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Simultaneous operation and control of about 100 telescopes for the Cherenkov Telescope Array

Journal of physics. Conference series, 2012, Vol.396 (1), p.12052-12

2012

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HESS-II reconstruction strategy and performance in the low-energy (20-150 GeV) domain

AIP conference proceedings, 2009, Vol.1085 (1), p.738-741

2009

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A new camera for the HESS phase II experiment

AIP conference proceedings, 2005, Vol.745 (1), p.791-796

2005

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Observations of the Crab nebula at TeV energies

AIP Conference Proceedings (American Institute of Physics); (United States), 1994, Vol.304:1

1994

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Detection of TeV photons from Markarian 421. [Mrk 421]

AIP Conference Proceedings (American Institute of Physics); (United States), 1993, Vol.280:1

1993

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A stress-life methodology for ball grid array lead-free and tin-lead solder interconnects under impact conditions

EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005, 2005, p.277-284

2005

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The heat transfer performance in a square channel downstream of a representative shape memory alloy structure for microfluidics applications

2015 31st Thermal Measurement, Modeling & Management Symposium (SEMI-THERM), 2015, p.273-279

2015

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Factors that influence ionic migration on printed wiring boards

2005 IEEE International Reliability Physics Symposium, 2005. Proceedings. 43rd Annual, 2005, p.300-304

2005

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Point-of-source thermal management

EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005, 2005, p.688-694

Punch, J.

2005

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Experimental determination and finite element model validation of the Anand viscoplasticity model constants for SnAgCu

EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005, 2005, p.490-496

2005

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A reliability evaluation of lead-free ball grid array (BGA) solder joints through mechanical fatigue testing

EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005, 2005, p.436-440

2005

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Transient hygrothermal behaviour of portable electronics

EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005, 2005, p.398-405

2005

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Oxide development on coated copper contacts

EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005, 2005, p.330-334