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Chemistry of materials, 2018-06, Vol.30 (12), p.4001-4007
2018
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AIP advances, 2021-12, Vol.11 (12), p.125225-125225-8
2021
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Applied physics letters, 2020-10, Vol.117 (17)
2020
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SID International Symposium Digest of technical papers, 2021-08, Vol.52 (S2), p.231-233
2021
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AIP advances, 2018-11, Vol.8 (11), p.115327-115327-11
2018
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Applied physics letters, 2006-08, Vol.89 (7)
2006
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2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA), 2019, p.1-4
2019
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2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA), 2018, p.1-4
2018
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2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA), 2017, p.1-4
2017
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AIP advances, 2012-03, Vol.2 (1), p.012132-012132-12
2012
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Application of deuterium oxide (D2O) isotope tracing technique for encapsulated QFN failure analysis
2022
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Applied physics letters, 2020-10, Vol.117 (17)
2020
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2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC), 2020, p.63-67
2020
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2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA), 2019, p.1-4
2019
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Chemistry of materials, 2018-06, Vol.30 (12), p.4001-4007
2018
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2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA), 2019, p.1-5
2019
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Journal of trace and microprobe techniques, 2003-01, Vol.21 (1), p.25-34
2003
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2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA), 2018, p.1-5
2018
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2018 19th International Conference on Electronic Packaging Technology (ICEPT), 2018, p.1546-1553
2018
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2020 China Semiconductor Technology International Conference (CSTIC), 2020, p.1-5
2020
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2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA), 2019, p.1-6
2019
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2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA), 2017, p.1-3
2017
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2020 China Semiconductor Technology International Conference (CSTIC), 2020, p.1-8
2020
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Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA), 2014, p.90-93
2014
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2023 24th International Conference on Electronic Packaging Technology (ICEPT), 2023, p.1-3
2023
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