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Impact of stroke‐associated pneumonia on mortality, length of hospitalization, and functional outcome

Acta neurologica Scandinavica, 2018-10, Vol.138 (4), p.293-300

2018

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Effect of low numerical-aperture femtosecond two-photon absorption on (SU-8) resist for ultrahigh-aspect-ratio microstereolithography

Journal of applied physics, 2005-03, Vol.97 (5)

2005

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Multi-strata subsurface laser die singulation to enable defect-free ultra-thin stacked memory dies

AIP advances, 2015-05, Vol.5 (5), p.057128-057128-7

2015

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SU-8 for real three-dimensional subdiffraction-limit two-photon microfabrication

Applied physics letters, 2004-05, Vol.84 (20), p.4095-4097

2004

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Cross-linked PMMA as a low-dimensional dielectric sacrificial layer

Journal of microelectromechanical systems, 2003-10, Vol.12 (5), p.641-648

2003

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Etching control of benzocyclobutene in CF4/O2 and SF6/O2 plasmas with thick photoresist and titanium masks

Thin solid films, 2006-05, Vol.504 (1-2), p.252-256

2006

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300-mm Production-Worthy Magnetically Enhanced Non-Bosch Through-Si-Via Etch for 3-D Logic Integration

IEEE transactions on semiconductor manufacturing, 2010-05, Vol.23 (2), p.293-302

2010

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Near-zero curvature fabrication of miniaturized micromechanical Ni switches using electron beam cross-linked PMMA

Journal of micromechanics and microengineering, 2003-09, Vol.13 (5), p.591-598

2003

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Adhesion Studies of Ta∕Low-k (Black Diamond) Interface using Thermocompressive Wafer Bonding and Four-Point Bend

Journal of the Electrochemical Society, 2006, Vol.153 (9), p.G795

2006

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200 mm wafer-scale epitaxial transfer of single crystal Si on glass by anodic bonding of silicon-on-insulator wafers

Applied physics letters, 2005-08, Vol.87 (7)

2005

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Quality control of semi-continuous mobility size-fractionated particle number concentration data

Atmospheric environment (1994), 2004-06, Vol.38 (20), p.3341-3348

2004

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200-mm wafer-scale transfer of 0.18-μm dual-damascene Cu/SiO2 interconnection system to plastic substrates

IEEE electron device letters, 2005-11, Vol.26 (11), p.802-804

2005

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200 mm wafer-scale substrate transfer of 0.13 μ m Cu ∕ low- k (Black Diamond™) dual-damascene interconnection to glass substrates

Applied physics letters, 2005-07, Vol.87 (4), p.043103-043103-3

2005

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Characteristics of a micromachined floating-gate high-electron-mobility transistor at 4.2 K

Journal of applied physics, 2005-06, Vol.97 (11), p.114507-114507-17

2005

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Reversible electrostatic control of micromechanical structure tunneling characteristics

Journal of applied physics, 2003-10, Vol.94 (7), p.4614-4618

2003

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Study of microstructure and resistivity evolution for electroplated copper films at near-room temperature

Microelectronics, 2001-07, Vol.32 (7), p.579-585

2001

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Switching characteristics of electrostatically actuated miniaturized micromechanical metallic cantilevers

Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, 2003-11, Vol.21 (6), p.2360-2367

2003

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Fabrication of quasi-three-dimensional micro/nanomechanical components using electron beam cross-linked poly (methyl methacrylate) resist

Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, 2003-11, Vol.21 (6), p.3007-3011

2003

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Erratum: “Reversible electrostatic control of micromechanical structure tunneling characteristics” [J. Appl. Phys. 94 , 4614 (2003)]

Journal of applied physics, 2004-04, Vol.95 (8), p.4509-4509

2004

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200 mm wafer-scale substrate transfer of 0.13μmCu∕low-k (Black Diamond™) dual-damascene interconnection to glass substrates

Applied physics letters, 2005-07, Vol.87 (4)

2005

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Corrections to "200-mm Wafer Scale Transfer of 0.18mum Dual-Damascene Cu/SiO_2Interconnection System to Plastic Substrates"

IEEE electron device letters, 2006-03, Vol.27 (3), p.198-198

2006

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Investigation into performance of TaN diffusion barrier against copper diffusion using XRD

Electronics letters, 2000-12, Vol.36 (25), p.1-1

Teh, W H

2000

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200-mm wafer-scale transfer of 0.18-mum dual-damascene Cu/SiO/sub 2/ interconnection system to plastic substrates

IEEE electron device letters, 2005-11, Vol.26 (11), p.802-804

2005

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Investigation into performance of TaN diffusion barrier against copper diffusion using XRD

Electronics letters, 2000-12, Vol.36 (25), p.2105-2106

Teh, W H

2000

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Post-bond sub-500 nm alignment in 300 mm integrated face-to-face wafer-to-wafer Cu-Cu thermocompression, Si-Si fusion and oxideoxide fusion bonding

2010 IEEE International 3D Systems Integration Conference (3DIC), 2010, p.1-6

2010

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Impact of stroke‐associated pneumonia on mortality, length of hospitalization, and functional outcome

Effect of low numerical-aperture femtosecond two-photon absorption on (SU-8) resist for ultrahigh-aspect-ratio microstereolithography

Multi-strata subsurface laser die singulation to enable defect-free ultra-thin stacked memory dies

SU-8 for real three-dimensional subdiffraction-limit two-photon microfabrication

Cross-linked PMMA as a low-dimensional dielectric sacrificial layer

Etching control of benzocyclobutene in CF4/O2 and SF6/O2 plasmas with thick photoresist and titanium masks

300-mm Production-Worthy Magnetically Enhanced Non-Bosch Through-Si-Via Etch for 3-D Logic Integration

Near-zero curvature fabrication of miniaturized micromechanical Ni switches using electron beam cross-linked PMMA

Adhesion Studies of Ta∕Low-k (Black Diamond) Interface using Thermocompressive Wafer Bonding and Four-Point Bend

200 mm wafer-scale epitaxial transfer of single crystal Si on glass by anodic bonding of silicon-on-insulator wafers

Quality control of semi-continuous mobility size-fractionated particle number concentration data

200-mm wafer-scale transfer of 0.18-μm dual-damascene Cu/SiO2 interconnection system to plastic substrates

200 mm wafer-scale substrate transfer of 0.13 μ m Cu ∕ low- k (Black Diamond™) dual-damascene interconnection to glass substrates

Characteristics of a micromachined floating-gate high-electron-mobility transistor at 4.2 K

Reversible electrostatic control of micromechanical structure tunneling characteristics

Study of microstructure and resistivity evolution for electroplated copper films at near-room temperature

Switching characteristics of electrostatically actuated miniaturized micromechanical metallic cantilevers

Fabrication of quasi-three-dimensional micro/nanomechanical components using electron beam cross-linked poly (methyl methacrylate) resist

Erratum: “Reversible electrostatic control of micromechanical structure tunneling characteristics” [J. Appl. Phys. 94 , 4614 (2003)]

200 mm wafer-scale substrate transfer of 0.13μmCu∕low-k (Black Diamond™) dual-damascene interconnection to glass substrates

Corrections to "200-mm Wafer Scale Transfer of 0.18mum Dual-Damascene Cu/SiO_2Interconnection System to Plastic Substrates"

Investigation into performance of TaN diffusion barrier against copper diffusion using XRD

200-mm wafer-scale transfer of 0.18-mum dual-damascene Cu/SiO/sub 2/ interconnection system to plastic substrates

Investigation into performance of TaN diffusion barrier against copper diffusion using XRD

Post-bond sub-500 nm alignment in 300 mm integrated face-to-face wafer-to-wafer Cu-Cu thermocompression, Si-Si fusion and oxideoxide fusion bonding

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