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Characterization of Inkjet Printed MWCNT in Colloidal and Conductive Polymer Solution

2008 10th Electronics Packaging Technology Conference, 2008, p.285-290

2008

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Process Integration of Inkjet Printing and Electroless Plating for LTCC Substrates

2007 9th Electronics Packaging Technology Conference, 2007, p.202-205

2007

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High aspect pattern formation by integration of micro inkjetting and electroless plating

2008 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, 2008, p.162-167

2008

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Identification of inorganic compounds of dust and their effects on electrical contact failure

Electrical Contacts - 1997 Proceedings of the Forty-Third IEEE Holm Conference on Electrical Contacts, 1997, p.315-327

1997

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Effect of selenium on cadmium uptake, translocation and accumulation in rice (Oryza sativa L.)

Selenium Research for Environment and Human Health: Perspectives, Technologies and Advancements, 2020, p.135-136

1, 2020

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Deformation classifying and reconstructing method for smart Geogrid integrated with fiber Bragg grating sensors

Life-Cycle Civil Engineering: Innovation, Theory and Practice, 2021, p.1007-1013

1, 2021

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The elimination efficacy of chelating agent deferiprone on urinary copper, zinc and manganese in aluminum-loaded rabbits

Trace elements and electrolytes, 2004-01, Vol.21 (7), p.174-179

2004

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Characterization of strip induced damage in ultra low-k dielectric

ISSM 2005, IEEE International Symposium on Semiconductor Manufacturing, 2005, 2005, p.183-185

2005

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Effect of ash process on leakage mechanism of Cu/ELK (k=2.5) interconnect for 65/45 nm generation

Proceedings of the IEEE 2005 International Interconnect Technology Conference, 2005, 2005, p.94-96

2005

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Reliability and conduction mechanism study on organic ultra low-k (k=2.2) for 65/45 nm hybrid Cu damascene technology

Proceedings of the IEEE 2005 International Interconnect Technology Conference, 2005, 2005, p.54-56

2005

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Integration of Cu and extra low-k dielectric (k=2.5/spl sim/2.2) for 65/45/32nm generations

IEEE InternationalElectron Devices Meeting, 2005. IEDM Technical Digest, 2005, p.4 pp.-88

2005

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Low k damage control & its reliability for organic hybrid dual damascene

Proceedings of the 11th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2004 (IEEE Cat. No.04TH8743), 2004, p.69-70

2004

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Characterization of Inkjet Printed MWCNT in Colloidal and Conductive Polymer Solution

Process Integration of Inkjet Printing and Electroless Plating for LTCC Substrates

High aspect pattern formation by integration of micro inkjetting and electroless plating

Identification of inorganic compounds of dust and their effects on electrical contact failure

Effect of selenium on cadmium uptake, translocation and accumulation in rice (Oryza sativa L.)

Deformation classifying and reconstructing method for smart Geogrid integrated with fiber Bragg grating sensors

The elimination efficacy of chelating agent deferiprone on urinary copper, zinc and manganese in aluminum-loaded rabbits

Characterization of strip induced damage in ultra low-k dielectric

Effect of ash process on leakage mechanism of Cu/ELK (k=2.5) interconnect for 65/45 nm generation

Reliability and conduction mechanism study on organic ultra low-k (k=2.2) for 65/45 nm hybrid Cu damascene technology

Integration of Cu and extra low-k dielectric (k=2.5/spl sim/2.2) for 65/45/32nm generations

Low k damage control & its reliability for organic hybrid dual damascene

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