Sie befinden Sich nicht im Netzwerk der Universität Paderborn. Der Zugriff auf elektronische Ressourcen ist gegebenenfalls nur via VPN oder Shibboleth (DFN-AAI) möglich. mehr Informationen...
Sortiert nach
    Datensatz exportieren als...
  • BibTeX
Pulmonary endometriosis resected by video-assisted thoracoscopic surgery
Respirology, 2006, Vol.11 (2), p.221-223
2006
Volltextzugriff (PDF)
    Datensatz exportieren als...
  • BibTeX
A 16Gb 18Gb/S/pin GDDR6 DRAM with per-bit trainable single-ended DFE and PLL-less clocking
2018 IEEE International Solid - State Circuits Conference - (ISSCC), 2018, p.204-206
2018
Volltextzugriff (PDF)
    Datensatz exportieren als...
  • BibTeX
Process Window of Mini-LED Display Panel Packaging using Laser Assisted Bonding Technology
2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC), 2023, p.1-4
2023
Volltextzugriff (PDF)
    Datensatz exportieren als...
  • BibTeX
Anisotropic Solder Paste (ASP) Material Solution for Laser Assisted Bonding (LAB) Process
2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC), 2023, p.1-4
2023
Volltextzugriff (PDF)
    Datensatz exportieren als...
  • BibTeX
Laser-Assisted Bonding (LAB) Process and its Bonding Materials as Technologies enabling the Low-Carbon Era
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 2022, p.198-203
2022
Volltextzugriff (PDF)
    Datensatz exportieren als...
  • BibTeX
Interconnection Reliability of Mini LEDs for Display Applications
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 2022, p.1184-1191
2022
Volltextzugriff (PDF)
    Datensatz exportieren als...
  • BibTeX
Micro-structure analysis of solder joint using room temperature Laser-Assisted Bonding (LAB) process
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 2023, p.01-06
2023
Volltextzugriff (PDF)
    Datensatz exportieren als...
  • BibTeX
Laser-Assisted Bonding with Compression (LABC) based Tiling Bonding Technology, Enabling Technology for Chiplet Integration
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 2023, p.1385-1389
2023
Volltextzugriff (PDF)
    Datensatz exportieren als...
  • BibTeX
Development of bonding process for flexible devices with fine-pitch interconnection using Anisotropic Solder Paste and Laser-Assisted Bonding Technology
2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 2020, p.1309-1314
2020
Volltextzugriff (PDF)
    Datensatz exportieren als...
  • BibTeX
Simultaneous Transfer and Bonding (SITRAB) Process for Micro-LEDs Using Laser-Assisted Bonding with Compression (LABC) Process and SITRAB Adhesive
2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2021, p.1607-1613
2021
Volltextzugriff (PDF)
    Datensatz exportieren als...
  • BibTeX
Chip-on-Wafer (CoW) Technology Utilizing Laser-Assisted Bonding with Compression (LABC) for Bump Counts Exceeding 500,000 at a 20 μm Pitch
2024 IEEE 74th Electronic Components and Technology Conference (ECTC), 2024, p.943-948
2024
Volltextzugriff (PDF)
    Datensatz exportieren als...
  • BibTeX
Enhanced Performance of Laser-Assisted Bonding with Compression (LABC) Compared with Thermal Compression Bonding (TCB) Technology
2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 2019, p.197-203
2019
Volltextzugriff (PDF)
    Datensatz exportieren als...
  • BibTeX
Mini LED array transferred onto a flexible substrate using Simultaneous Transfer and Bonding (SITRAB) process and Anisotropic Solder Film (ASF)
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 2022, p.619-624
2022
Volltextzugriff (PDF)
    Datensatz exportieren als...
  • BibTeX
Advanced Interconnection technology with Laser Assisted Bonding Process for PET Substrate
2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC), 2019, p.1-5
2019
Volltextzugriff (PDF)
    Datensatz exportieren als...
  • BibTeX
23.2 A 5Gb/s/pin 8Gb LPDDR4X SDRAM with power-isolated LVSTL and split-die architecture with 2-die ZQ calibration scheme
2017 IEEE International Solid-State Circuits Conference (ISSCC), 2017, p.390-391
2017
Volltextzugriff (PDF)
    Datensatz exportieren als...
  • BibTeX
Interconnection Process Using Laser and Hybrid Underfill for LED Array Module on PET Substrate
2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 2018, p.1567-1573
2018
Volltextzugriff (PDF)
    Datensatz exportieren als...
  • BibTeX
Development of Digital Signage Modules composed of Mini-LEDs using Laser-Assisted Bonding (LAB) Technology
2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 2020, p.1031-1036
2020
Volltextzugriff (PDF)
    Datensatz exportieren als...
  • BibTeX
Epoxy based Solder Paste for Flexible Substrate with Laser Assisted Bonding Process
2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC), 2022, p.28-30
2022
Volltextzugriff (PDF)
    Datensatz exportieren als...
  • BibTeX
Development of simultaneous transferring and bonding (SITRAB) process for µLED arrays using Anisotropic Solder Paste (ASP) and Laser-Assisted Bonding (LAB) Technology
2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2021, p.687-692
2021
Volltextzugriff (PDF)
    Datensatz exportieren als...
  • BibTeX
Reliability of Indium Solder Joints using a Laser-Assisted Bonding (LAB) Process at Room Temperature
2024 IEEE 74th Electronic Components and Technology Conference (ECTC), 2024, p.2237-2243
2024
Volltextzugriff (PDF)
    Datensatz exportieren als...
  • BibTeX
Development of Laser-Assisted Bonding with Compression (LABC) Process for 3D IC Integration
2019 International 3D Systems Integration Conference (3DIC), 2019, p.1-3
2019
Volltextzugriff (PDF)
    Datensatz exportieren als...
  • BibTeX
Dual-loop 2-step ZQ calibration for dedicated power supply voltage in LPDDR4 SDRAM
2017 IEEE Asian Solid-State Circuits Conference (A-SSCC), 2017, p.153-156
2017
Volltextzugriff (PDF)
    Datensatz exportieren als...
  • BibTeX
Thermal and Electrical Designs of RF 3D Module Based on Si Interposers with Redundant TSVs
2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 2016, p.2051-2057
2016
Volltextzugriff (PDF)
    Datensatz exportieren als...
  • BibTeX
Implementation of New CTI Service Platform Using Voice XML
Computational Science and Its Applications – ICCSA 2004, p.754-762
Volltextzugriff (PDF)
    Datensatz exportieren als...
  • BibTeX
Silica filler content in NCP and its effects on the reliability of 3D TSV Multi-Stack under thermal shock test
2017 IEEE 19th Electronics Packaging Technology Conference (EPTC), 2017, p.1-8
2017
Volltextzugriff (PDF)
1 – 25 von 30
Suche als RSS-Feed
Aktive Filter
PublikationsformArtikel
Suchergebnisse filtern
Filter anzeigen