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Fast tomography projection x-ray microscopy and transmission x-ray microscopy beamline at TPS of NSRRC

AIP Conference Proceedings, 2023, Vol.2990 (1)

2023

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The Effects of Quest Types and Gaming Motivations on Players’ Knowledge Acquisitions in an Online Role-Playing Game Environment

Human-Computer Interaction. Interacting in Various Application Domains, p.353-358

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Edge Termination Structures for 3.3 kV 4H-SiC Devices

2020 IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia), 2020, p.1-4

2020

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TSV-free FinFET-based Monolithic 3D+-IC with computing-in-memory SRAM cell for intelligent IoT devices

2017 IEEE International Electron Devices Meeting (IEDM), 2017, p.12.6.1-12.6.4

2017

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The Design of Quasi-Super Junction and Novel Edge Termination in Junction Barrier Schottky Diode

2019 IEEE 4th International Future Energy Electronics Conference (IFEEC), 2019, p.1-4

2019

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A Flexible Anti-Jamming Channel Hopping for Cognitive Radio Networks

2018 Sixth International Symposium on Computing and Networking Workshops (CANDARW), 2018, p.549-551

2018

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Ultra-Low Power 3D NC-FinFET-based Monolithic 3D+ -IC with Computing-in-Memory for Intelligent IoT Devices

2018 IEEE International Electron Devices Meeting (IEDM), 2018, p.15.1.1-15.1.4

2018

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Bit-Cost-Scalable 3D DRAM Architecture and Unit Cell First Demonstrated with Integrated Gate-Around and Channel-Around IGZO FETs

2024 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), 2024, p.1-2

2024

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Enabling low power BEOL compatible monolithic 3D+ nanoelectronics for IoTs using local and selective far-infrared ray laser anneal technology

2015 IEEE International Electron Devices Meeting (IEDM), 2015, p.8.7.1-8.7.4

2015

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High performance poly Si junctionless transistors with sub-5nm conformally doped layers by molecular monolayer doping and microwave incorporating CO2 laser annealing for 3D stacked ICs applications

2015 IEEE International Electron Devices Meeting (IEDM), 2015, p.6.2.1-6.2.4

2015

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3DIC with Stacked FinFET, Inter-Level Metal, and Field-Size ( \mathbf\times \mathbf\mathbf^}) Single-Crystalline Si on SiO2 by Elevated-Epi

2024 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), 2024, p.1-2

2024

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Distributed dynamic-TDD resource allocation in femtocell networks using evolutionary game

2015 IEEE 26th Annual International Symposium on Personal, Indoor, and Mobile Radio Communications (PIMRC), 2015, p.1157-1162

2015

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Record-high 121/62 μA/μm on-currents 3D stacked epi-like Si FETs with and without metal back gate

2013 IEEE International Electron Devices Meeting, 2013, p.29.6.1-29.6.4

2013

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Ultrahigh Responsivity and Tunable Photogain BEOL Compatible MoS2 Phototransistor Array for Monolithic 3D Image Sensor with Block-Level Sensing Circuits

2020 IEEE Symposium on VLSI Technology, 2020, p.1-2

2020

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A novel 3D IC assembly process for ultra-thin chip stacking

2014 International Conference on Electronics Packaging (ICEP), 2014, p.470-474

2014

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Quorum-Based Energy Saving MAC Protocol Design for Wireless Sensor Networks

2008 IEEE/IFIP International Conference on Embedded and Ubiquitous Computing, 2008, Vol.1, p.316-322

2008

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Development of the Motivation and Engagement in Virtual Reality Chinese Language Learning Questionnaire (MEVRCLQ)

2020 International Symposium on Educational Technology (ISET), 2020, p.67-72

2020

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A context-aware handoff scheme and all-ip mobile multicast service for heterogeneous wireless networks

2009 International Conference on Ultra Modern Telecommunications & Workshops, 2009, p.1-7

2009

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Enabling monolithic 3D image sensor using large-area monolayer transition metal dichalcogenide and logic/memory hybrid 3D+IC

2016 IEEE Symposium on VLSI Technology, 2016, p.1-2

2016

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An integrated microfluidic system for diagnosis of quinolones resistance of helicobacter pylori

2014 IEEE 27th International Conference on Micro Electro Mechanical Systems (MEMS), 2014, p.821-824

2014

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LRPBlog - Applying Blog to Learner's Participation Theory for Mutual Communication of E-Learning

2009 International Conference on Management and Service Science, 2009, p.1-4

2009

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Lactate peak in muscle disclosed by magnetic resonance spectroscopy in a patient with CPEO-plus syndrome

eNeurologicalSci, 2021, Vol.24, p.100360-100360

2021

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Thymidine Kinase 2 Deficiency-Induced Adult-Onset Ptosis and Proximal Weakness

Neurology. Clinical practice, 2021, Vol.11 (3), p.e379-e382

2021

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Impacts of SiN-Capping Layer on the Device Characteristics and Hot-Carrier Degradation of nMOSFETs

IEEE transactions on device and materials reliability, 2007-03, Vol.7 (1), p.175-180

2007

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Tribological properties evaluation of AISI 1095 steel chromized at different temperatures

Surface & coatings technology, 2004, Vol.188-89, p.550-555

2004

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Fast tomography projection x-ray microscopy and transmission x-ray microscopy beamline at TPS of NSRRC

The Effects of Quest Types and Gaming Motivations on Players’ Knowledge Acquisitions in an Online Role-Playing Game Environment

Edge Termination Structures for 3.3 kV 4H-SiC Devices

TSV-free FinFET-based Monolithic 3D+-IC with computing-in-memory SRAM cell for intelligent IoT devices

The Design of Quasi-Super Junction and Novel Edge Termination in Junction Barrier Schottky Diode

A Flexible Anti-Jamming Channel Hopping for Cognitive Radio Networks

Ultra-Low Power 3D NC-FinFET-based Monolithic 3D+ -IC with Computing-in-Memory for Intelligent IoT Devices

Bit-Cost-Scalable 3D DRAM Architecture and Unit Cell First Demonstrated with Integrated Gate-Around and Channel-Around IGZO FETs

Enabling low power BEOL compatible monolithic 3D+ nanoelectronics for IoTs using local and selective far-infrared ray laser anneal technology

High performance poly Si junctionless transistors with sub-5nm conformally doped layers by molecular monolayer doping and microwave incorporating CO2 laser annealing for 3D stacked ICs applications

3DIC with Stacked FinFET, Inter-Level Metal, and Field-Size ( \mathbf\times \mathbf\mathbf^}) Single-Crystalline Si on SiO2 by Elevated-Epi

Distributed dynamic-TDD resource allocation in femtocell networks using evolutionary game

Record-high 121/62 μA/μm on-currents 3D stacked epi-like Si FETs with and without metal back gate

Ultrahigh Responsivity and Tunable Photogain BEOL Compatible MoS2 Phototransistor Array for Monolithic 3D Image Sensor with Block-Level Sensing Circuits

A novel 3D IC assembly process for ultra-thin chip stacking

Quorum-Based Energy Saving MAC Protocol Design for Wireless Sensor Networks

Development of the Motivation and Engagement in Virtual Reality Chinese Language Learning Questionnaire (MEVRCLQ)

A context-aware handoff scheme and all-ip mobile multicast service for heterogeneous wireless networks

Enabling monolithic 3D image sensor using large-area monolayer transition metal dichalcogenide and logic/memory hybrid 3D+IC

An integrated microfluidic system for diagnosis of quinolones resistance of helicobacter pylori

LRPBlog - Applying Blog to Learner's Participation Theory for Mutual Communication of E-Learning

Lactate peak in muscle disclosed by magnetic resonance spectroscopy in a patient with CPEO-plus syndrome

Thymidine Kinase 2 Deficiency-Induced Adult-Onset Ptosis and Proximal Weakness

Impacts of SiN-Capping Layer on the Device Characteristics and Hot-Carrier Degradation of nMOSFETs

Tribological properties evaluation of AISI 1095 steel chromized at different temperatures

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