UB Paderborn / Katalog / Suche / in CDI

Sortiert nach

Einfacher Volltextzugriff von (fast) überall

Installieren Sie die LibKey Nomad-Browsererweiterung und erhalten Sie von vielen Webseiten einfachen Zugriff auf lizenzierte Volltexte oder Open Access Publikationen. Mehr erfahren...

A critical review on performance, microstructure and corrosion resistance of Pb-free solders

Measurement : journal of the International Measurement Confederation, 2019-02, Vol.134, p.897-907

2019

Volltextzugriff (PDF)

Growth inhibition of interfacial intermetallic compounds by pre-coating oriented Cu6Sn5 grains on Cu substrates

Journal of alloys and compounds, 2017-04, Vol.701, p.533-541

2017

Volltextzugriff (PDF)

Enhancement of the mechanical strength of Sn-3.0Ag-0.5Cu/Ni joints via doping minor Ni into solder alloy

Materials letters, 2019-01, Vol.235, p.180-183

2019

Volltextzugriff (PDF)

Temperature‐dependent fatigue modelling of a novel Ni, Bi and Sb containing Sn‐3.8Ag‐0.7Cu lead‐free solder alloy

Fatigue & fracture of engineering materials & structures, 2020-12, Vol.43 (12), p.2883-2891

2020

Volltextzugriff (PDF)

Interfacial reaction between Sn–Ag–Cu solder and Co–P films with various microstructures

Acta materialia, 2013-07, Vol.61 (12), p.4581-4590

2013

Volltextzugriff (PDF)

Mechanical properties and fracture mechanisms of Sn-3.0Ag-0.5Cu solder alloys and joints at cryogenic temperatures

Materials science & engineering. A, Structural materials : properties, microstructure and processing, 2017-01, Vol.684, p.697-705

2017

Volltextzugriff (PDF)

Viscoplastic characterization and post-rupture microanalysis of a novel lead-free solder with small additions of Bi, Sb and Ni

Journal of alloys and compounds, 2017-02, Vol.694, p.892-904

2017

Volltextzugriff (PDF)

Modeling of intergranular thermal fatigue cracking of a lead-free solder joint in a power electronic module

International journal of solids and structures, 2017-02, Vol.106-107, p.1-12

2017

Volltextzugriff (PDF)

Reactive wetting, evolution of interfacial and bulk IMCs and their effect on mechanical properties of eutectic Sn–Cu solder alloy

Advances in colloid and interface science, 2011-08, Vol.166 (1), p.87-118

2011

Volltextzugriff (PDF)

Interfacial IMC growth of SAC305/Cu joint with a novel dual-layer of Ni(P)/Cu plating during solid-state aging

Microelectronic engineering, 2018-11, Vol.199, p.69-79

2018

Volltextzugriff (PDF)

Effect of temperature on the fracture behavior of Cu/SAC305/Cu solder joints

Engineering fracture mechanics, 2018-08, Vol.199, p.730-738

2018

Volltextzugriff (PDF)

Distribution and Microstructure Analysis of Ceramic Particles in the Lead‐Free Solder Matrix

Crystal research and technology (1979), 2020-12, Vol.55 (12), p.n/a

2020

Volltextzugriff (PDF)

Improving the performance of lead-free solder reinforced with multi-walled carbon nanotubes

Materials science & engineering. A, Structural materials : properties, microstructure and processing, 2006-05, Vol.423 (1), p.166-169

2006

Volltextzugriff (PDF)

Effect of Sb content on properties of Sn—Bi solders

Transactions of Nonferrous Metals Society of China, 2014-01, Vol.24 (1), p.184-191

2014

Volltextzugriff (PDF)

Influence of Joining Conditions on Bonding Strength of Joints: Efficacy of Low-Temperature Bonding Using Cu Nanoparticle Paste

Journal of electronic materials, 2013-06, Vol.42 (6), p.1260-1267

2013

Volltextzugriff (PDF)

Study on Subgrain Rotation Behavior at Different Interfaces of a Solder Joint During Thermal Shock

Journal of electronic materials, 2016-12, Vol.45 (12), p.6086-6094

2016

Volltextzugriff (PDF)

Nonlinear finite element simulations on the mechanical response of the isothermally aged lead-free solders

Proceedings of the Institution of Mechanical Engineers. Part L, Journal of materials, design and applications, 2023-11, Vol.237 (11), p.2421-2431

Gharaibeh, Mohammad A

2023

Volltextzugriff (PDF)

Electromigration Damage Characterization in Sn-3.9Ag-0.7Cu and Sn-3.9Ag-0.7Cu-0.5Ce Solder Joints by Three-Dimensional X-ray Tomography and Scanning Electron Microscopy

Journal of electronic materials, 2014-01, Vol.43 (1), p.33-42

2014

Volltextzugriff (PDF)

Obtaining and Characterization of New Materials

Sandu, Andrei Victor

2022

Volltextzugriff (PDF)

Study of the Si-containing amorphous layer by electrical discharge coating: Wettability and Erosion Resistance of the Si-containing amorphous layer for Lead-free solder

Journal of the Japan Society for Precision Engineering, 2012/11/05, Vol.78(11), pp.970-974

2012

Volltextzugriff (PDF)

Effects of small addition of Ag and/or Cu on the microstructure and properties of Sn–9Zn lead-free solders

Materials science & engineering. A, Structural materials : properties, microstructure and processing, 2010-07, Vol.527 (20), p.5212-5219

2010

Volltextzugriff (PDF)

Effect of Ag, Ni and Bi Additions on Solderability of Lead-Free Solders

Journal of electronic materials, 2017-07, Vol.46 (7), p.4076-4084

2017

Volltextzugriff (PDF)

Effects of Metallic Nanoparticles on Interfacial Intermetallic Compounds in Tin-Based Solders for Microelectronic Packaging

Journal of electronic materials, 2017-10, Vol.46 (10), p.5503-5518

2017

Volltextzugriff (PDF)

Mechanical Characterization of Lead-Free Sn-Ag-Cu Solder Joints by High-Temperature Nanoindentation

Journal of electronic materials, 2013-06, Vol.42 (6), p.1085-1091

2013

Volltextzugriff (PDF)

Cracking and phase stability in reaction layers between Sn-Cu-Ni solders and Cu substrates

JOM (1989), 2009-06, Vol.61 (6), p.45-51

2009

Volltextzugriff (PDF)

1 – 25 von 4.489

Suche als RSS-Feed

Aktive Filter

Nur zeigenMit Volltextzugriff

Suchergebnisse filtern

Filter anzeigen

Nur zeigen

Geprüft (Peer-Review)
(3.158)

Publikationsform

4 weitere anzeigen...

Weniger anzeigen...

Sprache

4 weitere anzeigen...

Weniger anzeigen...

Erscheinungsjahr

n.n

Thema

Science & Technology
(2.927)
Technology
(2.819)
Materials Science
(2.302)
Materials Science, Multidisciplinary
(2.150)
Solders
(1.616)
Engineering
(1.614)
Lead-Free Solder
(1.537)
Engineering, Electrical & Electronic
(1.367)
Lead Free
(1.360)
Physical Sciences
(1.359)
Physics
(1.183)
Tin
(993)
Metallurgy & Metallurgical Engineering
(980)
Physics, Applied
(974)
Lead Free Solders
(939)
Exact Sciences And Technology
(877)
Soldering
(860)
Intermetallic Compounds
(859)
Microstructure
(846)
Copper
(828)

15 weitere anzeigen...

Weniger anzeigen...

Neu hinzugefügt

Menü

Weitere Dienste

Einstellungen

A critical review on performance, microstructure and corrosion resistance of Pb-free solders

Growth inhibition of interfacial intermetallic compounds by pre-coating oriented Cu6Sn5 grains on Cu substrates

Enhancement of the mechanical strength of Sn-3.0Ag-0.5Cu/Ni joints via doping minor Ni into solder alloy

Temperature‐dependent fatigue modelling of a novel Ni, Bi and Sb containing Sn‐3.8Ag‐0.7Cu lead‐free solder alloy

Interfacial reaction between Sn–Ag–Cu solder and Co–P films with various microstructures

Mechanical properties and fracture mechanisms of Sn-3.0Ag-0.5Cu solder alloys and joints at cryogenic temperatures

Viscoplastic characterization and post-rupture microanalysis of a novel lead-free solder with small additions of Bi, Sb and Ni

Modeling of intergranular thermal fatigue cracking of a lead-free solder joint in a power electronic module

Reactive wetting, evolution of interfacial and bulk IMCs and their effect on mechanical properties of eutectic Sn–Cu solder alloy

Interfacial IMC growth of SAC305/Cu joint with a novel dual-layer of Ni(P)/Cu plating during solid-state aging

Effect of temperature on the fracture behavior of Cu/SAC305/Cu solder joints

Distribution and Microstructure Analysis of Ceramic Particles in the Lead‐Free Solder Matrix

Improving the performance of lead-free solder reinforced with multi-walled carbon nanotubes

Effect of Sb content on properties of Sn—Bi solders

Influence of Joining Conditions on Bonding Strength of Joints: Efficacy of Low-Temperature Bonding Using Cu Nanoparticle Paste

Study on Subgrain Rotation Behavior at Different Interfaces of a Solder Joint During Thermal Shock

Nonlinear finite element simulations on the mechanical response of the isothermally aged lead-free solders

Electromigration Damage Characterization in Sn-3.9Ag-0.7Cu and Sn-3.9Ag-0.7Cu-0.5Ce Solder Joints by Three-Dimensional X-ray Tomography and Scanning Electron Microscopy

Obtaining and Characterization of New Materials

Study of the Si-containing amorphous layer by electrical discharge coating: Wettability and Erosion Resistance of the Si-containing amorphous layer for Lead-free solder

Effects of small addition of Ag and/or Cu on the microstructure and properties of Sn–9Zn lead-free solders

Effect of Ag, Ni and Bi Additions on Solderability of Lead-Free Solders

Effects of Metallic Nanoparticles on Interfacial Intermetallic Compounds in Tin-Based Solders for Microelectronic Packaging

Mechanical Characterization of Lead-Free Sn-Ag-Cu Solder Joints by High-Temperature Nanoindentation

Cracking and phase stability in reaction layers between Sn-Cu-Ni solders and Cu substrates

Aktive Filter

Suchergebnisse filtern