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Nerve‐Sparing Gynecologic Surgery Enabled by A Near‐Infrared Nerve‐Specific Fluorophore Using Existing Clinical Fluorescence Imaging Systems

Small (Weinheim an der Bergstrasse, Germany), 2023-07, Vol.20 (41), p.e2300011-n/a

2023

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Living polymers

Computational materials science, 1995, Vol.4 (4), p.334-338

Greer, S.C

1995

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A likely mechanism for pitch deposition control

Tappi journal, 1994-10, Vol.77 (10), p.91-96

1994

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Low Expansivity Organic Substrate for Flip-Chip Bonding

IEEE transactions on components, hybrids, and manufacturing technology, 1979-03, Vol.2 (1), p.140-144

Greer, S.

1979

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An Alternate Method of Fabricating Multilayer-Multichip Ceramic Substrates

IEEE transactions on components, hybrids, and manufacturing technology, 1983-06, Vol.6 (2), p.150-153

1983

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The Time Cone method for Nucleation and Growth Kinetics on a Finite Domain

MRS proceedings, 1995, Vol.398, Article 425

Cahn, John W.

1995

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Pitch deposit awareness and control

Tappi journal, 1991-06, Vol.74 (6), p.249-252

1991

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Calculations of the structure and properties of rapidly quenched NI/ZR alloys

2003

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Quantitative Measurement of Interface Fracture Energy in Multi-Layer Thin Film Structures

MRS proceedings, 1995, Vol.391, Article 91

1995

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Finite Element Analysis of Electromigration and Stress Induced Diffusion in Deformable Solids

MRS proceedings, 1995, Vol.391, Article 177

1995

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Schlieren techniques for ndt

Non-destructive testing (Guildford), 1970-01, Vol.3 (3), p.169-172

1970

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The Influence of Strain Energy Minimization on Abnormal Grain Growth in Copper Thin Films

MRS proceedings, 1995, Vol.391, Article 103

1995

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Coupled Stress Evolution in Polygranular Clusters and Bamboo Segments in Near-Bamboo Interconnects

MRS proceedings, 1995, Vol.391, Article 189

1995

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Real-Time Tem Studies of Electromigration in Submicron Aluminum Runners

MRS proceedings, 1995, Vol.391, p.249-258, Article 249

1995

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Failure in Tungsten-Filled Via Structures

MRS proceedings, 1995, Vol.391, p.423-428, Article 423

1995

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The Effect of Cu Distribution on Post-Patterning Grain Growth and Reliability of Al-1%Cu Interconnects

MRS proceedings, 1995, Vol.391, p.361-366, Article 361

1995

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Stress-Voiding and Electromigration in Multilevel Interconnects

MRS proceedings, 1995, Vol.391, p.411-422, Article 411

1995

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Stress and Electromigration

MRS proceedings, 1995, Vol.391, Article 231

Lloyd, J.R.

1995

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Electromigration Damage and Failure Distributions in Al-4wt.%Cu Interconnects

MRS proceedings, 1995, Vol.391, Article 391

1995

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The Effect of Cluster Interactions on Electromigration Induced Stress Evolution in Confined Metal Lines

MRS proceedings, 1995, Vol.391, p.197-202, Article 197

1995

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Influence of Film Thickness and Capping Layer on the Mechanical Properties of Copper Films

MRS proceedings, 1995, Vol.391, Article 309

1995

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Theory and Computer Simulation of Grain-Boundary and Void Dynamics in Polycrystalline Conductors

MRS proceedings, 1995, Vol.391, p.151-162, Article 151

1995

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A Highly Reliable Al Line with Controlled Texture and Grain Boundaries

MRS proceedings, 1995, Vol.391, Article 335

1995

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Measurement and Modeling of Intrinsic Stresses in CVD W Lines

MRS proceedings, 1995, Vol.391, p.115-119, Article 115

1995

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Thermal Stability of Platinum Silicide in Deep Sub-Micron Lines

MRS proceedings, 1995, Vol.391, Article 223

1995

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Nerve‐Sparing Gynecologic Surgery Enabled by A Near‐Infrared Nerve‐Specific Fluorophore Using Existing Clinical Fluorescence Imaging Systems

Living polymers

A likely mechanism for pitch deposition control

Low Expansivity Organic Substrate for Flip-Chip Bonding

An Alternate Method of Fabricating Multilayer-Multichip Ceramic Substrates

The Time Cone method for Nucleation and Growth Kinetics on a Finite Domain

Pitch deposit awareness and control

Calculations of the structure and properties of rapidly quenched NI/ZR alloys

Quantitative Measurement of Interface Fracture Energy in Multi-Layer Thin Film Structures

Finite Element Analysis of Electromigration and Stress Induced Diffusion in Deformable Solids

Schlieren techniques for ndt

The Influence of Strain Energy Minimization on Abnormal Grain Growth in Copper Thin Films

Coupled Stress Evolution in Polygranular Clusters and Bamboo Segments in Near-Bamboo Interconnects

Real-Time Tem Studies of Electromigration in Submicron Aluminum Runners

Failure in Tungsten-Filled Via Structures

The Effect of Cu Distribution on Post-Patterning Grain Growth and Reliability of Al-1%Cu Interconnects

Stress-Voiding and Electromigration in Multilevel Interconnects

Stress and Electromigration

Electromigration Damage and Failure Distributions in Al-4wt.%Cu Interconnects

The Effect of Cluster Interactions on Electromigration Induced Stress Evolution in Confined Metal Lines

Influence of Film Thickness and Capping Layer on the Mechanical Properties of Copper Films

Theory and Computer Simulation of Grain-Boundary and Void Dynamics in Polycrystalline Conductors

A Highly Reliable Al Line with Controlled Texture and Grain Boundaries

Measurement and Modeling of Intrinsic Stresses in CVD W Lines

Thermal Stability of Platinum Silicide in Deep Sub-Micron Lines

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