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Large Thermoelectric Figure-of-Merits from SiGe Nanowires by Simultaneously Measuring Electrical and Thermal Transport Properties

Nano letters, 2012-06, Vol.12 (6), p.2918-2923

2012

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Low cycle fatigue behavior of alloy 690 in simulated PWR water—Effects of dynamic strain aging and hydrogen

Materials science & engineering. A, Structural materials : properties, microstructure and processing, 2014-08, Vol.611, p.37-44

2014

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Enhanced mechanical properties of spark plasma sintered NiTi composites reinforced with carbon nanotubes

Journal of alloys and compounds, 2014-12, Vol.617, p.505-510

2014

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Photopatternable Quantum Dots Forming Quasi-Ordered Arrays

Nano letters, 2010-07, Vol.10 (7), p.2310-2317

2010

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Double-Stacked EBG Structure for Wideband Suppression of Simultaneous Switching Noise in LTCC-Based SiP Applications

IEEE microwave and wireless components letters, 2006-09, Vol.16 (9), p.481-483

2006

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IEEE_Xplore

Measurement and Analysis of a High-Speed TSV Channel

IEEE transactions on components, packaging, and manufacturing technology (2011), 2012-10, Vol.2 (10), p.1672-1685

2012

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IEEE_Xplore

High dielectric constant thin film EBG power/ground network for broad-band suppression of SSN and radiated emissions

IEEE microwave and wireless components letters, 2005-08, Vol.15 (8), p.505-507

2005

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IEEE_Xplore

Modeling and Analysis of a Power Distribution Network in TSV-Based 3-D Memory IC Including P/G TSVs, On-Chip Decoupling Capacitors, and Silicon Substrate Effects

IEEE transactions on components, packaging, and manufacturing technology (2011), 2012-12, Vol.2 (12), p.2057-2070

2012

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IEEE_Xplore

Modeling on the size dependent properties of InP quantum dots: a hybrid functional study

Nanotechnology, 2013-05, Vol.24 (21), p.215201-215201

2013

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Modeling and Measurement of Interlevel Electromagnetic Coupling and Fringing Effect in a Hierarchical Power Distribution Network Using Segmentation Method With Resonant Cavity Model

IEEE transactions on advanced packaging, 2008-08, Vol.31 (3), p.544-557

2008

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IEEE_Xplore

Modeling and call admission control algorithm of variable bit rate video in ATM networks

IEEE journal on selected areas in communications, 1994-02, Vol.12 (2), p.332-344

1994

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IEEE_Xplore

PDN Impedance Modeling and Analysis of 3D TSV IC by Using Proposed P/G TSV Array Model Based on Separated P/G TSV and Chip-PDN Models : THROUGH SILICON VIAS

IEEE transactions on components, packaging, and manufacturing technology (2011), 2011, Vol.1 (1-2), p.208-219

2011

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Modeling and Analysis of Through-Silicon Via (TSV) Noise Coupling and Suppression Using a Guard Ring : THROUGH SILICON VIAS

IEEE transactions on components, packaging, and manufacturing technology (2011), 2011, Vol.1 (1-2), p.220-233

2011

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High-Frequency Scalable Electrical Model and Analysis of a Through Silicon Via (TSV) : THROUGH SILICON VIAS

IEEE transactions on components, packaging, and manufacturing technology (2011), 2011, Vol.1 (1-2), p.181-195

2011

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An adapting weight rerouting algorithm for handoff control in wireless ATM networks

Lecture notes in computer science, 2002, p.103-113

2002

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Compensation of ESD and device input capacitance by using embedded inductor on PCB substrate for 3 Gbps SerDes applications

2004 International Symposium on Electromagnetic Compatibility (IEEE Cat. No.04CH37559), 2004, Vol.2, p.499-504 vol.2

2004

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IEEE_Xplore

Microwave frequency interconnection line model of a wafer level package

IEEE transactions on advanced packaging, 2002-08, Vol.25 (3), p.356-364

2002

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IEEE_Xplore

Over GHz electrical circuit model of a high-density multiple line grid array (MLGA) interposer

IEEE transactions on advanced packaging, 2003-02, Vol.26 (1), p.90-98

2003

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IEEE_Xplore

Efficiency of Differential Signaling on Cavity Noise Suppression in Applications with Refemce Plane Change

2004

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A Robot Joint With Variable Stiffness Using Leaf Springs

IEEE transactions on robotics, 2011-04, Vol.27 (2), p.229-238

2011

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IEEE_Xplore

Facets of simplicity for the smartphone interface: A structural model

International journal of human-computer studies, 2012-02, Vol.70 (2), p.129-142

2012

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One-pass antibacterial efficacy of bipolar air ions against aerosolized Staphylococcus epidermidis in a duct flow

Journal of aerosol science, 2014-03, Vol.69, p.71-81

2014

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Characterization of sprayed CuInS2 films by XRD and Raman spectroscopy measurements

Thin solid films, 2010-09, Vol.518 (22), p.6537-6541

2010

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Finite-element-based system reliability analysis of fatigue-induced sequential failures

Reliability engineering & system safety, 2012-12, Vol.108, p.131-141

2012

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Structural and mechanical properties of DLC films prepared by bipolar PBII&D

Diamond and related materials, 2011-05, Vol.20 (5), p.845-848

2011

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Large Thermoelectric Figure-of-Merits from SiGe Nanowires by Simultaneously Measuring Electrical and Thermal Transport Properties

Low cycle fatigue behavior of alloy 690 in simulated PWR water—Effects of dynamic strain aging and hydrogen

Enhanced mechanical properties of spark plasma sintered NiTi composites reinforced with carbon nanotubes

Photopatternable Quantum Dots Forming Quasi-Ordered Arrays

Double-Stacked EBG Structure for Wideband Suppression of Simultaneous Switching Noise in LTCC-Based SiP Applications

Measurement and Analysis of a High-Speed TSV Channel

High dielectric constant thin film EBG power/ground network for broad-band suppression of SSN and radiated emissions

Modeling and Analysis of a Power Distribution Network in TSV-Based 3-D Memory IC Including P/G TSVs, On-Chip Decoupling Capacitors, and Silicon Substrate Effects

Modeling on the size dependent properties of InP quantum dots: a hybrid functional study

Modeling and Measurement of Interlevel Electromagnetic Coupling and Fringing Effect in a Hierarchical Power Distribution Network Using Segmentation Method With Resonant Cavity Model

Modeling and call admission control algorithm of variable bit rate video in ATM networks

PDN Impedance Modeling and Analysis of 3D TSV IC by Using Proposed P/G TSV Array Model Based on Separated P/G TSV and Chip-PDN Models : THROUGH SILICON VIAS

Modeling and Analysis of Through-Silicon Via (TSV) Noise Coupling and Suppression Using a Guard Ring : THROUGH SILICON VIAS

High-Frequency Scalable Electrical Model and Analysis of a Through Silicon Via (TSV) : THROUGH SILICON VIAS

An adapting weight rerouting algorithm for handoff control in wireless ATM networks

Compensation of ESD and device input capacitance by using embedded inductor on PCB substrate for 3 Gbps SerDes applications

Microwave frequency interconnection line model of a wafer level package

Over GHz electrical circuit model of a high-density multiple line grid array (MLGA) interposer

Efficiency of Differential Signaling on Cavity Noise Suppression in Applications with Refemce Plane Change

A Robot Joint With Variable Stiffness Using Leaf Springs

Facets of simplicity for the smartphone interface: A structural model

One-pass antibacterial efficacy of bipolar air ions against aerosolized Staphylococcus epidermidis in a duct flow

Characterization of sprayed CuInS2 films by XRD and Raman spectroscopy measurements

Finite-element-based system reliability analysis of fatigue-induced sequential failures

Structural and mechanical properties of DLC films prepared by bipolar PBII&D

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