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A 0.078 pJ/SOP Unstructured Sparsity-Aware Spiking Attention/Convolution Processor with 3D Compute Array

2024 IEEE Custom Integrated Circuits Conference (CICC), 2024, p.1-2

2024

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The 0-1 Programming Model for Solving Critical Path and its Sensitivity Analysis

2011 Fourth International Conference on Intelligent Computation Technology and Automation, 2011, Vol.2, p.1019-1022

2011

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A 0.18 mum CMOS Implementation of a Low Power, Fully Differential RF Front-End for FM-UWB Based P-PAN Receivers

2006 10th IEEE Singapore International Conference on Communication Systems, 2006, p.1-5

2006

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A 0.18 mum CMOS Low Power Ring VCO with 1 GHZ Tuning Range for 3-5 GHZ FM-UWB Applications

2006 10th IEEE Singapore International Conference on Communication Systems, 2006, p.1-5

2006

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A 0.18 /spl mu/m high dynamic range NTSC/PAL imaging system-on-chip with embedded DRAM frame buffer

2003 IEEE International Solid-State Circuits Conference, 2003. Digest of Technical Papers. ISSCC, 2003, p.212-488 vol.1

2003

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0.18 μm CMOS RF front-end chipset for FM-UWB based P-PAN receivers

Norchip 2007, 2007, p.1-4

2007

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A 0.18μm CMOS Fully Differential RF Demodulator for FM-UWB Based P-PAN Receivers

APCCAS 2006 - 2006 IEEE Asia Pacific Conference on Circuits and Systems, 2006, p.359-362

2006

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0.18μm CMOS limiting amplifier for 10Gb/s optical receiver

2012 IEEE MTT-S International Microwave Workshop Series on Millimeter Wave Wireless Technology and Applications, 2012, p.1-3

2012

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A 0.1V VIN dual-branch charge pump with second order advanced dynamic gate biasing for energy harvesting applications

AIP Conference Proceedings, 2024, Vol.3161 (1)

2024

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A 0.25 μm CMOS Low Power RF Multiplier for Ultra-wide Band System Applications

2005 IEEE Conference on Electron Devices and Solid-State Circuits, 2005, p.221-224

2005

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0.2CNT/NiSex composite derived from CNT/MOF-74 as electrode material for electrochemical capacitor and electrochemical sensor

Microchemical journal, 2021-09, Vol.168, p.106519, Article 106519

2021

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A 0.33 V 683 [Formula Omitted] K-Band Transformer-Based Receiver Front-End in 65 nm CMOS Technology

IEEE microwave and wireless technology letters (Print), 2015-03, Vol.25 (3), p.184

2015

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A 0.33 V 683 \mu K-Band Transformer-Based Receiver Front-End in 65 nm CMOS Technology

IEEE microwave and wireless components letters, 2015-03, Vol.25 (3), p.184-186

2015

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A 0.33 V 683 mu rmW K-Band Transformer-Based Receiver Front-End in 65 nm CMOS Technology

IEEE microwave and wireless components letters, 2015-03, Vol.25 (3), p.184-186

2015

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0.34 THz high speed on-off keying (OOK) signal direct detector based on Schottky diode

Infrared and Laser Engineering, 2017-08, Vol.46 (8), p.822001

2017

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A 0.35 /spl mu/m CMOS 4.8 Gb/s 4:1 multiplexer

IEEE 2002 International Conference on Communications, Circuits and Systems and West Sino Expositions, 2002, Vol.1, p.824-826 vol.1

2002

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0.36BiScO 3 -0.64PbTiO 3 /Epoxy 1-3-2 High-Temperature Composite Ultrasonic Transducer for Non-destructive Testing Applications

IEEE transactions on ultrasonics, ferroelectrics, and frequency control, 2024-04, Vol.PP

2024

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0.36BiScO 3 -0.64PbTiO 3 /Epoxy 1-3-2 High- Temperature Composite Ultrasonic Transducer for Nondestructive Testing Applications

IEEE transactions on ultrasonics, ferroelectrics, and frequency control, 2024-06, Vol.71 (6), p.638-647

2024

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0.36BiScO3-0.64PbTiO3/Epoxy 1-3-2 High- Temperature Composite Ultrasonic Transducer for Nondestructive Testing Applications

IEEE transactions on ultrasonics, ferroelectrics, and frequency control, 2024-06, Vol.71 (6), p.638-647

2024

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(Na 0.5 Bi 0.5 )TiO 3 : Synthesis and X-Ray Powder Diffraction Data

Powder diffraction, 1989-12, Vol.4 (4), p.223-224

1989

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0.5 mm spatial resolution distributed fiber temperature and strain sensor with position-deviation compensation based on OFDR

Optics express, 2019-11, Vol.27 (24), p.35823-35829

2019

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A 0.5358-approximation for Bandpass-2

Journal of combinatorial optimization, 2015-10, Vol.30 (3), p.612-626

2015

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A 0.55-mm2 8-bit 32-GS/s TI-SAR ADC with optimized hierarchical sampling architecture

Microelectronics, 2024-02, Vol.144, p.106095, Article 106095

2024

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0.59 mJ单频掺Yb3＋百纳秒脉冲全光纤激光器

Zhōngguó jīguāng, 2022, Vol.49 (13), p.1301005

2022

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0.5W X-Band SOI 4-Channel Beamforming TR IC

2021 IEEE 14th International Conference on ASIC (ASICON), 2021, p.1-4

2021

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A 0.078 pJ/SOP Unstructured Sparsity-Aware Spiking Attention/Convolution Processor with 3D Compute Array

The 0-1 Programming Model for Solving Critical Path and its Sensitivity Analysis

A 0.18 mum CMOS Implementation of a Low Power, Fully Differential RF Front-End for FM-UWB Based P-PAN Receivers

A 0.18 mum CMOS Low Power Ring VCO with 1 GHZ Tuning Range for 3-5 GHZ FM-UWB Applications

A 0.18 /spl mu/m high dynamic range NTSC/PAL imaging system-on-chip with embedded DRAM frame buffer

0.18 μm CMOS RF front-end chipset for FM-UWB based P-PAN receivers

A 0.18μm CMOS Fully Differential RF Demodulator for FM-UWB Based P-PAN Receivers

0.18μm CMOS limiting amplifier for 10Gb/s optical receiver

A 0.1V VIN dual-branch charge pump with second order advanced dynamic gate biasing for energy harvesting applications

A 0.25 μm CMOS Low Power RF Multiplier for Ultra-wide Band System Applications

0.2CNT/NiSex composite derived from CNT/MOF-74 as electrode material for electrochemical capacitor and electrochemical sensor

A 0.33 V 683 [Formula Omitted] K-Band Transformer-Based Receiver Front-End in 65 nm CMOS Technology

A 0.33 V 683 \mu K-Band Transformer-Based Receiver Front-End in 65 nm CMOS Technology

A 0.33 V 683 mu rmW K-Band Transformer-Based Receiver Front-End in 65 nm CMOS Technology

0.34 THz high speed on-off keying (OOK) signal direct detector based on Schottky diode

A 0.35 /spl mu/m CMOS 4.8 Gb/s 4:1 multiplexer

0.36BiScO 3 -0.64PbTiO 3 /Epoxy 1-3-2 High-Temperature Composite Ultrasonic Transducer for Non-destructive Testing Applications

0.36BiScO 3 -0.64PbTiO 3 /Epoxy 1-3-2 High- Temperature Composite Ultrasonic Transducer for Nondestructive Testing Applications

0.36BiScO3-0.64PbTiO3/Epoxy 1-3-2 High- Temperature Composite Ultrasonic Transducer for Nondestructive Testing Applications

(Na 0.5 Bi 0.5 )TiO 3 : Synthesis and X-Ray Powder Diffraction Data

0.5 mm spatial resolution distributed fiber temperature and strain sensor with position-deviation compensation based on OFDR

A 0.5358-approximation for Bandpass-2

A 0.55-mm2 8-bit 32-GS/s TI-SAR ADC with optimized hierarchical sampling architecture

0.59 mJ单频掺Yb3＋百纳秒脉冲全光纤激光器

0.5W X-Band SOI 4-Channel Beamforming TR IC

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