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Inundation, flow dynamics, and damage in the 9 January 2018 Montecito debris-flow event, California, USA; opportunities and challenges for post-wildfire risk assessment

Geosphere (Boulder, Colo.), 2019-08, Vol.15 (4), p.1140-1163

2019

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Effect of Capped Cu Layer on Protrusion Behaviors of Through Silicon via Copper (TSV-Cu) Under Double Annealing Conditions: Comparative Study

IEEE transactions on device and materials reliability, 2023-03, Vol.23 (1), p.89-98

2023

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Applying a Statistical Model to the Observed Texture Evolution of Fatigued Metal Films

IEEE transactions on device and materials reliability, 2020-09, Vol.20 (3), p.517-523

2020

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Detrital zircon U-Pb geochronology and Hf isotope geochemistry of Paleozoic and Triassic passive margin strata of western North America

Geosphere (Boulder, Colo.), 2014-02, Vol.10 (1), p.49-65, Article 49

2014

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From intracrystalline distortion to plate motion; unifying structural, kinematic, and textural analysis in heterogeneous shear zones through crystallographic orientation-dispersion methods

Geosphere (Boulder, Colo.), 2019-04, Vol.15 (2), p.357-381

2019

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Electrical and Optical Characterization of R.F.-Sputtered CdTe Thin Films

IEEE transactions on device and materials reliability, 2014-12, Vol.14 (4), p.983-988

Gorji, Nima E.

2014

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Stress, Sheet Resistance, and Microstructure Evolution of Electroplated Cu Films During Self-Annealing

IEEE transactions on device and materials reliability, 2010-03, Vol.10 (1), p.47-54

2010

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Electromigration in Dual-Damascene CuMn Alloy IC Interconnects

IEEE transactions on device and materials reliability, 2013-03, Vol.13 (1), p.330-332

2013

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3D characterization of sandstone by means of X-ray computed tomography

Geosphere (Boulder, Colo.), 2011-02, Vol.7 (1), p.54-61

2011

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Physics-Based Models for EM and SM Simulation in Three-Dimensional IC Structures

IEEE transactions on device and materials reliability, 2012-06, Vol.12 (2), p.272-284

2012

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Paleoenvironments, taphonomy, and stable isotopic content of the terrestrial, fossil-vertebrate-bearing sequence of the El Disecado Member, El Gallo Formation, Upper Cretaceous, Baja California, Mexico

Geosphere (Boulder, Colo.), 2020-08, Vol.16 (4), p.991-1011, Article 991

2020

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The spatial association of accessory minerals with biotite in granitic rocks from the South Mountain Batholith, Nova Scotia, Canada

Geosphere (Boulder, Colo.), 2021-12, Vol.18 (1), p.1-18

2021

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Study of the Influence of Elastic Anisotropy of Cu on Thermo-Mechanical Behavior and Cu Protrusion of Through Silicon Vias Using Combined Phase Field and Finite Element Methods

IEEE transactions on device and materials reliability, 2019-06, Vol.19 (2), p.322-332

2019

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The Effects of Al Doping and Metallic-Cap Layers on Electromigration Transport Mechanisms in Copper Nanowires

IEEE transactions on device and materials reliability, 2011-12, Vol.11 (4), p.540-547

2011

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Rheological evolution of the Mount Meager 2010 debris avalanche, southwestern British Columbia

Geosphere (Boulder, Colo.), 2017-04, Vol.13 (2), p.369-390

2017

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Effect of Microstructure and Anisotropy of Copper on Reliability in Nanoscale Interconnects

IEEE transactions on device and materials reliability, 2017-03, Vol.17 (1), p.69-79

2017

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Marine sedimentary records of chemical weathering evolution in the western Himalaya since 17 Ma

Geosphere (Boulder, Colo.), 2021-03, Vol.17 (3), p.824-853

2021

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Synchrotron X-Ray Microdiffraction Investigation of Scaling Effects on Reliability for Through-Silicon Vias for 3-D Integration

IEEE transactions on device and materials reliability, 2019-09, Vol.19 (3), p.568-571

2019

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Electromigration: Void Dynamics

IEEE transactions on device and materials reliability, 2016-12, Vol.16 (4), p.446-451

2016

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Impact of Carbon Doping on Polysilicon Grain Size Distribution and Yield Enhancement for 40-nm Embedded Nonvolatile Memory Technology

IEEE transactions on device and materials reliability, 2018-03, Vol.18 (1), p.64-69

2018

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Improved Charge-Trapping Characteristics of ZrO2 by Al Doping for Nonvolatile Memory Applications

IEEE transactions on device and materials reliability, 2016-03, Vol.16 (1), p.38-42

2016

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Stratigraphic trends in detrital zircon geochronology of upper Neoproterozoic and Cambrian strata, Osgood Mountains, Nevada, and elsewhere in the Cordilleran miogeocline: Evidence for early Cambrian uplift of the Transcontinental Arch

Geosphere (Boulder, Colo.), 2014-12, Vol.10 (6), p.1402-1410

2014

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The Simulation of a new asymmetrical double-gate poly-Si TFT with modified channel conduction mechanism for highly reduced OFF-state leakage current

IEEE transactions on device and materials reliability, 2005-12, Vol.5 (4), p.675-682

2005

Volltextzugriff (PDF)

The Permo-Triassic Gondwana Sequence, central Transantarctic Mountains, Antarctica; zircon geochronology, provenance, and basin evolution

Geosphere (Boulder, Colo.), 2017-02, Vol.13 (1), p.155-178

2017

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Interconnect: Future nodes look beyond copper

Solid state technology, 2007-10, p.28

Derbyshire, Katherine

2007

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Inundation, flow dynamics, and damage in the 9 January 2018 Montecito debris-flow event, California, USA; opportunities and challenges for post-wildfire risk assessment

Effect of Capped Cu Layer on Protrusion Behaviors of Through Silicon via Copper (TSV-Cu) Under Double Annealing Conditions: Comparative Study

Applying a Statistical Model to the Observed Texture Evolution of Fatigued Metal Films

Detrital zircon U-Pb geochronology and Hf isotope geochemistry of Paleozoic and Triassic passive margin strata of western North America

From intracrystalline distortion to plate motion; unifying structural, kinematic, and textural analysis in heterogeneous shear zones through crystallographic orientation-dispersion methods

Electrical and Optical Characterization of R.F.-Sputtered CdTe Thin Films

Stress, Sheet Resistance, and Microstructure Evolution of Electroplated Cu Films During Self-Annealing

Electromigration in Dual-Damascene CuMn Alloy IC Interconnects

3D characterization of sandstone by means of X-ray computed tomography

Physics-Based Models for EM and SM Simulation in Three-Dimensional IC Structures

Paleoenvironments, taphonomy, and stable isotopic content of the terrestrial, fossil-vertebrate-bearing sequence of the El Disecado Member, El Gallo Formation, Upper Cretaceous, Baja California, Mexico

The spatial association of accessory minerals with biotite in granitic rocks from the South Mountain Batholith, Nova Scotia, Canada

Study of the Influence of Elastic Anisotropy of Cu on Thermo-Mechanical Behavior and Cu Protrusion of Through Silicon Vias Using Combined Phase Field and Finite Element Methods

The Effects of Al Doping and Metallic-Cap Layers on Electromigration Transport Mechanisms in Copper Nanowires

Rheological evolution of the Mount Meager 2010 debris avalanche, southwestern British Columbia

Effect of Microstructure and Anisotropy of Copper on Reliability in Nanoscale Interconnects

Marine sedimentary records of chemical weathering evolution in the western Himalaya since 17 Ma

Synchrotron X-Ray Microdiffraction Investigation of Scaling Effects on Reliability for Through-Silicon Vias for 3-D Integration

Electromigration: Void Dynamics

Impact of Carbon Doping on Polysilicon Grain Size Distribution and Yield Enhancement for 40-nm Embedded Nonvolatile Memory Technology

Improved Charge-Trapping Characteristics of ZrO2 by Al Doping for Nonvolatile Memory Applications

Stratigraphic trends in detrital zircon geochronology of upper Neoproterozoic and Cambrian strata, Osgood Mountains, Nevada, and elsewhere in the Cordilleran miogeocline: Evidence for early Cambrian uplift of the Transcontinental Arch

The Simulation of a new asymmetrical double-gate poly-Si TFT with modified channel conduction mechanism for highly reduced OFF-state leakage current

The Permo-Triassic Gondwana Sequence, central Transantarctic Mountains, Antarctica; zircon geochronology, provenance, and basin evolution

Interconnect: Future nodes look beyond copper

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