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Characteristics of SiO2 etching by using pulse-time modulation in 60 MHz/2 MHz dual-frequency capacitive coupled plasma

Current Applied Physics, 2013, 13(8), , pp.1830-1836

2013

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Effectiveness of the metal coating on U–7Mo dispersion fuel in Al during irradiation

Journal of nuclear materials, 2020-02, Vol.529 (C), p.151945, Article 151945

2020

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Surface-modified magnetite nanoparticles for hyperthermia: Preparation, characterization, and cytotoxicity studies

Current Applied Physics, 2006, 6(1l), , pp.242-246

2006

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Internal linear inductively coupled plasma (ICP) sources for large area FPD etch process applications

Materials science in semiconductor processing, 2002-08, Vol.5 (4), p.419-423

2002

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Low impedance antenna arrangement of internal linear ICP source for large area FPD processing

Thin solid films, 2006-05, Vol.506 (Complete), p.460-463

2006

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Abrasivity of a Dentifrice containing Nano Carbonate Apatite

Key engineering materials, 2007-08, Vol.345-346, p.773-776

2007

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Influence of Tricalcium Aluminate Phase on In Vitro Biocompatibility and Bioactivity of Calcium Aluminate Bone Cement

Journal of materials research, 2004-04, Vol.19 (4), p.1062-1067

2004

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Effects of multipolar magnetic fields on the characteristics of plasma and photoresist etching in an internal linear inductively coupled plasma system

Surface & coatings technology, 2004-01, Vol.177, p.752-757

2004

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Biodegradable Bone Cement Using Calcium Phosphate Glass

Key engineering materials, 2006-01, Vol.309-311, p.861-864

2006

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Ultrathin porous NiO nanoflake arrays on nickel foam as an advanced electrode for high performance asymmetric supercapacitors

Journal of materials chemistry. A, Materials for energy and sustainability, 2016-01, Vol.4 (23), p.9113-9123

2016

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Fracture reliability concern of (Au, Ni)Sn 4 phase in 3D integrated circuit microbumps using Ni/Au surface finishing

Scripta materialia, 2016-07, Vol.119, p.9-12

2016

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A metastable phase of tin in 3D integrated circuit solder microbumps

Scripta materialia, 2015-06, Vol.102 (C), p.39-42

2015

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Phase Transformations and Structural Developments in the Radular Teeth of Cryptochiton Stelleri

Advanced functional materials, 2013-06, Vol.23 (23), p.2908-2917

2013

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Oxidation of rubrene, and implications for device stability

Journal of materials chemistry. C, Materials for optical and electronic devices, 2018, Vol.6 (14), p.3757-3761

2018

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Electrical properties and crystal structures of nitrogen-doped Ge2Sb2Te5 thin film for phase change memory

Thin solid films, 2004-12, Vol.469-470 (Complete), p.322-326

2004

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Microstructural, optical, and electrical properties of Ni–Al co-doped ZnO films prepared by DC magnetron sputtering

Materials research bulletin, 2014-03, Vol.51, p.345-350

2014

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Morphology of instability of the wetting tips of eutectic SnBi, eutectic SnPb, and pure Sn on Cu

Journal of materials research, 1995-03, Vol.10 (3), p.497-504

1995

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Electro-optical properties of water-soluble conjugated polymer

Synthetic metals, 2003-04, Vol.135-136, p.353-354

2003

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Ferroelectric composites and ceramics based on stillwellite-like solid solutions

Journal of the European Ceramic Society, 2004, Vol.24 (6), p.1569-1572

2004

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Application of Artificial Neural Network for Fatigue Life Prediction

Key engineering materials, 2005-11, Vol.297-300, p.96-101

2005

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Fracture Mechanic Analysis for Package Delamination

Key engineering materials, 2005-11, Vol.297-300, p.844-850

2005

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Reduction of surface recombination in n-type HgZnTe ( x=0.16) crystal

Journal of crystal growth, 2000-06, Vol.214, p.255-259

2000

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Study on minority carrier lifetime of n-HgZnTe by photoconductive decay method

Journal of crystal growth, 1998-02, Vol.184-185 (1-2), p.1247-1252

Oh, K

1998

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Crystallization of electroless Ni-P under bump metallization induced by solder reaction

Proceedings International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces (IEEE Cat. No.99TH8405), 1999, p.252-255

1999

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Characteristics of SiO2 etching by using pulse-time modulation in 60 MHz/2 MHz dual-frequency capacitive coupled plasma

Effectiveness of the metal coating on U–7Mo dispersion fuel in Al during irradiation

Surface-modified magnetite nanoparticles for hyperthermia: Preparation, characterization, and cytotoxicity studies

Internal linear inductively coupled plasma (ICP) sources for large area FPD etch process applications

Low impedance antenna arrangement of internal linear ICP source for large area FPD processing

Abrasivity of a Dentifrice containing Nano Carbonate Apatite

Influence of Tricalcium Aluminate Phase on In Vitro Biocompatibility and Bioactivity of Calcium Aluminate Bone Cement

Effects of multipolar magnetic fields on the characteristics of plasma and photoresist etching in an internal linear inductively coupled plasma system

Biodegradable Bone Cement Using Calcium Phosphate Glass

Ultrathin porous NiO nanoflake arrays on nickel foam as an advanced electrode for high performance asymmetric supercapacitors

Fracture reliability concern of (Au, Ni)Sn 4 phase in 3D integrated circuit microbumps using Ni/Au surface finishing

A metastable phase of tin in 3D integrated circuit solder microbumps

Phase Transformations and Structural Developments in the Radular Teeth of Cryptochiton Stelleri

Oxidation of rubrene, and implications for device stability

Electrical properties and crystal structures of nitrogen-doped Ge2Sb2Te5 thin film for phase change memory

Microstructural, optical, and electrical properties of Ni–Al co-doped ZnO films prepared by DC magnetron sputtering

Morphology of instability of the wetting tips of eutectic SnBi, eutectic SnPb, and pure Sn on Cu

Electro-optical properties of water-soluble conjugated polymer

Ferroelectric composites and ceramics based on stillwellite-like solid solutions

Application of Artificial Neural Network for Fatigue Life Prediction

Fracture Mechanic Analysis for Package Delamination

Reduction of surface recombination in n-type HgZnTe ( x=0.16) crystal

Study on minority carrier lifetime of n-HgZnTe by photoconductive decay method

Crystallization of electroless Ni-P under bump metallization induced by solder reaction

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