Technology Conference, 1996, p.205-211

1996

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Approaches toward ultralarge FPDs

Dynamic response of high-speed PIN and Schottky-barrier photodiode layers to nonuniform optical illumination

Modeling and simulation of integrated capacitors for high frequency chip power decoupling

Low-resistance bandgap-engineered W/Si/sub 1-x/Ge/sub x//Si contacts

Inversion channel edge in trench-isolated sub-1/4-/spl mu/m MOSFET's

2-GHz 150-µW self-aligned Si MESFET logic

Conditions for space-charge reversal at thermionic heterojunctions designed for ballistic electron injection

Technology Independent Device Modeling for Simulation of Integrated Circuits for FET Technologies

Radiative coupling in BGA packaging for mixed-signal and high-speed digital

Hot electrons cathodes in high speed three-terminal devices: do they really make a difference?

Optical Interconnects and Interfaces for Electronic Subsystems

Analysis of materials and structure tradeoffs in thin and thick film multi-chip packages

Optimization of the design of the heterojunction vertical field effect transistor using a two-dimensional self-consistent Monte Carlo method

Potential of low temperature CMOS with normal and superconductive interconnect

Analysis of resonant tunneling structures for high frequency oscillator applications via time-dependent solution of Schrodinger's equation

IIIB-1 performance of MOS devices and integrated circuits with gate oxides grown by rapid thermal oxidation

Dopant Implantation and Activation in Polycrystalline-SiGe

Probabilistic prediction of wireability and routing requirements for high density interconnect substrates

Smart packages and interconnect substrates-computing functions using signal line coupling

Design, simulation, fabrication, and characterization of package level micro shielding for EMI/EMC management in BGA environment

Package and chip-level EMI/EMC structure design, modeling and simulation

Fabrication and analysis of 1/2µm Silicon logic MESFET's

Probabilistic prediction of wiring demand and routing requirements for high density interconnect substrates

Physical basis of short-channel MESFET operation II: Transient behavior

Transient thermal management in electronic packaging using dynamic control of power dissipation and heat transfer

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