UB Paderborn / Katalog / Suche / in CDI

Sortiert nach

Einfacher Volltextzugriff von (fast) überall

Installieren Sie die LibKey Nomad-Browsererweiterung und erhalten Sie von vielen Webseiten einfachen Zugriff auf lizenzierte Volltexte oder Open Access Publikationen. Mehr erfahren...

Thermoelectric properties of Zn4Sb3/CeFe(4-x)CoxSb12 nano-layered superlattices modified by MeV Si ion beam

Applied surface science, 2014, Vol.310, p.226-229

2014

Volltextzugriff (PDF)

Effects of POSS-Silanol Addition on Whisker Formation in Sn-Based Pb-Free Electronic Solders : LEAD-FREE SOLDERS

Journal of electronic materials, 2014, Vol.43 (1), p.26-32

2014

Volltextzugriff (PDF)

Thermoelectric Properties of Nanostructured Bismuth-Doped Lead Telluride Bix(PbTe)1−x Prepared by Co-Ball-Milling

Journal of electronic materials, 2014, Vol.43 (6), p.1674-1680

2014

Volltextzugriff (PDF)

Electromigration Damage Characterization in Sn-3.9Ag-0.7Cu and Sn-3.9Ag-0.7Cu-0.5Ce Solder Joints by Three-Dimensional X-ray Tomography and Scanning Electron Microscopy : LEAD-FREE SOLDERS

Journal of electronic materials, 2014, Vol.43 (1), p.33-42

2014

Volltextzugriff (PDF)

Kinetics of Reactive Diffusion in the (Pd-Cu)/Sn System at Solid-State Temperatures : PHASE STABILITY, PHASE TRANSFORMATIONS, AND REACTIVE PHASE FORMATION IN ELECTRONIC MATERIALS

Journal of electronic materials, 2014, Vol.43 (1), p.247-258

2014

Volltextzugriff (PDF)

IWCMM23

Computational materials science, 2014, Vol.94

2014

Volltextzugriff (PDF)

Polarity Effect in a Sn3Ag0.5Cu/Bismuth Telluride Thermoelectric System : PHASE STABILITY, PHASE TRANSFORMATIONS, AND REACTIVE PHASE FORMATION IN ELECTRONIC MATERIALS

Journal of electronic materials, 2014, Vol.43 (1), p.284-289

2014

Volltextzugriff (PDF)

Mitigation of Sn Whisker Growth by Small Bi Additions : LEAD-FREE SOLDERS

Journal of electronic materials, 2014, Vol.43 (1), p.1-8

2014

Volltextzugriff (PDF)

Incorporation of Interfacial Intermetallic Morphology in Fracture Mechanism Map for Sn-Ag-Cu Solder Joints : LEAD-FREE SOLDERS

Journal of electronic materials, 2014, Vol.43 (1), p.88-95

2014

Volltextzugriff (PDF)

Evaluation of Strain Measurement in a Die-to-Interposer Chip Using In Situ Synchrotron X-ray Diffraction and Finite-Element Analysis : LEAD-FREE SOLDERS

Journal of electronic materials, 2014, Vol.43 (1), p.52-56

2014

Volltextzugriff (PDF)

Thermal Expansion, Electrical Resistivity, and Spreading Area of Sn-Zn-In Alloys : Joining and Interface Design

Journal of materials engineering and performance, 2014, Vol.23 (5), p.1524-1529

2014

Volltextzugriff (PDF)

Theoretical Analysis of Melting Point Depression of Pure Metals in Different Initial Configurations : Joining and Interface Design

Journal of materials engineering and performance, 2014, Vol.23 (5), p.1600-1607

2014

Volltextzugriff (PDF)

In Situ Measurement of Stress and Whisker/Hillock Density During Thermal Cycling of Sn Layers : LEAD-FREE SOLDERS

Journal of electronic materials, 2014, Vol.43 (1), p.80-87

2014

Volltextzugriff (PDF)

Electromigration in Sintered Nanoscale Silver Films at Elevated Temperature : ADVANCED MATERIALS FOR POWER ELECTRONICS AND POWER CONDITIONING SYSTEMS

Journal of electronic materials, 2014, Vol.43 (1), p.109-116

2014

Volltextzugriff (PDF)

Structure-Property Correlations in CoFe-SiO2 Nanogranular Films Utilizing x-Ray Photoelectron Spectroscopy and Small-Angle Scattering Techniques : ADVANCED MATERIALS FOR POWER ELECTRONICS AND POWER CONDITIONING SYSTEMS

Journal of electronic materials, 2014, Vol.43 (1), p.142-150

2014

Volltextzugriff (PDF)

EBSD Investigation of Cu-Sn IMC Microstructural Evolution in Cu/Sn-Ag/Cu Microbumps During Isothermal Annealing : PHASE STABILITY, PHASE TRANSFORMATIONS, AND REACTIVE PHASE FORMATION IN ELECTRONIC MATERIALS

Journal of electronic materials, 2014, Vol.43 (1), p.219-228

2014

Volltextzugriff (PDF)

Investigation of Sn Whisker Growth in Electroplated Sn and Sn-Ag as a Function of Plating Variables and Storage Conditions : PHASE STABILITY, PHASE TRANSFORMATIONS, AND REACTIVE PHASE FORMATION IN ELECTRONIC MATERIALS

Journal of electronic materials, 2014, Vol.43 (1), p.259-269

2014

Volltextzugriff (PDF)

Characterization of ALD Beryllium Oxide as a Potential High-k Gate Dielectric for Low-Leakage AlGaN/GaN MOSHEMTs : ADVANCED MATERIALS FOR POWER ELECTRONICS AND POWER CONDITIONING SYSTEMS

Journal of electronic materials, 2014, Vol.43 (1), p.151-154

2014

Volltextzugriff (PDF)

Joule-Heating-Induced Damage in Cu-AI Wedge Bonds Under Current Stressing : PHASE STABILITY, PHASE TRANSFORMATIONS, AND REACTIVE PHASE FORMATION IN ELECTRONIC MATERIALS

Journal of electronic materials, 2014, Vol.43 (1), p.270-276

2014

Volltextzugriff (PDF)

Effect of Metal Bond-Pad Configurations on the Solder Microstructure Development of Flip-Chip Solder Joints : PHASE STABILITY, PHASE TRANSFORMATIONS, AND REACTIVE PHASE FORMATION IN ELECTRONIC MATERIALS

Journal of electronic materials, 2014, Vol.43 (1), p.170-175

2014

Volltextzugriff (PDF)

Evaluation of Electromigration Behaviors of Pb-Free Microbumps in Three-Dimensional Integrated Circuit Packaging : PHASE STABILITY, PHASE TRANSFORMATIONS, AND REACTIVE PHASE FORMATION IN ELECTRONIC MATERIALS

Journal of electronic materials, 2014, Vol.43 (1), p.236-246

2014

Volltextzugriff (PDF)

Enhanced Thermoelectric Performance of Nonstoichiometric Compounds Cu3−xSbSe4 by Cu Deficiencies

Journal of electronic materials, 2014, Vol.43 (6), p.2229-2238

2014

Volltextzugriff (PDF)

Interfacial Reactions in Cu/Ga and Cu/Ga/Cu Couples : PHASE STABILITY, PHASE TRANSFORMATIONS, AND REACTIVE PHASE FORMATION IN ELECTRONIC MATERIALS

Journal of electronic materials, 2014, Vol.43 (1), p.204-211

2014

Volltextzugriff (PDF)

Investigation of hydride powder bed swelling and shrinking during hydrogen absorption/desorption cycles under different compressive stresses

Journal of alloys and compounds, 2013, Vol.580, p.S149-S152

2013

Volltextzugriff (PDF)

Numerical Simulation of Trapped Field and Temperature Rise in MgB2 Bulks Magnetized by Pulsed Field

IEEE transactions on applied superconductivity, 2013, Vol.23 (3)

2013

Volltextzugriff (PDF)

1 – 25 von 3.507

Suche als RSS-Feed

Aktive Filter

SpracheSlowakisch

ThemaDefects And Impurities In Crystals; Microstructure

PublikationsformTagungsberichte

ThemaCondensed Matter: Structure, Mechanical And Thermal Properties

Suchergebnisse filtern

Filter anzeigen

Nur zeigen

Geprüft (Peer-Review)
(3.306)
Mit Volltextzugriff
(3.410)

Sprache

Erscheinungsjahr

n.n

Thema

14 weitere anzeigen...

Weniger anzeigen...

Menü

Weitere Dienste

Einstellungen

Thermoelectric properties of Zn4Sb3/CeFe(4-x)CoxSb12 nano-layered superlattices modified by MeV Si ion beam

Effects of POSS-Silanol Addition on Whisker Formation in Sn-Based Pb-Free Electronic Solders : LEAD-FREE SOLDERS

Thermoelectric Properties of Nanostructured Bismuth-Doped Lead Telluride Bix(PbTe)1−x Prepared by Co-Ball-Milling

Electromigration Damage Characterization in Sn-3.9Ag-0.7Cu and Sn-3.9Ag-0.7Cu-0.5Ce Solder Joints by Three-Dimensional X-ray Tomography and Scanning Electron Microscopy : LEAD-FREE SOLDERS

Kinetics of Reactive Diffusion in the (Pd-Cu)/Sn System at Solid-State Temperatures : PHASE STABILITY, PHASE TRANSFORMATIONS, AND REACTIVE PHASE FORMATION IN ELECTRONIC MATERIALS

IWCMM23

Polarity Effect in a Sn3Ag0.5Cu/Bismuth Telluride Thermoelectric System : PHASE STABILITY, PHASE TRANSFORMATIONS, AND REACTIVE PHASE FORMATION IN ELECTRONIC MATERIALS

Mitigation of Sn Whisker Growth by Small Bi Additions : LEAD-FREE SOLDERS

Incorporation of Interfacial Intermetallic Morphology in Fracture Mechanism Map for Sn-Ag-Cu Solder Joints : LEAD-FREE SOLDERS

Evaluation of Strain Measurement in a Die-to-Interposer Chip Using In Situ Synchrotron X-ray Diffraction and Finite-Element Analysis : LEAD-FREE SOLDERS

Thermal Expansion, Electrical Resistivity, and Spreading Area of Sn-Zn-In Alloys : Joining and Interface Design

Theoretical Analysis of Melting Point Depression of Pure Metals in Different Initial Configurations : Joining and Interface Design

In Situ Measurement of Stress and Whisker/Hillock Density During Thermal Cycling of Sn Layers : LEAD-FREE SOLDERS

Electromigration in Sintered Nanoscale Silver Films at Elevated Temperature : ADVANCED MATERIALS FOR POWER ELECTRONICS AND POWER CONDITIONING SYSTEMS

Structure-Property Correlations in CoFe-SiO2 Nanogranular Films Utilizing x-Ray Photoelectron Spectroscopy and Small-Angle Scattering Techniques : ADVANCED MATERIALS FOR POWER ELECTRONICS AND POWER CONDITIONING SYSTEMS

EBSD Investigation of Cu-Sn IMC Microstructural Evolution in Cu/Sn-Ag/Cu Microbumps During Isothermal Annealing : PHASE STABILITY, PHASE TRANSFORMATIONS, AND REACTIVE PHASE FORMATION IN ELECTRONIC MATERIALS

Investigation of Sn Whisker Growth in Electroplated Sn and Sn-Ag as a Function of Plating Variables and Storage Conditions : PHASE STABILITY, PHASE TRANSFORMATIONS, AND REACTIVE PHASE FORMATION IN ELECTRONIC MATERIALS

Characterization of ALD Beryllium Oxide as a Potential High-k Gate Dielectric for Low-Leakage AlGaN/GaN MOSHEMTs : ADVANCED MATERIALS FOR POWER ELECTRONICS AND POWER CONDITIONING SYSTEMS

Joule-Heating-Induced Damage in Cu-AI Wedge Bonds Under Current Stressing : PHASE STABILITY, PHASE TRANSFORMATIONS, AND REACTIVE PHASE FORMATION IN ELECTRONIC MATERIALS

Effect of Metal Bond-Pad Configurations on the Solder Microstructure Development of Flip-Chip Solder Joints : PHASE STABILITY, PHASE TRANSFORMATIONS, AND REACTIVE PHASE FORMATION IN ELECTRONIC MATERIALS

Evaluation of Electromigration Behaviors of Pb-Free Microbumps in Three-Dimensional Integrated Circuit Packaging : PHASE STABILITY, PHASE TRANSFORMATIONS, AND REACTIVE PHASE FORMATION IN ELECTRONIC MATERIALS

Enhanced Thermoelectric Performance of Nonstoichiometric Compounds Cu3−xSbSe4 by Cu Deficiencies

Interfacial Reactions in Cu/Ga and Cu/Ga/Cu Couples : PHASE STABILITY, PHASE TRANSFORMATIONS, AND REACTIVE PHASE FORMATION IN ELECTRONIC MATERIALS

Investigation of hydride powder bed swelling and shrinking during hydrogen absorption/desorption cycles under different compressive stresses

Numerical Simulation of Trapped Field and Temperature Rise in MgB2 Bulks Magnetized by Pulsed Field

Aktive Filter

Suchergebnisse filtern