UB Paderborn / Katalog / Suche / in CDI

Sortiert nach

Einfacher Volltextzugriff von (fast) überall

Installieren Sie die LibKey Nomad-Browsererweiterung und erhalten Sie von vielen Webseiten einfachen Zugriff auf lizenzierte Volltexte oder Open Access Publikationen. Mehr erfahren...

Soft, comfortable polymer dry electrodes for high quality ECG and EEG recording

Sensors (Basel, Switzerland), 2014-12, Vol.14 (12), p.23758-23780

2014

Volltextzugriff (PDF)

Effect of Pore Structure of Nanometer Scale Porous Films on the Measured Elastic Modulus

Langmuir, 2013-09, Vol.29 (38), p.12025-12035

2013

Volltextzugriff (PDF)

Thermal expansion coefficients of ultralow-k dielectric films by cube corner indentation tests at elevated temperatures

Applied physics letters, 2015-12, Vol.107 (23)

2015

Volltextzugriff (PDF)

Mechanical integrity of nano-interconnects; the impact of metallization density

Micro and Nano Engineering, 2019-03, Vol.2, p.35-40

2019

Volltextzugriff (PDF)

Mechanical integrity of back-end-of-line with Ru nanowires and airgaps

Microelectronics and reliability, 2020-07, Vol.110, p.113700, Article 113700

2020

Volltextzugriff (PDF)

Effect of UV wavelength on the hardening process of porogen-containing and porogen-free ultralow-k plasma-enhanced chemical vapor deposition dielectrics

Journal of vacuum science and technology. B, Nanotechnology & microelectronics, 2011-05, Vol.29 (3)

2011

Volltextzugriff (PDF)

Nanoindentation based method to determine the thermal expansion coefficients of low-k dielectrics

Thin solid films, 2022-10, Vol.759, p.139467, Article 139467

2022

Volltextzugriff (PDF)

Nanoindentation study of thin plasma enhanced chemical vapor deposition SiCOH low-k films modified in He/H2 downstream plasma

Journal of vacuum science and technology. B, Nanotechnology & microelectronics, 2010-01, Vol.28 (1), p.173-179

2010

Volltextzugriff (PDF)

Impact of back-end-of-line architecture on chip-package-interaction in advanced interconnects

Microelectronics and reliability, 2020-09, Vol.112, p.113825, Article 113825

2020

Volltextzugriff (PDF)

Metal-Organic Framework ZIF‑8 Films As Low‑κ Dielectrics in Microelectronics

Chemistry of materials, 2013-01, Vol.25 (1), p.27-33

2013

Volltextzugriff (PDF)

Evaluation of a New Advanced Low-$k$ Material

Japanese Journal of Applied Physics, 2011-05, Vol.50 (5), p.05EB03-05EB03-5

2011

Volltextzugriff (PDF)

A numerical study on nano-indentation induced fracture of low dielectric constant brittle thin films using cube corner probes

Microelectronic engineering, 2016-04, Vol.156, p.108-115

2016

Volltextzugriff (PDF)

Anodic electrodeposition of continuous metal-organic framework films with robust adhesion by pre-anchored strategy

Microporous and mesoporous materials, 2023-02, Vol.350, p.112443, Article 112443

2023

Volltextzugriff (PDF)

Determination of elastic properties of a MnO2 coating by surface acoustic wave velocity dispersion analysis

Journal of applied physics, 2014-07, Vol.116 (2)

2014

Volltextzugriff (PDF)

Atomic Layer Deposition of Ruthenium with TiN Interface for Sub-10 nm Advanced Interconnects beyond Copper

ACS applied materials & interfaces, 2016-10, Vol.8 (39), p.26119-26125

2016

Volltextzugriff (PDF)

Substrate Independent Elastic Modulus of Thin Low Dielectric Constant Materials

Advanced engineering materials, 2017-08, Vol.19 (8), p.n/a

2017

Volltextzugriff (PDF)

Influence of porosity on dielectric breakdown of ultralow-k dielectrics

Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, 2013-09, Vol.31 (5)

2013

Volltextzugriff (PDF)

Atomic Layer Deposition of Ruthenium Thin Films from (Ethylbenzyl) (1-Ethyl-1,4-cyclohexadienyl) Ru: Process Characteristics, Surface Chemistry, and Film Properties

Chemistry of materials, 2017-06, Vol.29 (11), p.4654-4666

2017

Volltextzugriff (PDF)

Ruthenium metallization for advanced interconnects

2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC), 2016, p.34-36

2016

Volltextzugriff (PDF)

Properties of ultrathin molybdenum films for interconnect applications

Materialia, 2022-08, Vol.24, p.101511, Article 101511

2022

Volltextzugriff (PDF)

Mechanical integrity of nano-interconnects as brittle-matrix nano-composites

Theoretical and applied fracture mechanics, 2018-06, Vol.95, p.194-207

2018

Volltextzugriff (PDF)

Advanced PECVD SiCOH low-k films with low dielectric constant and/or high Young’s modulus

Microelectronic engineering, 2014-05, Vol.120, p.225-229

2014

Volltextzugriff (PDF)

A Novel Method for Characterization of Ultralow Viscosity NCF Layers Using TCB for 3D Assembly

Journal of microelectronics and electronic packaging, 2021-01, Vol.18 (1), p.12-20

2021

Volltextzugriff (PDF)

Determining the physical properties of EpoClad negative photoresist for use in MEMS applications

Journal of micromechanics and microengineering, 2011-07, Vol.21 (7), p.074001

2011

Volltextzugriff (PDF)

Effect of 4-point bending test procedure on crack propagation in thin film stacks

Microelectronic engineering, 2015-04, Vol.137, p.59-63

2015

Volltextzugriff (PDF)

1 – 25 von 74

Suche als RSS-Feed

Aktive Filter

ThemaCopper

Suchergebnisse filtern

Filter anzeigen

Nur zeigen

Geprüft (Peer-Review)
(43)
Mit Volltextzugriff
(60)

Publikationsform

Sprache

Englisch
(74)

Erscheinungsjahr

n.n

Thema

Science & Technology
(48)
Technology
(40)
Physical Sciences
(36)
Physics
(27)
Physics, Applied
(26)
Engineering
(25)
Engineering, Electrical & Electronic
(24)
Materials Science
(20)
Nanoscience & Nanotechnology
(19)
Science & Technology - Other Topics
(19)
Materials Science, Multidisciplinary
(18)
Thin Films
(10)
Chemistry
(7)
Optics
(7)
Chemistry, Physical
(6)
Exact Sciences And Technology
(6)
Dielectric Constant
(5)
Dielectrics
(5)
Finite Element Method
(5)
Ruthenium
(5)

15 weitere anzeigen...

Weniger anzeigen...

Menü

Weitere Dienste

Einstellungen

Soft, comfortable polymer dry electrodes for high quality ECG and EEG recording

Effect of Pore Structure of Nanometer Scale Porous Films on the Measured Elastic Modulus

Thermal expansion coefficients of ultralow-k dielectric films by cube corner indentation tests at elevated temperatures

Mechanical integrity of nano-interconnects; the impact of metallization density

Mechanical integrity of back-end-of-line with Ru nanowires and airgaps

Effect of UV wavelength on the hardening process of porogen-containing and porogen-free ultralow-k plasma-enhanced chemical vapor deposition dielectrics

Nanoindentation based method to determine the thermal expansion coefficients of low-k dielectrics

Nanoindentation study of thin plasma enhanced chemical vapor deposition SiCOH low-k films modified in He/H2 downstream plasma

Impact of back-end-of-line architecture on chip-package-interaction in advanced interconnects

Metal-Organic Framework ZIF‑8 Films As Low‑κ Dielectrics in Microelectronics

Evaluation of a New Advanced Low-$k$ Material

A numerical study on nano-indentation induced fracture of low dielectric constant brittle thin films using cube corner probes

Anodic electrodeposition of continuous metal-organic framework films with robust adhesion by pre-anchored strategy

Determination of elastic properties of a MnO2 coating by surface acoustic wave velocity dispersion analysis

Atomic Layer Deposition of Ruthenium with TiN Interface for Sub-10 nm Advanced Interconnects beyond Copper

Substrate Independent Elastic Modulus of Thin Low Dielectric Constant Materials

Influence of porosity on dielectric breakdown of ultralow-k dielectrics

Atomic Layer Deposition of Ruthenium Thin Films from (Ethylbenzyl) (1-Ethyl-1,4-cyclohexadienyl) Ru: Process Characteristics, Surface Chemistry, and Film Properties

Ruthenium metallization for advanced interconnects

Properties of ultrathin molybdenum films for interconnect applications

Mechanical integrity of nano-interconnects as brittle-matrix nano-composites

Advanced PECVD SiCOH low-k films with low dielectric constant and/or high Young’s modulus

A Novel Method for Characterization of Ultralow Viscosity NCF Layers Using TCB for 3D Assembly

Determining the physical properties of EpoClad negative photoresist for use in MEMS applications

Effect of 4-point bending test procedure on crack propagation in thin film stacks

Aktive Filter

Suchergebnisse filtern