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Microstructure evolution during reflow and thermal aging in a Ag@Sn TLP bondline for high-temperature power devices

Journal of materials science. Materials in electronics, 2018-02, Vol.29 (4), p.3014-3024

2018

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The low temperature exothermic sintering of formic acid treated Cu nanoparticles for conductive ink

Journal of materials science. Materials in electronics, 2016-12, Vol.27 (12), p.13280-13287

2016

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Enhancement of the electron transportation in the perovskite solar cells via optimizing the photoelectric properties of electron transport layer with nitrogen-doped graphene quantum dots

Journal of materials science. Materials in electronics, 2022-06, Vol.33 (18), p.14443-14456

2022

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Tailoring thermal behavior and solid–liquid contact area of Sn/Cu composite solder during ultrasonic-assisted transient liquid phase process

Journal of materials science. Materials in electronics, 2023, Vol.34 (3), p.162, Article 162

2023

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Microstructure and mechanical properties of Sn–Bi solder joints reinforced with Zn@Sn core–shell particles

Journal of materials science. Materials in electronics, 2022-08, Vol.33 (22), p.17745-17756

2022

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Ag microflake-reinforced nano-Ag paste with high mechanical reliability for high-temperature applications

Journal of materials science. Materials in electronics, 2019-03, Vol.30 (6), p.5526-5535

2019

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Fabrication of high-temperature-resistant bondline based on multilayer core–shell hybrid microspheres for power devices

Journal of materials science. Materials in electronics, 2019-02, Vol.30 (4), p.3595-3603

2019

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Preparation, properties, and reliability of Cu/Sn composite joints with porous Cu as interlayer for high-temperature resistant packaging

Journal of materials science. Materials in electronics, 2023-03, Vol.34 (8), p.715, Article 715

2023

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Synthesis of PVZ glass and its improvement on mechanical and electrical properties of low temperature sintered silver paste

Journal of materials science. Materials in electronics, 2020-05, Vol.31 (10), p.8086-8098

2020

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Low temperature nanojoining of silver–copper nanopaste as die attach material for high temperature packaging

Journal of materials science. Materials in electronics, 2017-04, Vol.28 (7), p.5446-5451

2017

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Effect of SiC reinforcement on the reliability of Ag nanoparticle paste for high-temperature applications

Journal of materials science. Materials in electronics, 2019-02, Vol.30 (3), p.2413-2418

2019

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A high-temperature-resistant die attach material based on Cu@In@Ag particles for high-power devices

Journal of materials science. Materials in electronics, 2022-03, Vol.33 (8), p.5599-5612

2022

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Nucleation behavior of Mg2Sn on Ta surface during ultrasonic-assisted soldering of Ta/Sn/Mg joint

Journal of materials science. Materials in electronics, 2019-09, Vol.30 (18), p.17239-17244

2019

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A low-temperature bonding method for high power device packaging based on In-infiltrated nanoporous Cu

Journal of materials science. Materials in electronics, 2020-09, Vol.31 (17), p.14157-14164

2020

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Rapid formation of Cu–Cu joints with high shear strength using multiple-flocculated Ag nanoparticle paste

Journal of materials science. Materials in electronics, 2019-04, Vol.30 (8), p.8071-8079

2019

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Microstructure and properties of a vacuum-tempered glass with low-temperature-sintered silver paste

Journal of materials science. Materials in electronics, 2021-06, Vol.32 (12), p.16230-16241

2021

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Cu@Sn@Ag core–shell particles preform for power device packaging under harsh environments

Journal of materials science. Materials in electronics, 2021-06, Vol.32 (11), p.14703-14714

2021

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A low-temperature Cu-to-Cu interconnection method by using nanoporous Cu fabricated by dealloying electroplated Cu–Zn

Journal of materials science. Materials in electronics, 2020-11, Vol.31 (21), p.18381-18388

2020

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Enhanced pyroelectric properties of 1–3 nanocomposites achieved by uniaxial stretching

Journal of materials science. Materials in electronics, 2019-04, Vol.30 (7), p.6760-6767

2019

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A paste based on Cu@Sn@Ag particles for die attachment under ambient atmosphere in power device packaging

Journal of materials science. Materials in electronics, 2020-02, Vol.31 (3), p.1808-1816

2020

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Effects of Pd addition on the interfacial reactions between Cu and Al during ultrasonic welding

Journal of materials science. Materials in electronics, 2019-07, Vol.30 (14), p.12840-12850

2019

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A low temperature die attach technique for high temperature applications based on indium infiltrating micro-porous Ag sheet

Journal of materials science. Materials in electronics, 2018-11, Vol.29 (21), p.18302-18310

2018

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The mechanism of Pd distribution in the process of FAB formation during Pd-coated Cu wire bonding

Journal of materials science. Materials in electronics, 2018-08, Vol.29 (16), p.13774-13781

2018

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Effect of annealing process on magnetic properties of Fe80Co3Si3B10P1C3 amorphous alloy magnetic cores

Journal of materials science. Materials in electronics, 2023-06, Vol.34 (18), p.1396, Article 1396

2023

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Magnetic and structure property correlations in Mn-doped BiFeO3 system

Journal of materials science. Materials in electronics, 2020-08, Vol.31 (16), p.13150-13157

2020

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Microstructure evolution during reflow and thermal aging in a Ag@Sn TLP bondline for high-temperature power devices

The low temperature exothermic sintering of formic acid treated Cu nanoparticles for conductive ink

Enhancement of the electron transportation in the perovskite solar cells via optimizing the photoelectric properties of electron transport layer with nitrogen-doped graphene quantum dots

Tailoring thermal behavior and solid–liquid contact area of Sn/Cu composite solder during ultrasonic-assisted transient liquid phase process

Microstructure and mechanical properties of Sn–Bi solder joints reinforced with Zn@Sn core–shell particles

Ag microflake-reinforced nano-Ag paste with high mechanical reliability for high-temperature applications

Fabrication of high-temperature-resistant bondline based on multilayer core–shell hybrid microspheres for power devices

Preparation, properties, and reliability of Cu/Sn composite joints with porous Cu as interlayer for high-temperature resistant packaging

Synthesis of PVZ glass and its improvement on mechanical and electrical properties of low temperature sintered silver paste

Low temperature nanojoining of silver–copper nanopaste as die attach material for high temperature packaging

Effect of SiC reinforcement on the reliability of Ag nanoparticle paste for high-temperature applications

A high-temperature-resistant die attach material based on Cu@In@Ag particles for high-power devices

Nucleation behavior of Mg2Sn on Ta surface during ultrasonic-assisted soldering of Ta/Sn/Mg joint

A low-temperature bonding method for high power device packaging based on In-infiltrated nanoporous Cu

Rapid formation of Cu–Cu joints with high shear strength using multiple-flocculated Ag nanoparticle paste

Microstructure and properties of a vacuum-tempered glass with low-temperature-sintered silver paste

Cu@Sn@Ag core–shell particles preform for power device packaging under harsh environments

A low-temperature Cu-to-Cu interconnection method by using nanoporous Cu fabricated by dealloying electroplated Cu–Zn

Enhanced pyroelectric properties of 1–3 nanocomposites achieved by uniaxial stretching

A paste based on Cu@Sn@Ag particles for die attachment under ambient atmosphere in power device packaging

Effects of Pd addition on the interfacial reactions between Cu and Al during ultrasonic welding

A low temperature die attach technique for high temperature applications based on indium infiltrating micro-porous Ag sheet

The mechanism of Pd distribution in the process of FAB formation during Pd-coated Cu wire bonding

Effect of annealing process on magnetic properties of Fe80Co3Si3B10P1C3 amorphous alloy magnetic cores

Magnetic and structure property correlations in Mn-doped BiFeO3 system

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