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Localized Multi-axis Loading Impact on Interconnect Thermal Cycling Performance in Via-in-Pad Plated Over (VIPPO) Board Configuration

Journal of electronic materials, 2021-03, Vol.50 (3), p.699-709

2021

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Influence of Pad Surface Finish on the Microstructure Evolution and Intermetallic Compound Growth in Homogeneous Sn-Bi and Sn-Bi-Ag Solder Interconnects

Journal of electronic materials, 2021-12, Vol.50 (12), p.6615-6628

2021

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Superior Reliability of SAC105 Solder on BGA Package Pad with NiPdAu Coating

Journal of electronic materials, 2019-01, Vol.48 (1), p.1-8

2019

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Effect of Ag Additives on the Consumption of a Cathode Cu Pad in a Cu/Sn3.5Ag/Cu Flip-Chip Structure Under Electromigration

Journal of electronic materials, 2021-12, Vol.50 (12), p.6584-6589

2021

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A Technology for Bonding Cu Wires with Cu Pads: Structure and Electrical Fatigue Mechanism of Fine Micro-alloyed Cu Wires

Journal of electronic materials, 2023-06, Vol.52 (6), p.4169-4178

2023

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Solid–Solid Reaction Between Sn-3Ag-0.5Cu Alloy and Au/Pd(P)/Ni(P) Metallization Pad with Various Pd(P) Thicknesses

Journal of electronic materials, 2012, Vol.41 (1), p.11-21

2012

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The Intermetallic Compound Formation for the Wire Bond Between an Al Pad and Ag-xPd Alloy Wire

Journal of electronic materials, 2016-12, Vol.45 (12), p.6130-6136

2016

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Black Pad Susceptibility of the Electroless Ni Films on the Cu UBM

Journal of electronic materials, 2014-11, Vol.43 (11), p.4335-4343

2014

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Effects of PCB Pad Metal Finishes on the Cu-Pillar/Sn-Ag Micro Bump Joint Reliability of Chip-on-Board (COB) Assembly

Journal of electronic materials, 2016-06, Vol.45 (6), p.3208-3219

2016

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Development of a Novel Polishing Pad with a Phyllotactic Pattern, and Experimental Studies

Journal of electronic materials, 2014-07, Vol.43 (7), p.2738-2746

2014

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The Evolution of IMCs in Single Crystal Sn3.0Ag0.5Cu and Sn3.0Ag3.0Bi3.0In BGA Solder Joints with Au/Ni/Cu Pads Under Current Stressing

Journal of electronic materials, 2019-05, Vol.48 (5), p.2770-2779

2019

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Experimental Evaluation of the Effect of Pad Debris Size on Microscratches during CMP Process

Journal of electronic materials, 2013, Vol.42 (1), p.97-102

2013

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Effect of Metal Bond-Pad Configurations on the Solder Microstructure Development of Flip-Chip Solder Joints

Journal of electronic materials, 2014, Vol.43 (1), p.170-175

2014

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Gold- and Palladium-Induced Embrittlement Phenomenon in Microbumps with Au/Pd(P)/Ni(P) Metallization Pads

Journal of electronic materials, 2012-12, Vol.41 (12), p.3266-3275

2012

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Pad effects on material-removal rate in chemical-mechanical planarization

Journal of electronic materials, 2002-10, Vol.31 (10), p.1022-1031

2002

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Development and Evaluation of Direct Deposition of Au/Pd(P) Bilayers over Cu Pads in Soldering Applications

Journal of electronic materials, 2012-12, Vol.41 (12), p.3276-3283

2012

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Wetting of Cu Pads by Bi-2.6Ag-xCu Alloys and Phase Equilibria in the Ag-Bi-Cu System

Journal of electronic materials, 2014-12, Vol.43 (12), p.4365-4373

2014

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Effects of Cu and Pd addition on Au bonding wire/Al pad interfacial reactions and bond reliability

Journal of electronic materials, 2006-11, Vol.35 (11), p.2048-2055

2006

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Investigation on Surface Hardening of Polyurethane Pads During Chemical Mechanical Polishing (CMP)

Journal of electronic materials, 2010-03, Vol.39 (3), p.338-346

2010

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Effect of Thermal Aging on Drop Performance of Chip Scale Packages with SnAgCu Solder Joints on Cu Pads

Journal of electronic materials, 2007-12, Vol.36 (12), p.1679-1690

2007

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Encapsulated Thermoelectric Modules and Compliant Pads for Advanced Thermoelectric Systems

Journal of electronic materials, 2010-09, Vol.39 (9), p.1418-1421

2010

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Morphology and pull strength of Sn-Ag(-Co) solder joint with copper pad

Journal of electronic materials, 2007-09, Vol.36 (9), p.1137-1143

2007

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Observations of IMC Formation for Au Wire Bonds to Al Pads

Journal of electronic materials, 2012-04, Vol.41 (4), p.748-756

2012

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Effect of process conditions on uniformity of velocity and wear distance of pad and wafer during chemical mechanical planarization

Journal of electronic materials, 2004, Vol.33 (1), p.53-60

2004

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Electroless Ni/immersion Au interconnects: Investigation of black pad in wire bonds and solder joints

Journal of electronic materials, 2001-09, Vol.30 (9), p.1262-1270

2001

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Localized Multi-axis Loading Impact on Interconnect Thermal Cycling Performance in Via-in-Pad Plated Over (VIPPO) Board Configuration

Influence of Pad Surface Finish on the Microstructure Evolution and Intermetallic Compound Growth in Homogeneous Sn-Bi and Sn-Bi-Ag Solder Interconnects

Superior Reliability of SAC105 Solder on BGA Package Pad with NiPdAu Coating

Effect of Ag Additives on the Consumption of a Cathode Cu Pad in a Cu/Sn3.5Ag/Cu Flip-Chip Structure Under Electromigration

A Technology for Bonding Cu Wires with Cu Pads: Structure and Electrical Fatigue Mechanism of Fine Micro-alloyed Cu Wires

Solid–Solid Reaction Between Sn-3Ag-0.5Cu Alloy and Au/Pd(P)/Ni(P) Metallization Pad with Various Pd(P) Thicknesses

The Intermetallic Compound Formation for the Wire Bond Between an Al Pad and Ag-xPd Alloy Wire

Black Pad Susceptibility of the Electroless Ni Films on the Cu UBM

Effects of PCB Pad Metal Finishes on the Cu-Pillar/Sn-Ag Micro Bump Joint Reliability of Chip-on-Board (COB) Assembly

Development of a Novel Polishing Pad with a Phyllotactic Pattern, and Experimental Studies

The Evolution of IMCs in Single Crystal Sn3.0Ag0.5Cu and Sn3.0Ag3.0Bi3.0In BGA Solder Joints with Au/Ni/Cu Pads Under Current Stressing

Experimental Evaluation of the Effect of Pad Debris Size on Microscratches during CMP Process

Effect of Metal Bond-Pad Configurations on the Solder Microstructure Development of Flip-Chip Solder Joints

Gold- and Palladium-Induced Embrittlement Phenomenon in Microbumps with Au/Pd(P)/Ni(P) Metallization Pads

Pad effects on material-removal rate in chemical-mechanical planarization

Development and Evaluation of Direct Deposition of Au/Pd(P) Bilayers over Cu Pads in Soldering Applications

Wetting of Cu Pads by Bi-2.6Ag-xCu Alloys and Phase Equilibria in the Ag-Bi-Cu System

Effects of Cu and Pd addition on Au bonding wire/Al pad interfacial reactions and bond reliability

Investigation on Surface Hardening of Polyurethane Pads During Chemical Mechanical Polishing (CMP)

Effect of Thermal Aging on Drop Performance of Chip Scale Packages with SnAgCu Solder Joints on Cu Pads

Encapsulated Thermoelectric Modules and Compliant Pads for Advanced Thermoelectric Systems

Morphology and pull strength of Sn-Ag(-Co) solder joint with copper pad

Observations of IMC Formation for Au Wire Bonds to Al Pads

Effect of process conditions on uniformity of velocity and wear distance of pad and wafer during chemical mechanical planarization

Electroless Ni/immersion Au interconnects: Investigation of black pad in wire bonds and solder joints

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