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Air-Cooling Enhancement with Delta Winglet Vortex Generators in Entrance Region of In-Line Array Electronic Modules

Heat transfer engineering, 2007-04, Vol.28 (4), p.372-379

2007

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Analysis and Prediction of the Thermal Performance of Piezoelectrically Actuated Fans

Heat transfer engineering, 2009-05, Vol.30 (6), p.487-498

2009

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Analysis of Micro Vapor Bubble Growing Process in Open Capillary Microgrooves

Heat transfer engineering, 2011-06, Vol.32 (7-8), p.575-584

2011

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Analysis of Multilayer Mini- and Microchannel Heat Sinks in Single-Phase Flow Using One- and Two-Equation Porous Media Models

Heat transfer engineering, 2011-06, Vol.32 (7-8), p.566-574

2011

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Analytical Development and Computer Modeling of a Bellows-Type Heat Pipe for the Cooling of Electronic Components

Heat transfer engineering, 1988, Vol.9 (3), p.101-109

PETERSON, G. P.

1988

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An Analytical Model for EHD-Enhanced Microscale Thin-Film Evaporation

Heat transfer engineering, 2004-09, Vol.25 (6), p.14-22

DARABI, J.

2004

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An Assessment of Direct Chip Cooling Enhancement Using Pin Fins

Heat transfer engineering, 2012-07, Vol.33 (10), p.845-852

2012

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Cascaded Fins for Heat Transfer Enhancement

Heat transfer engineering, 2007-05, Vol.28 (5), p.451-459

2007

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Ceramic Miniature Heat Pipes and Liquid Charging Methods

Heat transfer engineering, 2010-06, Vol.31 (7), p.564-569

2010

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A CFD Study on the Effect of Shrinking Box Size on Cooling Airflows in Compact Electronic Equipment : The Case of Portable Projection Display Equipment: Recent topics in electronics cooling-From transistors to systems

Heat transfer engineering, 2008, Vol.29 (2), p.188-197

2008

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Challenges in Cooling Design of CPU Packages for High-Performance Servers: Recent topics in electronics cooling-From transistors to systems

Heat transfer engineering, 2008, Vol.29 (2), p.178-187

JIE WEI

2008

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Comparative Analysis of Microchannel Heat Sink Configurations Subject to a Pressure Constraint

Heat transfer engineering, 2009-01, Vol.30 (1-2), p.43-53

2009

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Comparison of Fluid Flow and Thermal Characteristics of Plate-Fin and Pin-Fin Heat Sinks Subject to a Parallel Flow: Recent topics in electronics cooling-From transistors to systems

Heat transfer engineering, 2008, Vol.29 (2), p.169-177

2008

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Constructal Optimization of Microchannel Heat Sinks With Noncircular Cross Sections

Heat transfer engineering, 2013-08, Vol.34 (10), p.863-874

2013

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Critical Heat Flux During Flow Boiling in Microchannels: A Parametric Study

Heat transfer engineering, 2009-06, Vol.30 (7), p.556-563

2009

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Departure from Natural Convection (DNC) in Low-Temperature Boiling Heat Transfer Encountered in Cooling Microelectronic LSI Devices

Heat transfer engineering, 1988-06, Vol.9 (3), p.93-100

OKTAY, S.

1988

Volltextzugriff (PDF)

Design and Fabrication of a Metallic Micro-Heat Pipe Based on High-Aspect-Ratio Microchannels

Heat transfer engineering, 2007-08, Vol.28 (8-9), p.772-778

2007

Volltextzugriff (PDF)

Design and Operation of a Novel Capillary Pumped Two-Loop System for Cooling of Electronic Devices

Heat transfer engineering, 2012-01, Vol.33 (1), p.12-20

2012

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The Design of Cold Plates for the Thermal Management of Electronic Equipment

Heat transfer engineering, 2006-08, Vol.27 (7), p.6-16

2006

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Design Optimization of a New Hot Heat Sink with a Rectangular Fin Array for Thermoelectric Dehumidifiers

Heat transfer engineering, 2007-07, Vol.28 (7), p.645-655

2007

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Detailed Heat Transfer Measurements of Curved Fin Channels

Heat transfer engineering, 2008-10, Vol.29 (10), p.849-863

2008

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Development and Characterization of Thermal Enhancement Structures for Single-Phase Liquid Cooling in Microelectronics Systems

Heat transfer engineering, 2007-12, Vol.28 (12), p.997-1007

2007

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Development of a Mini Liquid Cooling System for High-Heat-Flux Electronic Devices

Heat transfer engineering, 2011-06, Vol.32 (7-8), p.690-696

2011

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Development of an Experimental Facility for Investigating Single-Phase Liquid Flow in Microchannels

Heat transfer engineering, 2006-05, Vol.27 (4), p.41-52

2006

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Direct Comparison between Five Different Microchannels, Part 1: Channel Manufacture and Measurement

Heat transfer engineering, 2005-04, Vol.26 (3), p.79-88

2005

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Air-Cooling Enhancement with Delta Winglet Vortex Generators in Entrance Region of In-Line Array Electronic Modules

Analysis and Prediction of the Thermal Performance of Piezoelectrically Actuated Fans

Analysis of Micro Vapor Bubble Growing Process in Open Capillary Microgrooves

Analysis of Multilayer Mini- and Microchannel Heat Sinks in Single-Phase Flow Using One- and Two-Equation Porous Media Models

Analytical Development and Computer Modeling of a Bellows-Type Heat Pipe for the Cooling of Electronic Components

An Analytical Model for EHD-Enhanced Microscale Thin-Film Evaporation

An Assessment of Direct Chip Cooling Enhancement Using Pin Fins

Cascaded Fins for Heat Transfer Enhancement

Ceramic Miniature Heat Pipes and Liquid Charging Methods

A CFD Study on the Effect of Shrinking Box Size on Cooling Airflows in Compact Electronic Equipment : The Case of Portable Projection Display Equipment: Recent topics in electronics cooling-From transistors to systems

Challenges in Cooling Design of CPU Packages for High-Performance Servers: Recent topics in electronics cooling-From transistors to systems

Comparative Analysis of Microchannel Heat Sink Configurations Subject to a Pressure Constraint

Comparison of Fluid Flow and Thermal Characteristics of Plate-Fin and Pin-Fin Heat Sinks Subject to a Parallel Flow: Recent topics in electronics cooling-From transistors to systems

Constructal Optimization of Microchannel Heat Sinks With Noncircular Cross Sections

Critical Heat Flux During Flow Boiling in Microchannels: A Parametric Study

Departure from Natural Convection (DNC) in Low-Temperature Boiling Heat Transfer Encountered in Cooling Microelectronic LSI Devices

Design and Fabrication of a Metallic Micro-Heat Pipe Based on High-Aspect-Ratio Microchannels

Design and Operation of a Novel Capillary Pumped Two-Loop System for Cooling of Electronic Devices

The Design of Cold Plates for the Thermal Management of Electronic Equipment

Design Optimization of a New Hot Heat Sink with a Rectangular Fin Array for Thermoelectric Dehumidifiers

Detailed Heat Transfer Measurements of Curved Fin Channels

Development and Characterization of Thermal Enhancement Structures for Single-Phase Liquid Cooling in Microelectronics Systems

Development of a Mini Liquid Cooling System for High-Heat-Flux Electronic Devices

Development of an Experimental Facility for Investigating Single-Phase Liquid Flow in Microchannels

Direct Comparison between Five Different Microchannels, Part 1: Channel Manufacture and Measurement

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