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Whisker growth behaviors in POSS-silanol modified Sn3.0Ag0.5Cu composite solders

Journal of alloys and compounds, 2016-02, Vol.657, p.400-407

2016

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Clinical decision analysis in the management of displaced mid-shaft clavicle fractures: the patient's perspective

Injury extra, 2010-12, Vol.41 (12), p.159-159

2010

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Evaluation of creep behavior of near-eutectic Sn–Ag solders containing small amount of alloy additions

Materials science & engineering. A, Structural materials : properties, microstructure and processing, 2003-06, Vol.351 (1), p.190-199

2003

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Electrochemical studies of Pd-doped Cu and Pd-doped Cu-Al intermetallics for understanding corrosion behavior in wire-bonding packages

Microelectronics and reliability, 2017-11, Vol.78, p.355-361

2017

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Strain patterns in three different femoral interlocking nail-bone units: A biomechanical comparative study

Injury extra, 2008-05, Vol.39 (5), p.164-164

2008

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Current concepts on management of cuff tear

Journal of clinical orthopaedics and trauma, 2022-05, Vol.28, p.101808, Article 101808

2022

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Effects of internal stresses on the thermomechanical behavior of Sn-based solder joints

Materials science & engineering. A, Structural materials : properties, microstructure and processing, 2006-04, Vol.421 (1), p.46-56

2006

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Electromigration induced microstructure and morphological changes in eutectic SnPb solder joints

Journal of materials research, 2007-11, Vol.22 (11), p.3265-3272

2007

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Electrical conductivity changes in bulk Sn, and eutectic Sn-Ag in bulk and in joints, from aging and thermal shock

Journal of materials research, 2005-02, Vol.20 (2), p.364-374

2005

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Effect of cold rolling on the tensile properties of (Al 2O 3) p/Al composites

Materials science & engineering. A, Structural materials : properties, microstructure and processing, 1992-12, Vol.159 (1), p.43-50

1992

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Roles of imposed cyclic strain amplitude and cyclic strain rate on the stress relaxation behaviour of prestrained eutectic Sn3.5Ag solder joints

Soldering & surface mount technology, 2006-01, Vol.18 (1), p.19-28

2006

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Microstructural features contributing to enhanced behaviour of SnAg based solder joints

Soldering & surface mount technology, 2005-03, Vol.17 (1), p.33-39

2005

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Foreword

Journal of electronic materials, 2008, Vol.37 (1), p.1-1

2008

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Foreword

Journal of electronic materials, 2008-01, Vol.37 (1), p.1-1

2008

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Quantification of creep strain distribution in small crept lead-free in-situ composite and non composite solder joints

Materials science & engineering. A, Structural materials : properties, microstructure and processing, 2000-06, Vol.285 (1), p.25-34

2000

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Microstructural engineering of solders

Journal of electronic materials, 1999-11, Vol.28 (11), p.1176-1183

1999

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Creep behaviour of composite leadfree electronic solder joints

Soldering & surface mount technology, 2003-04, Vol.15 (1), p.39-42

2003

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Mechanical characterization of Sn3.5Ag solder joints at various temperatures

Soldering & surface mount technology, 2003-12, Vol.15 (3), p.21-26

2003

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Percutaneous removal of metalwork around ankle: our experience with first 12 cases

Foot and ankle surgery, 2004, Vol.10 (1), p.9-11

2004

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Creep deformation behavior in eutectic Sn-Ag solder joints using a novel mapping technique

Journal of electronic materials, 1999-11, Vol.28 (11), p.1270-1275

1999

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The tensile properties of hot-rolled (Al 2O 3) p-Al composites

Materials science & engineering. A, Structural materials : properties, microstructure and processing, 1995-06, Vol.196 (1), p.71-78

1995

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On the growth of the two-phase bicrystals of alpha-beta brass

Journal of crystal growth, 1974-02, Vol.21 (2), p.287-293

1974

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Effects of Pb contamination on the eutectic SnAg solder joint

Soldering & surface mount technology, 2001-08, Vol.13 (2), p.26-29

2001

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Microstructural characterisation of reflowed and isothermallyaged Cu and Ag particulate reinforced Sn3.5Ag composite solders

Soldering & surface mount technology, 2001-04, Vol.13 (1), p.7-18

2001

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Intravenous immune globulin therapy for early-onset sepsis in premature neonates

The Journal of pediatrics, 1992-09, Vol.121 (3), p.434-443

1992

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Whisker growth behaviors in POSS-silanol modified Sn3.0Ag0.5Cu composite solders

Clinical decision analysis in the management of displaced mid-shaft clavicle fractures: the patient's perspective

Evaluation of creep behavior of near-eutectic Sn–Ag solders containing small amount of alloy additions

Electrochemical studies of Pd-doped Cu and Pd-doped Cu-Al intermetallics for understanding corrosion behavior in wire-bonding packages

Strain patterns in three different femoral interlocking nail-bone units: A biomechanical comparative study

Current concepts on management of cuff tear

Effects of internal stresses on the thermomechanical behavior of Sn-based solder joints

Electromigration induced microstructure and morphological changes in eutectic SnPb solder joints

Electrical conductivity changes in bulk Sn, and eutectic Sn-Ag in bulk and in joints, from aging and thermal shock

Effect of cold rolling on the tensile properties of (Al 2O 3) p/Al composites

Roles of imposed cyclic strain amplitude and cyclic strain rate on the stress relaxation behaviour of prestrained eutectic Sn3.5Ag solder joints

Microstructural features contributing to enhanced behaviour of SnAg based solder joints

Foreword

Foreword

Quantification of creep strain distribution in small crept lead-free in-situ composite and non composite solder joints

Microstructural engineering of solders

Creep behaviour of composite leadfree electronic solder joints

Mechanical characterization of Sn3.5Ag solder joints at various temperatures

Percutaneous removal of metalwork around ankle: our experience with first 12 cases

Creep deformation behavior in eutectic Sn-Ag solder joints using a novel mapping technique

The tensile properties of hot-rolled (Al 2O 3) p-Al composites

On the growth of the two-phase bicrystals of alpha-beta brass

Effects of Pb contamination on the eutectic SnAg solder joint

Microstructural characterisation of reflowed and isothermallyaged Cu and Ag particulate reinforced Sn3.5Ag composite solders

Intravenous immune globulin therapy for early-onset sepsis in premature neonates

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