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Ultra-Low Drift Voltage by Using Gate Voltage Control in Oxide-Based Gate ISFET

ECS transactions, 2008, Vol.6 (19), p.11-29

2008

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Comparison of hemodynamic and inflammatory changes between transoral and transthoracic thoracoscopic surgery

Endoscopy, 2012, Vol.44 (10)

2012

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Flip-flop and repeater insertion for early interconnect planning

Design, Automation, and Test in Europe: Proceedings of the conference on Design, automation and test in Europe; 04-08 Mar. 2002, 2002, p.690-695

2002

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Thermal placement for high-performance multichip modules

Proceedings of ICCD '95 International Conference on Computer Design. VLSI in Computers and Processors, 1995, p.218-223

1995

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Exact algorithms for coupling capacitance minimization by adding one metal layer

Sixth international symposium on quality electronic design (isqed'05), 2005, p.181-186

2005

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Simultaneous floorplanning and buffer block planning

Proceedings of the ASP-DAC Asia and South Pacific Design Automation Conference, 2003, 2003, p.431-434

2003

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ECO algorithms for removing overlaps between power rails and signal wires

Digest of technical papers - IEEE/ACM International Conference on Computer-Aided Design, 2002, p.67-74

2002

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Signal integrity optimization on the pad assignment for high-speed VLSI design

Proceedings of the 1995 IEEE/ACM international conference on Computer-aided design, 1995, p.720-725

1995

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Floorplanning for low power designs

1995 IEEE International Symposium on Circuits and Systems (ISCAS), 1995, Vol.1, p.45-48 vol.1

1995

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Layer assignment for high-performance multi-chip modules

Proceedings of the 1994 IEEE/ACM international conference on Computer-aided design, 1994, p.680-685

1994

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The complementary relationship of interprocedural register allocation and inlining

Proceedings of 1994 IEEE International Conference on Computer Languages (ICCL'94), 1994, p.253-264

1994

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An optimal layer assignment algorithm for minimizing crosstalk for three layer VHV channel routing

1995 IEEE International Symposium on Circuits and Systems (ISCAS), 1995, Vol.1, p.207-210 vol.1

1995

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Ceramic varistor fabricated by surface diffusion

1992 Proceedings 42nd Electronic Components & Technology Conference, 1992, p.306-310

1992

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Implementation of switching controller for precise network time synchronization

CPEM 2010, 2010, p.40-41

2010

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Three-photon fluorescence microscopic imaging by a compact Er-doped fiber laser at 1.6 μm

2018 Conference on Lasers and Electro-Optics (CLEO), 2018, p.1-2

2018

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Topic Based Information Diffusion Prediction Model with External Trends

2015 IEEE 12th International Conference on e-Business Engineering, 2015, p.29-36

2015

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Extended MTJ TDDB Model, and Improved STT-MRAM Reliability With Reduced Circuit and Process Variabilities

2022 IEEE International Reliability Physics Symposium (IRPS), 2022, p.6B.3-1-6B.3-6

2022

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Applying Augmented Reality Technology to Book Publication Business

2015 IEEE 12th International Conference on e-Business Engineering, 2015, p.281-286

2015

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A Case-Based Approach for Unravelling the Complexity in Adoption Decision-Making in Enterprise Health Information Systems

Proceedings of the 2024 Australasian Computer Science Week, 2024, p.92-97

2024

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A Highly Stackable Thin-Film Transistor (TFT) NAND-Type Flash Memory

2006 Symposium on VLSI Technology, 2006. Digest of Technical Papers, 2006, p.46-47

2006

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Gigahertz FPGA by SiGe BiCMOS Technology for Low Power, High Speed Computing with 3-D Memory

Field Programmable Logic and Application, 2003, p.11-20

2003

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Device trends and implications on circuit design in advanced CMOS technologies

Proceedings of the IEEE 2005 Custom Integrated Circuits Conference, 2005, 2005, p.675-679

2005

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Preparation and characterization of low-k mesoporous silica films

Studies in Surface Science and Catalysis, 2004, Vol.154, p.94-101

2004

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A Millimeter-Wave Wideband SPDT Switch with Traveling-Wave Concept Using 0.13-μm CMOS Process

IEEE MTT-S International Microwave Symposium Digest, 2005, 2005, p.53-56

2005

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Thermal behavior of flip chip LED packages using electrical conductive adhesive and soldering methods

2013 10th China International Forum on Solid State Lighting (ChinaSSL), 2013, p.4-7

2013

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Ultra-Low Drift Voltage by Using Gate Voltage Control in Oxide-Based Gate ISFET

Comparison of hemodynamic and inflammatory changes between transoral and transthoracic thoracoscopic surgery

Flip-flop and repeater insertion for early interconnect planning

Thermal placement for high-performance multichip modules

Exact algorithms for coupling capacitance minimization by adding one metal layer

Simultaneous floorplanning and buffer block planning

ECO algorithms for removing overlaps between power rails and signal wires

Signal integrity optimization on the pad assignment for high-speed VLSI design

Floorplanning for low power designs

Layer assignment for high-performance multi-chip modules

The complementary relationship of interprocedural register allocation and inlining

An optimal layer assignment algorithm for minimizing crosstalk for three layer VHV channel routing

Ceramic varistor fabricated by surface diffusion

Implementation of switching controller for precise network time synchronization

Three-photon fluorescence microscopic imaging by a compact Er-doped fiber laser at 1.6 μm

Topic Based Information Diffusion Prediction Model with External Trends

Extended MTJ TDDB Model, and Improved STT-MRAM Reliability With Reduced Circuit and Process Variabilities

Applying Augmented Reality Technology to Book Publication Business

A Case-Based Approach for Unravelling the Complexity in Adoption Decision-Making in Enterprise Health Information Systems

A Highly Stackable Thin-Film Transistor (TFT) NAND-Type Flash Memory

Gigahertz FPGA by SiGe BiCMOS Technology for Low Power, High Speed Computing with 3-D Memory

Device trends and implications on circuit design in advanced CMOS technologies

Preparation and characterization of low-k mesoporous silica films

A Millimeter-Wave Wideband SPDT Switch with Traveling-Wave Concept Using 0.13-μm CMOS Process

Thermal behavior of flip chip LED packages using electrical conductive adhesive and soldering methods

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