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Increasing the Strength and Electrical Conductivity of AA6101 Aluminum by Nanostructuring
Light Metals 2019, p.1507-1513
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Hurst-Exponent-Based Detection of High-Impedance DC Arc Events for 48-V Systems in Vehicles
IEEE transactions on power electronics, 2021-04, Vol.36 (4), p.3803-3813
2021
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Polyethylene-BN nanosheets nanocomposites with enhanced thermal and mechanical properties
Composites science and technology, 2021-03, Vol.204, p.108631, Article 108631
2021
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Improvement of the thermal conductivity and tribological properties of polyethylene by incorporating functionalized boron nitride nanosheets
Tribology international, 2022-01, Vol.165, p.107277, Article 107277
2022
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Influence of equal-channel angular pressing on the corrosion fatigue behaviour of an Al-Mg-Si aluminium alloy for automotive conductors
International journal of fatigue, 2020-11, Vol.140, p.105812, Article 105812
2020
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Effect of Continuous Recrystallization on Pb-Free Solder Joints in Thermo-mechanical Fatigue(TMF)
AIP conference proceedings, 2012-03
2012
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The Effect of Microstructure on the Reliability of Lead Free Solder Joints
AIP conference proceedings, 2012-03
2012
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The effects of nucleation and solidification mechanisms on the microstructure and thermomechanical response of tin silver copper solder joints
2010
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On-Line Detection of Dc Arc Faults Using Hurst Exponents for Hybrid-Electric Vehicles
2020 IEEE Energy Conversion Congress and Exposition (ECCE), 2020, p.6372-6378
2020
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Effect of variation in the reflow profile on the microstructure of near eutectic SnAgCu alloys
2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 2014, p.1769-1775
2014
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Failure mechanism and microstructural evolution of Pb-free solder alloys in thermal cycling tests: Effect of solder composition and Sn grain morphology
2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 2015, p.118-126
2015
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Effect of Processing Variables on the Mechanical Reliability of Copper Pillar SnAg Solder Joints
2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 2017, p.423-428
2017
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Reliability and failure mechanism of solder joints in thermal cycling tests
2013 IEEE 63rd Electronic Components and Technology Conference, 2013, p.976-985
2013
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The effect of nickel microalloying on thermal fatigue reliability and microstructure of SAC105 and SAC205 solders
2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 2014, p.425-440
2014
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Dependence of solder joint reliability on solder volume, Composition and printed circuit board surface finish
2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 2014, p.655-665
2014
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Reliability Assessment and Microstructure Characterization of Cu Pillars Assembled on Si and Glass Substrates
2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 2016, p.1141-1147
2016
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Effect of microstructure evolution on Pb-free solder joint reliability in thermomechanical fatigue
2012 IEEE 62nd Electronic Components and Technology Conference, 2012, p.493-499
2012
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The dependence of the Sn grain structure of Pb-free solder joints on composition and geometry
2012 IEEE 62nd Electronic Components and Technology Conference, 2012, p.703-709
2012
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Recrystallization behavior of lead free and lead containing solder in cycling
2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 2011, p.1775-1781
2011
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On the evolution of the properties and microstructure of backward compatible solder joints during cycling and aging
2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 2011, p.722-730
2011
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