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Partial mummification and extraordinary context observed in perinate burials: a complex osteoarcheological study applying ICP-AES, μXRF, and macromorphological methods

Archaeological and anthropological sciences, 2018-04, Vol.10 (3), p.685-695

2018

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Slawonische Banalmünzpragung

Dissertationes archaeologicae ex Instituto Archaeologico Universitatis de Rolando Eötvös Nominatae., 2013-03, Vol.2 (8), p.1-149

Székely, György V

2013

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Érem- és kincslelet Kiskunmajsa-Jonathermál lelőhelyen

Archæologiai értesítő, 2018-12, Vol.143 (1), p.197-201

2018

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A new evaluation method of thermal transient measurement results

Microelectronics, 1997-03, Vol.28 (3), p.277-292

Székely, V.

1997

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Design of a Static TIM Tester

Journal of electronic packaging, 2010-03, Vol.132 (1)

2010

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Érem- és kincslelet Kiskunmajsa-Jonathermál lelőhelyen

Archæologiai értesítő, 2018, Vol.143 (1), p.197-201

2018

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Cross-Verification of Thermal Characterization of a Microcooler

Journal of electronic packaging, 2007-06, Vol.129 (2), p.167-171

2007

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Enhancing reliability with thermal transient testing

Microelectronics and reliability, 2002-04, Vol.42 (4), p.629-640

Szekely, V

2002

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Courses of Action to Optimize Heavy Bearings Cages

IOP conference series. Materials Science and Engineering, 2016-11, Vol.161 (1), p.12008

Szekely, V G

2016

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A new Early Bronze Age wagon model from the Carpathian Basin

World archaeology, 2011-12, Vol.43 (4), p.538-553

2011

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Blind tracing of mechanical movement in electrostatic MEMS structures

Analog integrated circuits and signal processing, 2012-04, Vol.71 (1), p.11-20

2012

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Heavy Bearings Exploitation Energy and Reduction Methods

IOP conference series. Materials Science and Engineering, 2016-11, Vol.161 (1), p.12009

2016

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Thermal Measurement and Modeling of Multi-Die Packages

IEEE transactions on components and packaging technologies, 2009-06, Vol.32 (2), p.484-492

2009

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Measuring partial thermal resistances in a heat-flow path

IEEE transactions on components and packaging technologies, 2002-12, Vol.25 (4), p.547-553

2002

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Cooling as a possible way to extend the usability of IDDQ testing

Electronics letters, 1997, Vol.33 (25), p.2117

1997

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Studies on the nonlinearity effects in dynamic compact model generation of packages

IEEE transactions on components and packaging technologies, 2004-03, Vol.27 (1), p.124-130

2004

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Heat-flux sensor to support transient thermal characterisation of IC packages

Sensors and actuators. A. Physical., 2004-10, Vol.116 (2), p.284-292

2004

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Urban municipalities versus rural municipalities - selected aspects of quality of life in Slovakia

Europa XXI (Warsaw, Poland), 2006 (15), p.87-102

SZÉKELY, V

2006

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Thermal Monitoring of Self-Checking Systems

Journal of electronic testing, 1998-02, Vol.12 (1-2), p.81-92

1998

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Dynamic thermal multiport modeling of IC packages

IEEE transactions on components and packaging technologies, 2001-12, Vol.24 (4), p.596-604

2001

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Thermal dynamics and the time constant domain

IEEE transactions on components and packaging technologies, 2000-09, Vol.23 (3), p.587-594

2000

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Increasing the accuracy of thermal transient measurements

IEEE transactions on components and packaging technologies, 2002-12, Vol.25 (4), p.539-546

2002

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Increasing the accuracy of structure function based thermal material parameter measurements

IEEE transactions on components and packaging technologies, 2005-03, Vol.28 (1), p.51-57

2005

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A Methodology for the Co-Simulation of Dynamic Compact Models of Packages With the Detailed Models of Boards

IEEE transactions on components and packaging technologies, 2007-09, Vol.30 (3), p.367-374

2007

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Evaluation of short pulse and short time thermal transient measurements

Microelectronics, 2010-09, Vol.41 (9), p.560-565

Szekely, V

2010

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Partial mummification and extraordinary context observed in perinate burials: a complex osteoarcheological study applying ICP-AES, μXRF, and macromorphological methods

Slawonische Banalmünzpragung

Érem- és kincslelet Kiskunmajsa-Jonathermál lelőhelyen

A new evaluation method of thermal transient measurement results

Design of a Static TIM Tester

Érem- és kincslelet Kiskunmajsa-Jonathermál lelőhelyen

Cross-Verification of Thermal Characterization of a Microcooler

Enhancing reliability with thermal transient testing

Courses of Action to Optimize Heavy Bearings Cages

A new Early Bronze Age wagon model from the Carpathian Basin

Blind tracing of mechanical movement in electrostatic MEMS structures

Heavy Bearings Exploitation Energy and Reduction Methods

Thermal Measurement and Modeling of Multi-Die Packages

Measuring partial thermal resistances in a heat-flow path

Cooling as a possible way to extend the usability of IDDQ testing

Studies on the nonlinearity effects in dynamic compact model generation of packages

Heat-flux sensor to support transient thermal characterisation of IC packages

Urban municipalities versus rural municipalities - selected aspects of quality of life in Slovakia

Thermal Monitoring of Self-Checking Systems

Dynamic thermal multiport modeling of IC packages

Thermal dynamics and the time constant domain

Increasing the accuracy of thermal transient measurements

Increasing the accuracy of structure function based thermal material parameter measurements

A Methodology for the Co-Simulation of Dynamic Compact Models of Packages With the Detailed Models of Boards

Evaluation of short pulse and short time thermal transient measurements

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