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Recent progress of integrated circuits and optoelectronic chips

Science China. Information sciences, 2021-10, Vol.64 (10), p.201401, Article 201401

2021

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The Detection of Open and Leakage Faults for Prebond TSV Test Based on Weak Current Source

IEEE transactions on computer-aided design of integrated circuits and systems, 2022-09, Vol.41 (9), p.2768-2779

2022

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IEEE_Xplore

A Pulse Shrinking-Based Test Solution for Prebond Through Silicon via in 3-D ICs

IEEE transactions on computer-aided design of integrated circuits and systems, 2019-04, Vol.38 (4), p.755-766

2019

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IEEE_Xplore

Silicon Demonstration of Hardware Trojan Design and Detection in Wireless Cryptographic ICs

IEEE transactions on very large scale integration (VLSI) systems, 2017-04, Vol.25 (4), p.1506-1519

2017

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IEEE_Xplore

An ILD Void Detection Method for Monolithic 3-D ICs Based on Switched Capacitors

IEEE transactions on computer-aided design of integrated circuits and systems, 2023-08, Vol.42 (8), p.2728-2737

2023

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IEEE_Xplore

A SiGe BiCMOS D-Band LNA with Gain Boosted by Local Feedback in Common-Emitter Transistors

2023 IEEE Radio Frequency Integrated Circuits Symposium (RFIC), 2023, p.133-136

2023

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A Novel Thermal-Aware Floorplanning and TSV Assignment With Game Theory for Fixed-Outline 3-D ICs

IEEE transactions on very large scale integration (VLSI) systems, 2023-11, Vol.31 (11), p.1639-1652

2023

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IEEE_Xplore

Enabling a New Methodology of Neural Coding: Multiplexing Temporal Encoding in Neuromorphic Computing

IEEE transactions on very large scale integration (VLSI) systems, 2023-03, Vol.31 (3), p.1-12

2023

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IEEE_Xplore

Review of Recent Progress on Silicon Nitride-based Photonic Integrated Circuits

IEEE access, 2020-01, Vol.8, p.1-1

2020

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Application and Product-Volume-Specific Customization of BEOL Metal Pitch

IEEE transactions on very large scale integration (VLSI) systems, 2018-09, Vol.26 (9), p.1627-1636

2018

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IEEE_Xplore

Dynamic Frequency Scaling Aware Opportunistic Through-Silicon-Via Inductor Utilization in Resonant Clocking

IEEE transactions on computer-aided design of integrated circuits and systems, 2020-02, Vol.39 (2), p.281-293

2020

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IEEE_Xplore

Circuit Performance Shifts Due to Layout-Dependent Stress in Planar and 3D-ICs

IEEE transactions on very large scale integration (VLSI) systems, 2018-12, Vol.26 (12), p.2907-2920

2018

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IEEE_Xplore

A survey on design and synthesis techniques for photonic integrated circuits

The Journal of supercomputing, 2021-05, Vol.77 (5), p.4332-4374

2021

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Modeling and Design of Dual-purpose MIV in Monolithic 3D IC

IEEE access, 2024-01, Vol.12, p.1-1

2024

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Conventional and machine learning approaches as countermeasures against hardware trojan attacks

Microprocessors and microsystems, 2020-11, Vol.79, p.103295, Article 103295

2020

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Development of Flat Panel Active Phased Array Antennas Using 5G Silicon RFICs at Ku- and Ka-Bands

IEEE access, 2020, Vol.8, p.192669-192681

2020

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Silicon Effect-Aware Full-Chip Extraction and Mitigation of TSV-to-TSV Coupling

IEEE transactions on computer-aided design of integrated circuits and systems, 2014-12, Vol.33 (12), p.1900-1913

2014

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IEEE_Xplore

Power Blurring: Fast Static and Transient Thermal Analysis Method for Packaged Integrated Circuits and Power Devices

IEEE transactions on very large scale integration (VLSI) systems, 2014-11, Vol.22 (11), p.2366-2379

2014

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IEEE_Xplore

Novel Error-Tolerant Voltage-Divider-Based Through-Silicon-Via Test Architecture

IEEE transactions on computer-aided design of integrated circuits and systems, 2023-01, Vol.42 (1), p.308-321

2023

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IEEE_Xplore

A Compact Passive Equalizer Design for Differential Channels in TSV-Based 3-D ICs

IEEE access, 2018, Vol.6, p.75278-75292

2018

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Modern architecture for photonic networks-on-chip

The Journal of supercomputing, 2020-12, Vol.76 (12), p.9901-9921

2020

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An Improved Dual-Gate Compact Model for Carbon Nanotube Field Effect Transistors with a Back-Gate Effect and Circuit Implementation

Electronics (Basel), 2024-02, Vol.13 (3), p.620

2024

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Data reorganization in memory using 3D-stacked DRAM

2015 ACM/IEEE 42nd Annual International Symposium on Computer Architecture (ISCA), 2015, p.131-143

2015

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IEEE_Xplore

Compact Lateral Thermal Resistance Model of TSVs for Fast Finite-Difference Based Thermal Analysis of 3-D Stacked ICs

IEEE transactions on computer-aided design of integrated circuits and systems, 2014-10, Vol.33 (10), p.1490-1502

2014

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IEEE_Xplore

Carbon nanotube-based CMOS transistors and integrated circuits

Science China. Information sciences, 2021-10, Vol.64 (10), p.201402, Article 201402

2021

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Recent progress of integrated circuits and optoelectronic chips

The Detection of Open and Leakage Faults for Prebond TSV Test Based on Weak Current Source

A Pulse Shrinking-Based Test Solution for Prebond Through Silicon via in 3-D ICs

Silicon Demonstration of Hardware Trojan Design and Detection in Wireless Cryptographic ICs

An ILD Void Detection Method for Monolithic 3-D ICs Based on Switched Capacitors

A SiGe BiCMOS D-Band LNA with Gain Boosted by Local Feedback in Common-Emitter Transistors

A Novel Thermal-Aware Floorplanning and TSV Assignment With Game Theory for Fixed-Outline 3-D ICs

Enabling a New Methodology of Neural Coding: Multiplexing Temporal Encoding in Neuromorphic Computing

Review of Recent Progress on Silicon Nitride-based Photonic Integrated Circuits

Application and Product-Volume-Specific Customization of BEOL Metal Pitch

Dynamic Frequency Scaling Aware Opportunistic Through-Silicon-Via Inductor Utilization in Resonant Clocking

Circuit Performance Shifts Due to Layout-Dependent Stress in Planar and 3D-ICs

A survey on design and synthesis techniques for photonic integrated circuits

Modeling and Design of Dual-purpose MIV in Monolithic 3D IC

Conventional and machine learning approaches as countermeasures against hardware trojan attacks

Development of Flat Panel Active Phased Array Antennas Using 5G Silicon RFICs at Ku- and Ka-Bands

Silicon Effect-Aware Full-Chip Extraction and Mitigation of TSV-to-TSV Coupling

Power Blurring: Fast Static and Transient Thermal Analysis Method for Packaged Integrated Circuits and Power Devices

Novel Error-Tolerant Voltage-Divider-Based Through-Silicon-Via Test Architecture

A Compact Passive Equalizer Design for Differential Channels in TSV-Based 3-D ICs

Modern architecture for photonic networks-on-chip

An Improved Dual-Gate Compact Model for Carbon Nanotube Field Effect Transistors with a Back-Gate Effect and Circuit Implementation

Data reorganization in memory using 3D-stacked DRAM

Compact Lateral Thermal Resistance Model of TSVs for Fast Finite-Difference Based Thermal Analysis of 3-D Stacked ICs

Carbon nanotube-based CMOS transistors and integrated circuits

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