UB Paderborn / Katalog / Suche / in CDI

Morphology, kinetics, and thermodynamics of solid-state aging of eutectic SnPb and Pb-free solders (Sn–3.5Ag, Sn–3.8Ag–0.7Cu and Sn–0.7Cu) on Cu

Journal of materials research, 2002-02, Vol.17 (2), p.291-301

2002

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Correction to: Influence of Substrate Surface Finish Metallurgy on Lead-Free Solder Joint Microstructure with Implications for Board-Level Reliability

Journal of electronic materials, 2020-07, Vol.49 (7), p.4466-4467

2020

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Intermetallic growth and mechanical behavior of low and high melting temperature solder alloys

Metallurgical and materials transactions. A, Physical metallurgy and materials science, 1994-07, Vol.25 (7), p.1509-1523

1994

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Failure morphology after the drop impact test of the ball grid array package with lead-free Sn-3.8Ag-0.7Cu on Cu and Ni under-bump metallurgies

Journal of electronic materials, 2007-03, Vol.36 (3), p.207-213

2007

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Time-dependent deformation behavior of near-eutectic 60Sn-40Pb solder

Metallurgical and materials transactions. A, Physical metallurgy and materials science, 1999-05, Vol.30 (5), p.1301-1313

1999

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Interfacial Morphology and Shear Deformation of Flip Chip Solder Joints

Journal of materials research, 2000-08, Vol.15 (8), p.1679-1687

2000

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Metallurgical factors influencing the corrosion of aluminum, Al-Cu, and Al-Si alloy thin films in dilute hydrofluoric solution

Metallurgical transactions. A, Physical metallurgy and materials science, 1992-09, Vol.23 (9), p.2641-2655

1992

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The evolution of microstructure in Al-2 Pct Cu thin films : precipitation, dissolution, and reprecipitation

Metallurgical transactions. A, Physical metallurgy and materials science, 1990-09, Vol.21 (9), p.2449-2458

1990

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Failure Morphology After Drop Impact Test of Ball Grid Array (BGA) Package With Lead-Free Sn-3.8Ag-0.7Cu and Eutectic SnPb Solders

IEEE transactions on electronics packaging manufacturing, 2007-01, Vol.30 (1), p.49-53

2007

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Tensile fracture behaviors of solid-state-annealed eutectic SnPb and lead-free solder flip chip bumps

Journal of materials research, 2004-06, Vol.19 (6), p.1826-1834

2004

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Time-dependent deformation behavior of near-eutectic 60Sn-40Pb solder

Metallurgical and materials transactions. A, Physical metallurgy and materials science, 1999-05, Vol.30A (5), p.1301-1313A

1999

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Drop Performance of Land Grid Array Packages as a Function of Cu Content in Lead-free Solder Alloys

Journal of the Korean Physical Society, 2011-08, p.402-407

2011

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Issues related to the implementation of Pb-free electronic solders in consumer electronics: Lead-free electronic solders

Journal of materials science. Materials in electronics, 2007, Vol.18 (1-3), p.319-330

FREAR, D. R

2007

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Thermal Fatigue in Solder Joints

JOM (1989), 1988-06, Vol.40 (6), p.18-22

1988

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Microstructure and Thermomechanical Behavior Pb‐Free Solders

Lead‐Free Solders: Materials Reliability for Electronics, 2012, p.233-250

2012

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Interfacial fracture toughness of Pb-free solders : RECENT RESEARCH ADVANCES IN Pb-FREE SOLDERS

Microelectronics and reliability, 2009, Vol.49 (3), p.269-287

2009

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The microstructural details of β-Sn precipitation in a 5Sn-95Pb solder alloy

Metallurgical transactions. A, Physical metallurgy and materials science, 1989-08, Vol.20 (8), p.1325-1333

1989

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Ripening-assisted void formation in the matrix of lead-free solder joints during solid-state aging

Journal of materials research, 2007-04, Vol.22 (4), p.826-830

2007

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Rapid Communications: Ripening-assisted void formation in the matrix of lead-free solder joints during solid-state aging

Journal of materials research, 2007-04, Vol.22 (4), p.826-830

2007

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Microstructurally Based Finite Element Simulation on Solder Joint Behaviour

Soldering & surface mount technology, 1997-06, Vol.9 (1), p.39-42

1997

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Emerging reliability challenges in electronic packaging

2008 IEEE International Reliability Physics Symposium, 2008, p.450-454

2008

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Trends and issues in Pb-free soldering for electronic packaging

Elektrotechnik und Informationstechnik, 2001-02, Vol.118 (2), p.81-86

Frear, D. R.

2001

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The Effect of Cu Alloying on Al Alloy Thin Films: Microstructural Mechanisms That Enhance Electromigration Resistance

MRS proceedings, 1993, Vol.309, Article 359

1993

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System-in-a-package integration of SAW RF Rx filter stacked on a transceiver chip

IEEE transactions on advanced packaging, 2005-05, Vol.28 (2), p.310-319

2005

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Thermomechanical fatigue of solder joints: a new comprehensive test method

IEEE transactions on components, hybrids, and manufacturing technology, 1989-12, Vol.12 (4), p.492-501

Frear, D.R.

1989

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Morphology, kinetics, and thermodynamics of solid-state aging of eutectic SnPb and Pb-free solders (Sn–3.5Ag, Sn–3.8Ag–0.7Cu and Sn–0.7Cu) on Cu

Correction to: Influence of Substrate Surface Finish Metallurgy on Lead-Free Solder Joint Microstructure with Implications for Board-Level Reliability

Intermetallic growth and mechanical behavior of low and high melting temperature solder alloys

Failure morphology after the drop impact test of the ball grid array package with lead-free Sn-3.8Ag-0.7Cu on Cu and Ni under-bump metallurgies

Time-dependent deformation behavior of near-eutectic 60Sn-40Pb solder

Interfacial Morphology and Shear Deformation of Flip Chip Solder Joints

Metallurgical factors influencing the corrosion of aluminum, Al-Cu, and Al-Si alloy thin films in dilute hydrofluoric solution

The evolution of microstructure in Al-2 Pct Cu thin films : precipitation, dissolution, and reprecipitation

Failure Morphology After Drop Impact Test of Ball Grid Array (BGA) Package With Lead-Free Sn-3.8Ag-0.7Cu and Eutectic SnPb Solders

Tensile fracture behaviors of solid-state-annealed eutectic SnPb and lead-free solder flip chip bumps

Time-dependent deformation behavior of near-eutectic 60Sn-40Pb solder

Drop Performance of Land Grid Array Packages as a Function of Cu Content in Lead-free Solder Alloys

Issues related to the implementation of Pb-free electronic solders in consumer electronics: Lead-free electronic solders

Thermal Fatigue in Solder Joints

Microstructure and Thermomechanical Behavior Pb‐Free Solders

Interfacial fracture toughness of Pb-free solders : RECENT RESEARCH ADVANCES IN Pb-FREE SOLDERS

The microstructural details of β-Sn precipitation in a 5Sn-95Pb solder alloy

Ripening-assisted void formation in the matrix of lead-free solder joints during solid-state aging

Rapid Communications: Ripening-assisted void formation in the matrix of lead-free solder joints during solid-state aging

Microstructurally Based Finite Element Simulation on Solder Joint Behaviour

Emerging reliability challenges in electronic packaging

Trends and issues in Pb-free soldering for electronic packaging

The Effect of Cu Alloying on Al Alloy Thin Films: Microstructural Mechanisms That Enhance Electromigration Resistance

System-in-a-package integration of SAW RF Rx filter stacked on a transceiver chip

Thermomechanical fatigue of solder joints: a new comprehensive test method

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