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Early Detection of Parkinson's Disease Using Deep Learning and Machine Learning

IEEE access, 2020-01, Vol.8, p.1-1

2020

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Wind Power Prediction Using Ensemble Learning-Based Models

IEEE access, 2020, Vol.8, p.61517-61527

2020

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Deep learning STEM-EDX tomography of nanocrystals

Nature machine intelligence, 2021-03, Vol.3 (3), p.267-274

2021

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Recent Advances in Smart Tactile Sensory Systems with Brain‐Inspired Neural Networks

Advanced intelligent systems, 2024-04, Vol.6 (4), p.n/a

2024

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Detection and analysis of shaft misalignment in application of production and logistics systems using motor current signature analysis

Expert systems with applications, 2023-05, Vol.217, p.119463, Article 119463

2023

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Exploiting spatial sparsity for estimating channels of hybrid MIMO systems in millimeter wave communications

2014 IEEE Global Communications Conference, 2014, p.3326-3331

2014

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Empirical mode decomposition and Hilbert–Huang transform-based eccentricity fault detection and classification with demagnetization in 120 kW interior permanent magnet synchronous motors

Expert systems with applications, 2024-05, Vol.241, p.122515, Article 122515

2024

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Low dimensional multiuser detection exploiting low user activity

Journal of Communications and Networks, 2013, 15(3), , pp.283-291

2013

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Congestion-aware dynamic routing in automated material handling systems

Computers & industrial engineering, 2014-04, Vol.70, p.176-182

2014

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MasKGrasp: Mask-based Grasping for Scenes with Multiple General Real-world Objects

2022 IEEE/RSJ International Conference on Intelligent Robots and Systems (IROS), 2022, p.3137-3144

2022

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EventVLAD: Visual Place Recognition with Reconstructed Edges from Event Cameras

2021 IEEE/RSJ International Conference on Intelligent Robots and Systems (IROS), 2021, p.2247-2252

2021

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Exploiting Sparsity for Multiple Relay Selection with Relay Gain Control in Large AF Relay Networks

IEEE wireless communications letters, 2013-06, Vol.2 (3), p.347-350

2013

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Automatic diagnosis and correction of logical errors for functional programming assignments

Proceedings of ACM on programming languages, 2018-11, Vol.2 (OOPSLA), p.1-30

2018

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GATSBI: Generative Agent-centric Spatio-temporal Object Interaction

2021 IEEE/CVF Conference on Computer Vision and Pattern Recognition (CVPR), 2021, p.3073-3082

2021

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eCDT: Event Clustering for Simultaneous Feature Detection and Tracking

2022 IEEE/RSJ International Conference on Intelligent Robots and Systems (IROS), 2022, p.3808-3815

2022

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Channel estimation via oblique matching pursuit for FDD massive MIMO downlink

2015 IEEE International Conference on Communication Workshop (ICCW), 2015, p.1060-1064

2015

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Non-contact wafer-level TSV connectivity test methodology using magnetic coupling

2013 IEEE International 3D Systems Integration Conference (3DIC), 2013, p.1-4

2013

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Through-silicon via (TSV) depletion effect

2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems, 2011, p.101-104

2011

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Vertical tree 3-dimensional TSV clock distribution network in 3D IC

2012 IEEE 62nd Electronic Components and Technology Conference, 2012, p.1945-1950

2012

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Thermal effects on through-silicon via (TSV) signal integrity

2012 IEEE 62nd Electronic Components and Technology Conference, 2012, p.816-821

2012

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Eye-diagram simulation and analysis of a high-speed TSV-based channel

2013 IEEE International 3D Systems Integration Conference (3DIC), 2013, p.1-7

2013

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Temperature-dependent through-silicon via (TSV) model and noise coupling

2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems, 2011, p.247-250

2011

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Nonlinear effects of TSV and harmonic generation

2012 IEEE 62nd Electronic Components and Technology Conference, 2012, p.834-838

2012

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A Wideband Capacity Maximization Approach for CSI Feedback in Frequency Selective Channels

GLOBECOM 2022 - 2022 IEEE Global Communications Conference, 2022, p.5935-5940

2022

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Distributed multi TSV 3D clock distribution network in TSV-based 3D IC

2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems, 2011, p.87-90

2011

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Early Detection of Parkinson's Disease Using Deep Learning and Machine Learning

Wind Power Prediction Using Ensemble Learning-Based Models

Deep learning STEM-EDX tomography of nanocrystals

Recent Advances in Smart Tactile Sensory Systems with Brain‐Inspired Neural Networks

Detection and analysis of shaft misalignment in application of production and logistics systems using motor current signature analysis

Exploiting spatial sparsity for estimating channels of hybrid MIMO systems in millimeter wave communications

Empirical mode decomposition and Hilbert–Huang transform-based eccentricity fault detection and classification with demagnetization in 120 kW interior permanent magnet synchronous motors

Low dimensional multiuser detection exploiting low user activity

Congestion-aware dynamic routing in automated material handling systems

MasKGrasp: Mask-based Grasping for Scenes with Multiple General Real-world Objects

EventVLAD: Visual Place Recognition with Reconstructed Edges from Event Cameras

Exploiting Sparsity for Multiple Relay Selection with Relay Gain Control in Large AF Relay Networks

Automatic diagnosis and correction of logical errors for functional programming assignments

GATSBI: Generative Agent-centric Spatio-temporal Object Interaction

eCDT: Event Clustering for Simultaneous Feature Detection and Tracking

Channel estimation via oblique matching pursuit for FDD massive MIMO downlink

Non-contact wafer-level TSV connectivity test methodology using magnetic coupling

Through-silicon via (TSV) depletion effect

Vertical tree 3-dimensional TSV clock distribution network in 3D IC

Thermal effects on through-silicon via (TSV) signal integrity

Eye-diagram simulation and analysis of a high-speed TSV-based channel

Temperature-dependent through-silicon via (TSV) model and noise coupling

Nonlinear effects of TSV and harmonic generation

A Wideband Capacity Maximization Approach for CSI Feedback in Frequency Selective Channels

Distributed multi TSV 3D clock distribution network in TSV-based 3D IC

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