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Structural Reliability and Performance Analysis of Backside PDN

2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), 2023, p.1-2

2023

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A 16Gb 9.5Gb/S/pin LPDDR5X SDRAM With Low-Power Schemes Exploiting Dynamic Voltage-Frequency Scaling and Offset-Calibrated Readout Sense Amplifiers in a Fourth Generation 10nm DRAM Process

2022 IEEE International Solid-State Circuits Conference (ISSCC), 2022, Vol.65, p.448-450

2022

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A sub-micron-thick InGaAs broadband (400-1700 nm) photodetectors with a high external quantum efficiency (>70%)

2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), 2022, p.413-414

2022

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25.2 A 16Gb Sub-1V 7.14Gb/s/pin LPDDR5 SDRAM Applying a Mosaic Architecture with a Short-Feedback 1-Tap DFE, an FSS Bus with Low-Level Swing and an Adaptively Controlled Body Biasing in a 3rd-Generation 10nm DRAM

2021 IEEE International Solid- State Circuits Conference (ISSCC), 2021, Vol.64, p.346-348

2021

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Sums of Finite Products of Euler Functions

Advances in Real and Complex Analysis with Applications, 2017, p.243-260

2017

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7.6 1GB/s 2Tb NAND flash multi-chip package with frequency-boosting interface chip

2015 IEEE International Solid State Circuits Conference (ISSCC), 2015, p.1-3

2015

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7.2 A 128Gb 3b/cell V-NAND flash memory with 1Gb/s I/O rate

2015 IEEE International Solid State Circuits Conference (ISSCC), 2015, p.1-3

2015

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Advanced RDL Interposer PKG Technology for Heterogeneous Integration

2020 International Wafer Level Packaging Conference (IWLPC), 2020, p.1-5

2020

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A Simple and Robust Method for Determining the Quality of Cardiovascular Signals Using the Signal Similarity

2018 40th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC), 2018, Vol.2018, p.478-481

2018

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A study on D2W Hybrid Cu bonding Technology for HBM Multi-die Stacking

2024 IEEE 74th Electronic Components and Technology Conference (ECTC), 2024, p.76-80

2024

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The Extremely Large 2.5D Molded Interposer on Substrate (MIoS) Package Integration - Warpage and Reliability

2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2021, p.1998-2002

2021

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Characterization of Die-to-Wafer Hybrid Bonding using Heterogeneous Dielectrics

2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 2022, p.335-339

2022

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Volatile organic compounds optical fiber gas sensor based on evanescentl field coupling and solvatochromism

2013 IEEE SENSORS, 2013, p.1-4

2013

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High Performance 3D Package Technology for Mobile Application Processor (AP)

2024 IEEE 74th Electronic Components and Technology Conference (ECTC), 2024, p.348-352

2024

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(Invited) High Brightness, Large Scale GaN Based Light-Emitting Diode Grown on 8-Inch Si Substrate

ECS transactions, 2014, Vol.61 (4), p.71-78

2014

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A Study on Memory Stack Process by Hybrid Copper Bonding (HCB) Technology

2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 2022, p.1085-1089

2022

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Development of the Testing Automation System for verifying interoperability of Digital Substation

2022 6th International Conference on Electric Power Equipment - Switching Technology (ICEPE-ST), 2022, p.363-366

2022

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Construction of the Interoperability Test-bed for IEC 61850 based Digital Substation

2022 6th International Conference on Electric Power Equipment - Switching Technology (ICEPE-ST), 2022, p.359-362

2022

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Human Action Recognition based on ST-GCN using Opticalflow and Image Gradient

The 9th International Conference on Smart Media and Applications, 2020, p.207-213

2020

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Power Integrity Performance Gain of a Novel Integrated Stack Capacitor (ISC) Solution for High-end Computing Applications

2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 2020, p.1358-1362

2020

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Dynamic Modeling and Force Analysis on Revolute Joint of Mechanical Master-Slave Manipulator using RecurDyn

2020 20th International Conference on Control, Automation and Systems (ICCAS), 2020, p.111-114

2020

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A 1.8 Gb/s/pin 16Tb NAND Flash Memory Multi-Chip Package with F-Chip of Toggle 4.0 Specification for High Performance and High Capacity Storage Systems

2020 IEEE Symposium on VLSI Circuits, 2020, p.1-2

2020

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Novel 2.5D RDL Interposer Packaging: A Key Enabler for the New Era of Heterogenous Chip Integration

2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2021, p.321-326

2021

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25.2 A 1.2V 8Gb 8-channel 128GB/s high-bandwidth memory (HBM) stacked DRAM with effective microbump I/O test methods using 29nm process and TSV

2014 IEEE International Solid-State Circuits Conference Digest of Technical Papers (ISSCC), 2014, p.432-433

2014

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Development of thermoelectric cooling system for BIPV module

INTELEC 2009 - 31st International Telecommunications Energy Conference, 2009, p.1-6

2009

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Structural Reliability and Performance Analysis of Backside PDN

A 16Gb 9.5Gb/S/pin LPDDR5X SDRAM With Low-Power Schemes Exploiting Dynamic Voltage-Frequency Scaling and Offset-Calibrated Readout Sense Amplifiers in a Fourth Generation 10nm DRAM Process

A sub-micron-thick InGaAs broadband (400-1700 nm) photodetectors with a high external quantum efficiency (>70%)

25.2 A 16Gb Sub-1V 7.14Gb/s/pin LPDDR5 SDRAM Applying a Mosaic Architecture with a Short-Feedback 1-Tap DFE, an FSS Bus with Low-Level Swing and an Adaptively Controlled Body Biasing in a 3rd-Generation 10nm DRAM

Sums of Finite Products of Euler Functions

7.6 1GB/s 2Tb NAND flash multi-chip package with frequency-boosting interface chip

7.2 A 128Gb 3b/cell V-NAND flash memory with 1Gb/s I/O rate

Advanced RDL Interposer PKG Technology for Heterogeneous Integration

A Simple and Robust Method for Determining the Quality of Cardiovascular Signals Using the Signal Similarity

A study on D2W Hybrid Cu bonding Technology for HBM Multi-die Stacking

The Extremely Large 2.5D Molded Interposer on Substrate (MIoS) Package Integration - Warpage and Reliability

Characterization of Die-to-Wafer Hybrid Bonding using Heterogeneous Dielectrics

Volatile organic compounds optical fiber gas sensor based on evanescentl field coupling and solvatochromism

High Performance 3D Package Technology for Mobile Application Processor (AP)

(Invited) High Brightness, Large Scale GaN Based Light-Emitting Diode Grown on 8-Inch Si Substrate

A Study on Memory Stack Process by Hybrid Copper Bonding (HCB) Technology

Development of the Testing Automation System for verifying interoperability of Digital Substation

Construction of the Interoperability Test-bed for IEC 61850 based Digital Substation

Human Action Recognition based on ST-GCN using Opticalflow and Image Gradient

Power Integrity Performance Gain of a Novel Integrated Stack Capacitor (ISC) Solution for High-end Computing Applications

Dynamic Modeling and Force Analysis on Revolute Joint of Mechanical Master-Slave Manipulator using RecurDyn

A 1.8 Gb/s/pin 16Tb NAND Flash Memory Multi-Chip Package with F-Chip of Toggle 4.0 Specification for High Performance and High Capacity Storage Systems

Novel 2.5D RDL Interposer Packaging: A Key Enabler for the New Era of Heterogenous Chip Integration

25.2 A 1.2V 8Gb 8-channel 128GB/s high-bandwidth memory (HBM) stacked DRAM with effective microbump I/O test methods using 29nm process and TSV

Development of thermoelectric cooling system for BIPV module

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