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IPMSM torque control method considering DC-link voltage variation and friction torque for EV/HEV applications

2012 IEEE Vehicle Power and Propulsion Conference, 2012, p.1063-1069

2012

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An Investigation into the History of the Taekwondo Uniform since the Korean Peninsula's Liberation from Japan

Martial Arts in Asia, 2018, Vol.1, p.83-97

1, 2018

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28.1 A Fully Integrated, Domino-Like-Buffered Analog LDO Achieving -28dB Worst-Case Power-Supply Rejection Across the Frequency Spectrum from 10Hz to 1GHz with 50pF On-Chip Capacitance

2024 IEEE International Solid-State Circuits Conference (ISSCC), 2024, Vol.67, p.456-458

2024

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A 7V/μs-DVS Class-G Digital-Shunt-Aided Buck Voltage Regulator Achieving a 7% Dynamic-Efficiency Drop at a 600kHz DVS Occurrence Frequency in 28nm CMOS

2024 IEEE Custom Integrated Circuits Conference (CICC), 2024, p.1-2

2024

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A 16Gb/s/pin 8Gb GDDR6 DRAM with bandwidth extension techniques for high-speed applications

2018 IEEE International Solid - State Circuits Conference - (ISSCC), 2018, p.210-212

2018

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14.10 34.7A/mm2 Scalable Distributed All-Digital 6×6 Dot-LDOs Featuring Freely Linkable Current-Sharing Network: A Fine-Grained On-Chip Power Delivery Solution in 28nm CMOS

2024 IEEE International Solid-State Circuits Conference (ISSCC), 2024, Vol.67, p.272-274

2024

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Fast and efficient haze removal

2015 IEEE International Conference on Consumer Electronics (ICCE), 2015, p.360-361

2015

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Invariant Risk Minimization in Medical Imaging with Modular Data Representation

2024 International Conference on Electronics, Information, and Communication (ICEIC), 2024, p.1-5

2024

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Modeling and analysis of high-speed through silicon via (TSV) channel and defects

2016 IEEE International Symposium on Electromagnetic Compatibility (EMC), 2016, p.430-433

2016

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Advanced downlink MU-MIMO receiver for 3GPP LTE-A

2012 IEEE International Conference on Communications (ICC), 2012, p.7004-7008

2012

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Thermal and electrical reliability analysis of TO-247 for bonding method, substrate structure and heat dissipation bonding material

2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2021, p.1950-1956

2021

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Study on Emotional Speech Features in Korean with Its Application to Voice Conversion

Affective Computing and Intelligent Interaction, 2005, p.342-349

2005

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A new spectral smoothing algorithm for unit concatenating speech synthesis

Lecture notes in computer science, 2005, p.550-556

2005

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An All-Digital 90-Degree Phase-Shift DLL with Loop-Embedded DCC for 1.6Gbps DDR Interface

2007 IEEE Custom Integrated Circuits Conference, 2007, p.373-376

2007

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An Automated Framework for Accurately Classifying Financial Tables in Enterprise Analysis Reports

Pattern Recognition, 2023, Vol.14406, p.374-384

2023

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Parametric multichannel noise reduction algorithm utilizing temporal correlations in reverberant environment

2014 IEEE International Conference on Acoustics, Speech and Signal Processing (ICASSP), 2014, p.7049-7052

2014

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A global guide to protecting copyright

Managing Intellectual Property, 2009-11

2009

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Modeling and analysis of defects in through silicon via channel for non-invasive fault isolation

2015 International 3D Systems Integration Conference (3DIC), 2015, p.TS8.29.1-TS8.29.4

2015

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A novel approach to the enhancement of lane estimator by using Kalman filter

2017 17th International Conference on Control, Automation and Systems (ICCAS), 2017, p.1078-1082

2017

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Optical fronthaul technologies for next-generation mobile communications

2016 18th International Conference on Transparent Optical Networks (ICTON), 2016, p.1-3

2016

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Fault isolation of short defect in through silicon via (TSV) based 3D-IC

2013 IEEE International 3D Systems Integration Conference (3DIC), 2013, p.1-4

2013

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Optimization of control gate material and structure for enhancing 20nm 64Gb NAND flash reliability

Proceedings of Technical Program of 2012 VLSI Technology, System and Application, 2012, p.1-2

2012

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Modeling and analysis of open defect in through silicon via (TSV) channel

2013 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC Compo), 2013, p.163-166

2013

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Requirement of DML's Chirp Parameters for RoF-based Mobile Fronthaul Networks

2018 23rd Opto-Electronics and Communications Conference (OECC), 2018, p.1-2

2018

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Context-Aware Mashup for Smart Mobile Devices

2012 IEEE Asia-Pacific Services Computing Conference, 2012, p.179-186

2012

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IPMSM torque control method considering DC-link voltage variation and friction torque for EV/HEV applications

An Investigation into the History of the Taekwondo Uniform since the Korean Peninsula's Liberation from Japan

28.1 A Fully Integrated, Domino-Like-Buffered Analog LDO Achieving -28dB Worst-Case Power-Supply Rejection Across the Frequency Spectrum from 10Hz to 1GHz with 50pF On-Chip Capacitance

A 7V/μs-DVS Class-G Digital-Shunt-Aided Buck Voltage Regulator Achieving a 7% Dynamic-Efficiency Drop at a 600kHz DVS Occurrence Frequency in 28nm CMOS

A 16Gb/s/pin 8Gb GDDR6 DRAM with bandwidth extension techniques for high-speed applications

14.10 34.7A/mm2 Scalable Distributed All-Digital 6×6 Dot-LDOs Featuring Freely Linkable Current-Sharing Network: A Fine-Grained On-Chip Power Delivery Solution in 28nm CMOS

Fast and efficient haze removal

Invariant Risk Minimization in Medical Imaging with Modular Data Representation

Modeling and analysis of high-speed through silicon via (TSV) channel and defects

Advanced downlink MU-MIMO receiver for 3GPP LTE-A

Thermal and electrical reliability analysis of TO-247 for bonding method, substrate structure and heat dissipation bonding material

Study on Emotional Speech Features in Korean with Its Application to Voice Conversion

A new spectral smoothing algorithm for unit concatenating speech synthesis

An All-Digital 90-Degree Phase-Shift DLL with Loop-Embedded DCC for 1.6Gbps DDR Interface

An Automated Framework for Accurately Classifying Financial Tables in Enterprise Analysis Reports

Parametric multichannel noise reduction algorithm utilizing temporal correlations in reverberant environment

A global guide to protecting copyright

Modeling and analysis of defects in through silicon via channel for non-invasive fault isolation

A novel approach to the enhancement of lane estimator by using Kalman filter

Optical fronthaul technologies for next-generation mobile communications

Fault isolation of short defect in through silicon via (TSV) based 3D-IC

Optimization of control gate material and structure for enhancing 20nm 64Gb NAND flash reliability

Modeling and analysis of open defect in through silicon via (TSV) channel

Requirement of DML's Chirp Parameters for RoF-based Mobile Fronthaul Networks

Context-Aware Mashup for Smart Mobile Devices

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