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Centering Sustainability in Process Development Through Improved Characterization of HFC-PFC Byproducts

IEEE transactions on semiconductor manufacturing, 2024-08, p.1-1

2024

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Utilizing photosensitive polymers to evaluate UV radiation exposures in different plasma chamber configurations

Journal of vacuum science & technology. A, Vacuum, surfaces, and films, 2020-05, Vol.38 (3)

2020

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Nitride etching with hydrofluorocarbons III: Comparison of C4H9F and CH3F for low-k′ nitride spacer etch processes

Journal of vacuum science and technology. B, Nanotechnology & microelectronics, 2018-05, Vol.36 (3)

2018

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Cover Picture: Plasma Process. Polym. 9/2019

Plasma processes and polymers, 2019-09, Vol.16 (9), p.n/a

2019

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Ultrahigh-Q on-chip silicon–germanium microresonators

Optica, 2022-03, Vol.9 (3), p.284

2022

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Nitride etching with hydrofluorocarbons. II. Evaluation of C4H9F for tight pitch Si3N4 patterning applications

Journal of vacuum science and technology. B, Nanotechnology & microelectronics, 2018-05, Vol.36 (3)

2018

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In-situ etch rate study of HfxLayOz in Cl-2/BCl3 plasmas using the quartz crystal microbalance

Journal of vacuum science & technology. A, Vacuum, surfaces, and films, 2015-05, Vol.33 (3)

2015

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In-situ etch rate study of Hf{sub x}La{sub y}O{sub z} in Cl{sub 2}/BCl{sub 3} plasmas using the quartz crystal microbalance

Journal of vacuum science & technology. A, Vacuum, surfaces, and films, 2015-05, Vol.33 (3)

2015

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In-situ etch rate study of HfxLayOz in Cl2/BCl3 plasmas using the quartz crystal microbalance

Journal of vacuum science & technology. A, Vacuum, surfaces, and films, 2015-05, Vol.33 (3)

2015

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Rethinking surface reactions in nanoscale dry processes toward atomic precision and beyond: a physics and chemistry perspective

Japanese Journal of Applied Physics, 2019-05, Vol.58 (SE)

2019

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Feature profile evolution during shallow trench isolation etching in chlorine-based plasmas. III. The effect of oxygen addition

Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, 2013-07, Vol.31 (4)

2013

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Applications for Surface Engineering Using Atomic Layer Etching - Invited Paper

Solid state phenomena, 2016-09, Vol.255, p.41-48

2016

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Area Selective Atomic Layer Deposition by Microcontact Printing with a Water-Soluble Polymer

Journal of the Electrochemical Society, 2010, Vol.157 (12), p.D600

2010

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Critical BEOL Aspects of the Fabrication of a Thermally-Assisted MRAM Device

ECS transactions, 2015-09, Vol.69 (3), p.127-137

2015

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Kinetic Modeling of Halogen-Based Plasma Etching of Complex Oxide Films and its Application to Predictive Feature Profile Simulation

Marchack, Nathan Philip

2012

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Novel Solder Pads for Self-Aligned Flip-Chip Assembly

2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 2019, p.528-534

2019

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Nanoscale Etching and Deposition

Plasma Processing of Nanomaterials, 2012, p.1-34

1, 2012

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Solder Mobility for High-Yield Self-Aligned Flip-Chip Assembly

2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 2017, p.667-674

2017

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Silicon Photonic Gas Sensing

2019 Optical Fiber Communications Conference and Exhibition (OFC), 2019, p.1-3

2019

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Trace-Gas Spectroscopy of Methane Using a Monolithically Integrated Silicon Photonic Chip Sensor

2019 Conference on Lasers and Electro-Optics (CLEO), 2019, p.1-2

2019

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Etching Methods for STT-MRAM

Meeting abstracts (Electrochemical Society), 2017-09, Vol.MA2017-02 (26), p.1138-1138

2017

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Critical BEOL Aspects of the Fabrication of a Thermally-Assisted MRAM Device

Meeting abstracts (Electrochemical Society), 2015-07, Vol.MA2015-02 (16), p.779-779

2015

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Centering Sustainability in Process Development Through Improved Characterization of HFC-PFC Byproducts

Utilizing photosensitive polymers to evaluate UV radiation exposures in different plasma chamber configurations

Nitride etching with hydrofluorocarbons III: Comparison of C4H9F and CH3F for low-k′ nitride spacer etch processes

Cover Picture: Plasma Process. Polym. 9/2019

Ultrahigh-Q on-chip silicon–germanium microresonators

Nitride etching with hydrofluorocarbons. II. Evaluation of C4H9F for tight pitch Si3N4 patterning applications

In-situ etch rate study of HfxLayOz in Cl-2/BCl3 plasmas using the quartz crystal microbalance

In-situ etch rate study of Hf{sub x}La{sub y}O{sub z} in Cl{sub 2}/BCl{sub 3} plasmas using the quartz crystal microbalance

In-situ etch rate study of HfxLayOz in Cl2/BCl3 plasmas using the quartz crystal microbalance

Rethinking surface reactions in nanoscale dry processes toward atomic precision and beyond: a physics and chemistry perspective

Feature profile evolution during shallow trench isolation etching in chlorine-based plasmas. III. The effect of oxygen addition

Applications for Surface Engineering Using Atomic Layer Etching - Invited Paper

Area Selective Atomic Layer Deposition by Microcontact Printing with a Water-Soluble Polymer

Critical BEOL Aspects of the Fabrication of a Thermally-Assisted MRAM Device

Kinetic Modeling of Halogen-Based Plasma Etching of Complex Oxide Films and its Application to Predictive Feature Profile Simulation

Novel Solder Pads for Self-Aligned Flip-Chip Assembly

Nanoscale Etching and Deposition

Solder Mobility for High-Yield Self-Aligned Flip-Chip Assembly

Silicon Photonic Gas Sensing

Trace-Gas Spectroscopy of Methane Using a Monolithically Integrated Silicon Photonic Chip Sensor

Etching Methods for STT-MRAM

Critical BEOL Aspects of the Fabrication of a Thermally-Assisted MRAM Device

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