UB Paderborn / Katalog / Suche / in CDI

1 – 25 von 71

Sortiert nach

Innovative Practices Track: Session 6 - Using AI to Address the Silicon Growth Curve

2024 IEEE 42nd VLSI Test Symposium (VTS), 2024, p.1-1

2024

Link zum Volltext
IEEE_Xplore

LLMs for Hardware Security: Boon or Bane?

2024 IEEE 42nd VLSI Test Symposium (VTS), 2024, p.1-4

2024

Link zum Volltext
IEEE_Xplore

Temperature-Insensitive Soft-Error-Tolerant Flip-Flop Design For Automotive Electronics

2024 IEEE 42nd VLSI Test Symposium (VTS), 2024, p.1-7

2024

Link zum Volltext
IEEE_Xplore

Extremely Narrow Pitch Gravure Offset Printing Technology using Fine Solder Paste

2024 International Conference on Electronics Packaging (ICEP), 2024, p.15-16

2024

Link zum Volltext

Verfügbarkeit prüfen

Novel Lightweight, Highly Thermally Conductive Graphene-Enhanced Heat Pipes for Electronics Cooling and Thermal Management Applications

2024 International Conference on Electronics Packaging (ICEP), 2024, p.339-340

2024

Link zum Volltext

Verfügbarkeit prüfen

HAZ-free Direct Laser Machining on Silicone-Based Flexible Hybrid Electronics

2024 International Conference on Electronics Packaging (ICEP), 2024, p.25-26

2024

Link zum Volltext

Verfügbarkeit prüfen

Simulation Study of Pore Structure Evolution and its Influences on the Properties of Sintered Silver

2024 International Conference on Electronics Packaging (ICEP), 2024, p.159-160

2024

Link zum Volltext

Verfügbarkeit prüfen

Investigation of Additional Elements in Sn-Bi Based Low-Temperature Solder

2024 International Conference on Electronics Packaging (ICEP), 2024, p.203-204

2024

Link zum Volltext

Verfügbarkeit prüfen

Development of a Sintering Paste Using Cu@Ag Powder for Power Package

2024 International Conference on Electronics Packaging (ICEP), 2024, p.327-328

2024

Link zum Volltext

Verfügbarkeit prüfen

Differentiating Analysis of Beef, Pork, Bovine Blood, and Porcine Blood via Electronic Olfaction Technology

2024 12th International Electrical Engineering Congress (iEECON), 2024, p.1-4

2024

Link zum Volltext

Verfügbarkeit prüfen

Characterization of Chitin or Chitosan/PEO Nanofibers Prepared by Electrospinning

2024 International Conference on Electronics Packaging (ICEP), 2024, p.319-320

2024

Link zum Volltext

Verfügbarkeit prüfen

In-Depth Analysis of Bonding Interface at Die Level Hybrid Bonding

2024 International Conference on Electronics Packaging (ICEP), 2024, p.3-4

2024

Link zum Volltext

Verfügbarkeit prüfen

Solid/Solid Interfacial Reactions in the Sn/C7025 and Sn-3.0 wt%Ag-0.5wt%Cu/C7025 Couples

2024 International Conference on Electronics Packaging (ICEP), 2024, p.21-22

2024

Link zum Volltext

Verfügbarkeit prüfen

Investigation of Plasma Gases for Polysilazane Conversion into SiO2 for Wafer Bonding

2024 International Conference on Electronics Packaging (ICEP), 2024, p.289-290

2024

Link zum Volltext

Verfügbarkeit prüfen

CubeSat for IEEE-GRSS Algeria Chapter

2024 IEEE Mediterranean and Middle-East Geoscience and Remote Sensing Symposium (M2GARSS), 2024, p.505-508

2024

Link zum Volltext

Verfügbarkeit prüfen

Automatic Fault Location Technology of Electronic Circuit Based on Artificial Intelligence

2024 International Conference on Electrical Drives, Power Electronics & Engineering (EDPEE), 2024, p.936-938

Zheng, Junna

2024

Link zum Volltext

Verfügbarkeit prüfen

Decomposition of electrical and electronic waste management by using artificial intelligence

2023 Seventh International Conference on Image Information Processing (ICIIP), 2023, p.411-416

2023

Link zum Volltext
IEEE_Xplore

Cathodoluminescence Characterization of Diamond Polished by Gas Cluster Ion Beam

2024 International Conference on Electronics Packaging (ICEP), 2024, p.137-138

2024

Link zum Volltext

Verfügbarkeit prüfen

Reliability Evaluations of Bonding Characteristics of Combined Pb-free Solder Joints with Sn-Bi-Ag and Sn-Ag-Cu

2024 International Conference on Electronics Packaging (ICEP), 2024, p.17-18

2024

Link zum Volltext

Verfügbarkeit prüfen

Temperature-Dependent Electrical Resistivity in Sn-Bi Alloys

2024 International Conference on Electronics Packaging (ICEP), 2024, p.207-208

2024

Link zum Volltext

Verfügbarkeit prüfen

Study of Galvanic Effect Factor and Mechanism for Ni/Au Plated Substrate

2024 International Conference on Electronics Packaging (ICEP), 2024, p.143-144

2024

Link zum Volltext

Verfügbarkeit prüfen

Thermal Stability of Bi in Sn-Cu Based High Strength Pb-Free Solder Alloys

2024 International Conference on Electronics Packaging (ICEP), 2024, p.81-82

2024

Link zum Volltext

Verfügbarkeit prüfen

Development of Thermal Characteristics Evaluation System for Multi-Chip SiC Power Modules

2024 International Conference on Electronics Packaging (ICEP), 2024, p.47-48

2024

Link zum Volltext

Verfügbarkeit prüfen

Investigating Laser Direct Structuring and Aerosol-Jet for Additively Manufactured Helix Antennas

2024 International Conference on Electronics Packaging (ICEP), 2024, p.127-128

2024

Link zum Volltext

Verfügbarkeit prüfen

Using Virtual Reality to Promote Pro-environmental Consumption

2024 IEEE Conference on Virtual Reality and 3D User Interfaces Abstracts and Workshops (VRW), 2024, p.01-02

2024

Link zum Volltext

Verfügbarkeit prüfen

1 – 25 von 71

Suche als RSS-Feed

Aktive Filter

Neu hinzugefügt... seit 7 Tagen

ThemaComputer Science, Information Systems

ThemaOptics

PublikationsformTagungsberichte

Suchergebnisse filtern

Filter anzeigen

Nur zeigen

Mit Volltextzugriff
(10)

Sprache

Englisch
(71)

Erscheinungsjahr

n.n

Thema

Electronic Packaging Thermal Management
(18)
Electronics Packaging
(17)
Thermal Conductivity
(12)
Conductivity
(11)
Bonding
(9)
Reliability
(8)
Heating Systems
(7)
Temperature Measurement
(7)
Performance Evaluation
(6)
Silver
(6)
Temperature
(6)
Thermal Resistance
(6)
Security
(5)
Temperature Sensors
(5)
Aging
(4)
Metals
(4)
Multichip Modules
(4)
Packaging
(4)
Plating
(4)
Power Electronics
(4)

15 weitere anzeigen...

Weniger anzeigen...

Kollektion

IEEE/IET Electronic Library
(67)

Menü

Weitere Dienste

Einstellungen

Innovative Practices Track: Session 6 - Using AI to Address the Silicon Growth Curve

LLMs for Hardware Security: Boon or Bane?

Temperature-Insensitive Soft-Error-Tolerant Flip-Flop Design For Automotive Electronics

Extremely Narrow Pitch Gravure Offset Printing Technology using Fine Solder Paste

Novel Lightweight, Highly Thermally Conductive Graphene-Enhanced Heat Pipes for Electronics Cooling and Thermal Management Applications

HAZ-free Direct Laser Machining on Silicone-Based Flexible Hybrid Electronics

Simulation Study of Pore Structure Evolution and its Influences on the Properties of Sintered Silver

Investigation of Additional Elements in Sn-Bi Based Low-Temperature Solder

Development of a Sintering Paste Using Cu@Ag Powder for Power Package

Differentiating Analysis of Beef, Pork, Bovine Blood, and Porcine Blood via Electronic Olfaction Technology

Characterization of Chitin or Chitosan/PEO Nanofibers Prepared by Electrospinning

In-Depth Analysis of Bonding Interface at Die Level Hybrid Bonding

Solid/Solid Interfacial Reactions in the Sn/C7025 and Sn-3.0 wt%Ag-0.5wt%Cu/C7025 Couples

Investigation of Plasma Gases for Polysilazane Conversion into SiO2 for Wafer Bonding

CubeSat for IEEE-GRSS Algeria Chapter

Automatic Fault Location Technology of Electronic Circuit Based on Artificial Intelligence

Decomposition of electrical and electronic waste management by using artificial intelligence

Cathodoluminescence Characterization of Diamond Polished by Gas Cluster Ion Beam

Reliability Evaluations of Bonding Characteristics of Combined Pb-free Solder Joints with Sn-Bi-Ag and Sn-Ag-Cu

Temperature-Dependent Electrical Resistivity in Sn-Bi Alloys

Study of Galvanic Effect Factor and Mechanism for Ni/Au Plated Substrate

Thermal Stability of Bi in Sn-Cu Based High Strength Pb-Free Solder Alloys

Development of Thermal Characteristics Evaluation System for Multi-Chip SiC Power Modules

Investigating Laser Direct Structuring and Aerosol-Jet for Additively Manufactured Helix Antennas

Using Virtual Reality to Promote Pro-environmental Consumption

Aktive Filter

Suchergebnisse filtern