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Quality Evaluation Method for Chest X-Ray Images using the Reference Patterns

2022 IEEE 4th International Conference on Artificial Intelligence Circuits and Systems (AICAS), 2022, p.266-269

2022

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Ciliated muconodular papillary tumor of the lung with cavitary change: A case report with 11-year preoperative follow-up

Thoracic cancer, 2022, Vol.13 (12), p.1866-1869

2022

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A Neural Text-to-Speech Model Utilizing Broadcast Data Mixed with Background Music

ICASSP 2021 - 2021 IEEE International Conference on Acoustics, Speech and Signal Processing (ICASSP), 2021, p.6603-6607

2021

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Stroke Revisited: Diabetes in Stroke

2021

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A 16Gb 27Gb/s/pin T-coil based GDDR6 DRAM with Merged-MUX TX, Optimized WCK Operation, and Alternative-Data-Bus

2022 IEEE International Solid- State Circuits Conference (ISSCC), 2022, Vol.65, p.446-448

2022

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Design, packaging, and architectural policy co-optimization for DC power integrity in 3D DRAM

2015 52nd ACM/EDAC/IEEE Design Automation Conference (DAC), 2015, p.1-6

2015

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Defect Analysis and Cost-Effective Resilience Architecture for Future DRAM Devices

2017 IEEE International Symposium on High Performance Computer Architecture (HPCA), 2017, p.61-72

2017

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Highly reliable vertical NAND technology with biconcave shaped storage layer and leakage controllable offset structure

2010 Symposium on VLSI Technology, 2010, p.173-174

2010

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A highly manufacturable integration technology of 20nm generation 64Gb multi-level NAND flash memory

2011 Symposium on VLSI Technology - Digest of Technical Papers, 2011, p.70-71

2011

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Highly Scalable Saddle-Fin (S-Fin) Transistor for Sub-50nm DRAM Technology

2006 Symposium on VLSI Technology, 2006. Digest of Technical Papers, 2006, p.32-33

2006

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Optimization of control gate material and structure for enhancing 20nm 64Gb NAND flash reliability

Proceedings of Technical Program of 2012 VLSI Technology, System and Application, 2012, p.1-2

2012

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Implementation of fully isolated Low Vgs nLDMOS with low specific on-resistance

2011 IEEE 23rd International Symposium on Power Semiconductor Devices and ICs, 2011, p.24-27

2011

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7.2 A 128Gb 3b/cell V-NAND flash memory with 1Gb/s I/O rate

2015 IEEE International Solid State Circuits Conference (ISSCC), 2015, p.1-3

2015

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IEEE_Xplore

A Novel Simulation Methodology Reflecting System Power Scenario using a Markov-Chain-based Stochastic Random Power Model

2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 2022, p.929-936

2022

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Gate-first high-k/metal gate DRAM technology for low power and high performance products

2015 IEEE International Electron Devices Meeting (IEDM), 2015, p.26.6.1-26.6.4

2015

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Implementation of PHY module for personal and portable Cognitive Radio devices

2011 IEEE International Conference on Consumer Electronics (ICCE), 2011, p.451-452

2011

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PVT-invariant single-to-differential data converter with minimum skew and duty-ratio distortion

2008 IEEE International Symposium on Circuits and Systems, 2008, p.1902-1905

2008

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Using Depth Information for Real-Time Face Detection

HCI International 2014 - Posters’ Extended Abstracts, p.480-483

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Inherent Issues and Challenges of Program Disturbance of 3D NAND Flash Cell

2012 4th IEEE International Memory Workshop, 2012, p.1-4

2012

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Non thermal microplasma jet array for wound healing

2012 Abstracts IEEE International Conference on Plasma Science, 2012, p.2E-4-2E-4

2012

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Reversed Arterial and Venous Flow in Free-Flap Surgery for Leg Reconstruction

Journal of Reconstructive Microsurgery, 2006, Vol.22 (4)

2006

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Sural Artery Flap, Distally or Proximally Based

Journal of Reconstructive Microsurgery, 2006, Vol.22 (4)

2006

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Development of Digital Signage Modules composed of Mini-LEDs using Laser-Assisted Bonding (LAB) Technology

2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 2020, p.1031-1036

2020

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IEEE_Xplore

Efficient Uplink Scheduler Architecture of Subscriber Station in IEEE 802.16 System

Embedded and Ubiquitous Computing – EUC 2005 Workshops, 2005, p.734-743

2005

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Low Voltage and High Speed 1Xnm 1T1C FE-RAM with Ultra-Thin 5nm HZO

2021 IEEE International Electron Devices Meeting (IEDM), 2021, p.33.3.1-33.3.4

2021

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IEEE_Xplore

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Quality Evaluation Method for Chest X-Ray Images using the Reference Patterns

Ciliated muconodular papillary tumor of the lung with cavitary change: A case report with 11-year preoperative follow-up

A Neural Text-to-Speech Model Utilizing Broadcast Data Mixed with Background Music

Stroke Revisited: Diabetes in Stroke

A 16Gb 27Gb/s/pin T-coil based GDDR6 DRAM with Merged-MUX TX, Optimized WCK Operation, and Alternative-Data-Bus

Design, packaging, and architectural policy co-optimization for DC power integrity in 3D DRAM

Defect Analysis and Cost-Effective Resilience Architecture for Future DRAM Devices

Highly reliable vertical NAND technology with biconcave shaped storage layer and leakage controllable offset structure

A highly manufacturable integration technology of 20nm generation 64Gb multi-level NAND flash memory

Highly Scalable Saddle-Fin (S-Fin) Transistor for Sub-50nm DRAM Technology

Optimization of control gate material and structure for enhancing 20nm 64Gb NAND flash reliability

Implementation of fully isolated Low Vgs nLDMOS with low specific on-resistance

7.2 A 128Gb 3b/cell V-NAND flash memory with 1Gb/s I/O rate

A Novel Simulation Methodology Reflecting System Power Scenario using a Markov-Chain-based Stochastic Random Power Model

Gate-first high-k/metal gate DRAM technology for low power and high performance products

Implementation of PHY module for personal and portable Cognitive Radio devices

PVT-invariant single-to-differential data converter with minimum skew and duty-ratio distortion

Using Depth Information for Real-Time Face Detection

Inherent Issues and Challenges of Program Disturbance of 3D NAND Flash Cell

Non thermal microplasma jet array for wound healing

Reversed Arterial and Venous Flow in Free-Flap Surgery for Leg Reconstruction

Sural Artery Flap, Distally or Proximally Based

Development of Digital Signage Modules composed of Mini-LEDs using Laser-Assisted Bonding (LAB) Technology

Efficient Uplink Scheduler Architecture of Subscriber Station in IEEE 802.16 System

Low Voltage and High Speed 1Xnm 1T1C FE-RAM with Ultra-Thin 5nm HZO

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