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Development of Millimeter-wave Integrated Passives on MCM-D Technology with Thin-Film Microstrip Line

2006 IEEE MTT-S International Microwave Symposium Digest, 2006, p.952-955

2006

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Low-loss and high-isolation through silicon via technology for high performance RF applications

2014 44th European Microwave Conference, 2014, p.996-999

2014

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Molecular Orientation and Crystalline Structure of Aligned Electrospun Nylon 6 Nanofibers: Effect of Gap Size

Advanced materials research, 2011, Vol.175-176, p.333-336

2011

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A novel integrated dual-mode RF front-end module for Wi-Fi and bluetooth applications

2011 IEEE MTT-S International Microwave Symposium, 2011, p.1-4

2011

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A miniaturized module for Bluetooth/GPS by embedding capacitors in printed-circuit-board and using interposer

2013 IEEE 63rd Electronic Components and Technology Conference, 2013, p.2052-2057

2013

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A novel integrated Tx-Rx diplexer for dual-band WiMAX system

2010 IEEE MTT-S International Microwave Symposium, 2010, p.1736-1739

2010

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A mobile TV/GPS module by embedding a GPS IC in printed-circuit-board

2012 IEEE 62nd Electronic Components and Technology Conference, 2012, p.1668-1672

2012

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The effects of decoupling capacitors in DC bias lines by measuring an implemented RF system

Asia-Pacific Microwave Conference 2011, 2011, p.1818-1821

2011

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Fabrication of a switch module by embedding chip capacitors and an active IC in organic substrate

2010 Proceedings 60th Electronic Components and Technology Conference (ECTC), 2010, p.1980-1985

2010

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13.3 A 280-Layer 1Tb 4b/cell 3D-NAND Flash Memory with a 28.5Gb/mm2 Areal Density and a 3.2GB/s High-Speed IO Rate

2024 IEEE International Solid-State Circuits Conference (ISSCC), 2024, Vol.67, p.236-237

2024

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Fabrication of wireless LAN low-pass-filters for IEEE 802.11 b/g and IEEE 802.11 a in printed-circuit-board

2009 Asia Pacific Microwave Conference, 2009, p.1423-1426

2009

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High density and low-cost silicon interposer using thin-film and organic lamination processes

2012 IEEE 62nd Electronic Components and Technology Conference, 2012, p.274-278

2012

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A diplexer by various embedding method

2008 Electrical Design of Advanced Packaging and Systems Symposium, 2008, p.183-185

2008

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Embedded IC module package using silicon substrate

2012 42nd European Microwave Conference, 2012, p.999-1002

2012

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Embedded IC module package using silicon substrate

2012 7th European Microwave Integrated Circuit Conference, 2012, p.619-622

2012

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Implementation of compact triple-mode module by embedding an IC in printed-circuit-board

2012 7th European Microwave Integrated Circuit Conference, 2012, p.901-904

2012

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Implementation of compact triple-mode module by embedding an IC in printed-circuit-board

2012 42nd European Microwave Conference, 2012, p.1281-1284

2012

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Implementation of a RF front-end module by embedding ICs in molding package

2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems, 2013, p.183-186

2013

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Embedded passive and active package using silicon substrate

2011 IEEE 13th Electronics Packaging Technology Conference, 2011, p.554-557

2011

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Biological Safety Evaluation of Polymers

Degradation of Implant Materials, 2012, p.463-479

2012

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A system-on-package module by embedding a mobile TV IC in printed-circuit-board

2012 IEEE Radio and Wireless Symposium, 2012, p.283-286

2012

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A compact BT/WiFi dual-band dual-mode RF front-end module

Asia-Pacific Microwave Conference 2011, 2011, p.110-113

2011

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A GPS/BT/WiFi triple-mode RF FEM using Si- and LTCC-based embedded technologies

2012 IEEE/MTT-S International Microwave Symposium Digest, 2012, p.1-3

2012

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Investigation of an embedded RF switch IC in printed-circuit-board

2008 Electrical Design of Advanced Packaging and Systems Symposium, 2008, p.81-84

2008

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Fabrication and characterization of embedded active and passive device for wireless application

2010 Proceedings 60th Electronic Components and Technology Conference (ECTC), 2010, p.2035-2041

2010

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Development of Millimeter-wave Integrated Passives on MCM-D Technology with Thin-Film Microstrip Line

Low-loss and high-isolation through silicon via technology for high performance RF applications

Molecular Orientation and Crystalline Structure of Aligned Electrospun Nylon 6 Nanofibers: Effect of Gap Size

A novel integrated dual-mode RF front-end module for Wi-Fi and bluetooth applications

A miniaturized module for Bluetooth/GPS by embedding capacitors in printed-circuit-board and using interposer

A novel integrated Tx-Rx diplexer for dual-band WiMAX system

A mobile TV/GPS module by embedding a GPS IC in printed-circuit-board

The effects of decoupling capacitors in DC bias lines by measuring an implemented RF system

Fabrication of a switch module by embedding chip capacitors and an active IC in organic substrate

13.3 A 280-Layer 1Tb 4b/cell 3D-NAND Flash Memory with a 28.5Gb/mm2 Areal Density and a 3.2GB/s High-Speed IO Rate

Fabrication of wireless LAN low-pass-filters for IEEE 802.11 b/g and IEEE 802.11 a in printed-circuit-board

High density and low-cost silicon interposer using thin-film and organic lamination processes

A diplexer by various embedding method

Embedded IC module package using silicon substrate

Embedded IC module package using silicon substrate

Implementation of compact triple-mode module by embedding an IC in printed-circuit-board

Implementation of compact triple-mode module by embedding an IC in printed-circuit-board

Implementation of a RF front-end module by embedding ICs in molding package

Embedded passive and active package using silicon substrate

Biological Safety Evaluation of Polymers

A system-on-package module by embedding a mobile TV IC in printed-circuit-board

A compact BT/WiFi dual-band dual-mode RF front-end module

A GPS/BT/WiFi triple-mode RF FEM using Si- and LTCC-based embedded technologies

Investigation of an embedded RF switch IC in printed-circuit-board

Fabrication and characterization of embedded active and passive device for wireless application

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