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Key Technologies and Design Aspects for Wafer Level Packaging of High Performance Computing Modules

2024 IEEE 74th Electronic Components and Technology Conference (ECTC), 2024, p.433-440

2024

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Technologies for Wafer Level MEMS Capping based on Permanent and Temporary Wafer Bonding

IMAPS other content, 2015-01, Vol.2015 (DPC), p.698-725

2015

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Evolution of structured adhesive wafer to wafer bonding enabled by laser direct patterning of polymer resins

2016 IEEE 18th Electronics Packaging Technology Conference (EPTC), 2016, p.223-228

2016

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3D Process Integration – Requirements and Challenges

MRS proceedings, 2008, Vol.1112 (1), Article 1112-E01-01

2008

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Flexible and Stretchable Systems for Healthcare and Mobility

Flexible, Wearable, and Stretchable Electronics, 2021, Vol.1, p.269-282

1, 2021

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Hermetic Wafer Level Packaging of LED Modules with Phosphor Ceramic Converter for White Light Applications based on TSV Technology

2018 7th Electronic System-Integration Technology Conference (ESTC), 2018, p.1-9

2018

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Temporary handling technology by polyimide based adhesive bonding and laser assisted de-bonding

2016 6th Electronic System-Integration Technology Conference (ESTC), 2016, p.1-6

2016

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Effect of wafer-level silicon cap packaging on BiCMOS embedded RF-MEMS switch performance

IMAPS other content, 2017-07, Vol.2017 (NOR), p.1-4

2017

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Effect of wafer-level silicon cap packaging on BiCMOS embedded RF-MEMS switch performance

2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac), 2017, p.31-34

2017

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Ultra Thin Force and Acceleration Sensor Embedded in Flexible Thin Film Substrates Using Thin Chip Handling, Bonding and Carrier Release Technologies

2019 12th International Conference on Developments in eSystems Engineering (DeSE), 2019, p.902-905

2019

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Temporary handling technology for advanced wafer level packaging applications based on adhesive bonding and laser assisted de-bonding

2014 IEEE 16th Electronics Packaging Technology Conference (EPTC), 2014, p.209-214

2014

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Laser Direct Patterning of Dry Etch BCB Adhesive Layers for Low Temperature Permanent Wafer-to-Wafer Bonding

IMAPS other content, 2016-01, Vol.2016 (DPC), p.1222-1254

2016

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Wafer level packaging for hermetical encapsulation of MEMS resonators

2015 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2015, p.1-6

2015

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Wafer level packaging of MEMS and 3D integration with CMOS for fabrication of timing microsystems

2016 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2016, p.1-6

2016

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Thin Wafer Handling Using Mechanical- or Laser-Debondable Temporary Adhesives

IMAPS other content, 2015-01, Vol.2015 (DPC), p.419-441

2015

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Low Temperature Wafer Level Bonding Using Benzocyclobutene Adhesive Polymers

IMAPS other content, 2012-01, Vol.2012 (DPC), p.1-24

2012

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Temporary and Permanent Adhesives for Thin Wafer Handling and Assembly

IMAPS other content, 2013-01, Vol.2013 (DPC), p.1009-1032

2013

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Wafer-level glass-caps for advanced optical applications

2011 Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS (DTIP), 2011, p.46-52

2011

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Anodic bonding at low voltage using microstructured borosilicate glass thin-films

3rd Electronics System Integration Technology Conference ESTC, 2010, p.1-4

2010

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Patterned Permanent Bonding of Benzocyclobutene Based Dielectric Materials for Advanced Wafer Level Packaging

IMAPS other content, 2014-01, Vol.2014 (DPC), p.886-912

2014

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Thin hermetic passivation of semiconductors using low temperature borosilicate glass - benchmark of a new wafer-level packaging technology

2009 59th Electronic Components and Technology Conference, 2009, p.886-891

2009

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Overexpression of ctr1Δ300, a high‐affinity copper transporter with deletion of the cytosolic C‐terminus in Saccharomyces cerevisiae under excess copper, leads to disruption of transition metal homeostasis and transcriptional remodelling of cellular processes

Yeast (Chichester, England), 2013-05, Vol.30 (5), p.201-218

2013

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Overexpression of ctr1 Delta 300, a high-affinity copper transporter with deletion of the cytosolic C-terminus in Saccharomyces cerevisiae under excess copper, leads to disruption of transition metal homeostasis and transcriptional remodelling of cellular processes

Yeast (Chichester, England), 2013-05, Vol.30 (5), p.201-218

2013

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Overexpression of ctr1[Delta]300, a high-affinity copper transporter with deletion of the cytosolic C-terminus in Saccharomyces cerevisiae under excess copper, leads to disruption of transition metal homeostasis and transcriptional remodelling of cellular processes

Yeast (Chichester, England), 2013-05, Vol.30 (5), p.201

2013

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Key Technologies and Design Aspects for Wafer Level Packaging of High Performance Computing Modules

Technologies for Wafer Level MEMS Capping based on Permanent and Temporary Wafer Bonding

Evolution of structured adhesive wafer to wafer bonding enabled by laser direct patterning of polymer resins

3D Process Integration – Requirements and Challenges

Flexible and Stretchable Systems for Healthcare and Mobility

Hermetic Wafer Level Packaging of LED Modules with Phosphor Ceramic Converter for White Light Applications based on TSV Technology

Temporary handling technology by polyimide based adhesive bonding and laser assisted de-bonding

Effect of wafer-level silicon cap packaging on BiCMOS embedded RF-MEMS switch performance

Effect of wafer-level silicon cap packaging on BiCMOS embedded RF-MEMS switch performance

Ultra Thin Force and Acceleration Sensor Embedded in Flexible Thin Film Substrates Using Thin Chip Handling, Bonding and Carrier Release Technologies

Temporary handling technology for advanced wafer level packaging applications based on adhesive bonding and laser assisted de-bonding

Laser Direct Patterning of Dry Etch BCB Adhesive Layers for Low Temperature Permanent Wafer-to-Wafer Bonding

Wafer level packaging for hermetical encapsulation of MEMS resonators

Wafer level packaging of MEMS and 3D integration with CMOS for fabrication of timing microsystems

Thin Wafer Handling Using Mechanical- or Laser-Debondable Temporary Adhesives

Low Temperature Wafer Level Bonding Using Benzocyclobutene Adhesive Polymers

Temporary and Permanent Adhesives for Thin Wafer Handling and Assembly

Wafer-level glass-caps for advanced optical applications

Anodic bonding at low voltage using microstructured borosilicate glass thin-films

Patterned Permanent Bonding of Benzocyclobutene Based Dielectric Materials for Advanced Wafer Level Packaging

Thin hermetic passivation of semiconductors using low temperature borosilicate glass - benchmark of a new wafer-level packaging technology

Overexpression of ctr1Δ300, a high‐affinity copper transporter with deletion of the cytosolic C‐terminus in Saccharomyces cerevisiae under excess copper, leads to disruption of transition metal homeostasis and transcriptional remodelling of cellular processes

Overexpression of ctr1 Delta 300, a high-affinity copper transporter with deletion of the cytosolic C-terminus in Saccharomyces cerevisiae under excess copper, leads to disruption of transition metal homeostasis and transcriptional remodelling of cellular processes

Overexpression of ctr1[Delta]300, a high-affinity copper transporter with deletion of the cytosolic C-terminus in Saccharomyces cerevisiae under excess copper, leads to disruption of transition metal homeostasis and transcriptional remodelling of cellular processes

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