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Simple model for time-dependent dielectric breakdown in inter- and intralevel low- k dielectrics

Journal of applied physics, 2005-10, Vol.98 (8), p.084109-084109-6

2005

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Relationship between interfacial adhesion and electromigration in Cu metallization

Journal of applied physics, 2003-02, Vol.93 (3), p.1417-1421

2003

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Reduced electromigration of Cu wires by surface coating

Applied physics letters, 2002-09, Vol.81 (10), p.1782-1784

2002

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The effect of stress on the dielectric properties of barium strontium titanate thin films

Applied physics letters, 1999-10, Vol.75 (14), p.2129-2131

1999

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Effect of oxygen at the Cu-SiCxNy interface on electromigration performance of interconnect structures

Thin solid films, 2006-08, Vol.513 (1-2), p.295-299

2006

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Comparison of Cu electromigration lifetime in Cu interconnects coated with various caps

Applied physics letters, 2003-08, Vol.83 (5), p.869-871

2003

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In situ study of void growth kinetics in electroplated Cu lines

Journal of applied physics, 2002-08, Vol.92 (4), p.1803-1810

2002

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Effect of liner thickness on electromigration lifetime

Journal of applied physics, 2003-06, Vol.93 (12), p.9576-9582

2003

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Electromigration Cu mass flow in Cu interconnections

Thin solid films, 2006-05, Vol.504 (1), p.274-278

2006

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Stress‐Corrosion Cracking of Low‐Dielectric‐Constant Spin‐On‐Glass Thin Films

Journal of the Electrochemical Society, 1999-12, Vol.146 (12), p.4439-4448

1999

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Synergistic combinations of dielectrics and metallization process technology to achieve 22nm interconnect performance targets

Microelectronic engineering, 2012-04, Vol.92, p.9-14

2012

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Random loose packings of uniform spheres and the dilatancy onset

Physical review letters, 1990-05, Vol.64 (22), p.2727-2730

1990

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Effect of metal liner on electromigration in Cu Damascene lines

Journal of applied physics, 2005-12, Vol.98 (12), p.124501-124501-8

2005

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Polymeric Organic−Inorganic Hybrid Nanocomposites: Preparation of Polyimide-Modified Poly(silsesquioxane) Using Functionalized Poly(amic acid alkyl ester) Precursors

Macromolecules, 1997-12, Vol.30 (26), p.8512-8515

1997

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Electromigration in On-Chip Single/Dual Damascene Cu Interconnections

Journal of the Electrochemical Society, 2002-07, Vol.149 (7), p.G408

2002

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Moisture-driven crack growth in blanket low dielectric constant and ultralow dielectric constant films

Journal of applied physics, 2004-09, Vol.96 (6), p.3482-3485

2004

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Electromigration Reliability of Advanced Interconnects

Stress-Induced Phenomona in Metallization (AIP Conference Proceedings Volume 945), 2007, Vol.945, p.27-41

2007

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Divergence effects in monochromatic x-ray microdiffraction using tapered capillary optics

Review of scientific instruments, 2000-05, Vol.71 (5), p.1991-2000

2000

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Topographic measurement of electromigration-induced stress gradients in aluminum conductor lines

Applied physics letters, 2000-06, Vol.76 (25), p.3726-3728

2000

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Novel low k Dielectric materials for nano device interconnect technology

2020 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA), 2020, p.117-118

2020

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Electrolyte Additive Chemistry and Feature Size-Dependent Impurity Incorporation for Cu Interconnects

Journal of the Electrochemical Society, 2012-01, Vol.159 (10), p.D563-D569

2012

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Kinetics of Indentation Cracking in Glass

Journal of the American Ceramic Society, 1993-05, Vol.76 (5), p.1096-1105

1993

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Low Hydrogen Silicon Carbon Nitride Cap for High Performance Sub-10 nm Cu-Low k Interconnect

ECS transactions, 2017, Vol.77 (5), p.111-120

2017

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Delamination from edge flaws

Proceedings of the Royal Society. A, Mathematical and physical sciences, 1994-11, Vol.447 (1930), p.271-279

1994

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Low Hydrogen Silicon Carbon Nitride Cap for High Performance Sub-10 nm Cu-Low k Interconnect

ECS journal of solid state science and technology, 2017, Vol.6 (7), p.P429-P434

2017

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Simple model for time-dependent dielectric breakdown in inter- and intralevel low- k dielectrics

Relationship between interfacial adhesion and electromigration in Cu metallization

Reduced electromigration of Cu wires by surface coating

The effect of stress on the dielectric properties of barium strontium titanate thin films

Effect of oxygen at the Cu-SiCxNy interface on electromigration performance of interconnect structures

Comparison of Cu electromigration lifetime in Cu interconnects coated with various caps

In situ study of void growth kinetics in electroplated Cu lines

Effect of liner thickness on electromigration lifetime

Electromigration Cu mass flow in Cu interconnections

Stress‐Corrosion Cracking of Low‐Dielectric‐Constant Spin‐On‐Glass Thin Films

Synergistic combinations of dielectrics and metallization process technology to achieve 22nm interconnect performance targets

Random loose packings of uniform spheres and the dilatancy onset

Effect of metal liner on electromigration in Cu Damascene lines

Polymeric Organic−Inorganic Hybrid Nanocomposites: Preparation of Polyimide-Modified Poly(silsesquioxane) Using Functionalized Poly(amic acid alkyl ester) Precursors

Electromigration in On-Chip Single/Dual Damascene Cu Interconnections

Moisture-driven crack growth in blanket low dielectric constant and ultralow dielectric constant films

Electromigration Reliability of Advanced Interconnects

Divergence effects in monochromatic x-ray microdiffraction using tapered capillary optics

Topographic measurement of electromigration-induced stress gradients in aluminum conductor lines

Novel low k Dielectric materials for nano device interconnect technology

Electrolyte Additive Chemistry and Feature Size-Dependent Impurity Incorporation for Cu Interconnects

Kinetics of Indentation Cracking in Glass

Low Hydrogen Silicon Carbon Nitride Cap for High Performance Sub-10 nm Cu-Low k Interconnect

Delamination from edge flaws

Low Hydrogen Silicon Carbon Nitride Cap for High Performance Sub-10 nm Cu-Low k Interconnect

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