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High-Current GaSb/InAs(Sb) Nanowire Tunnel Field-Effect Transistors

IEEE electron device letters, 2013-02, Vol.34 (2), p.211-213

2013

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IEEE_Xplore

High-Frequency Gate-All-Around Vertical InAs Nanowire MOSFETs on Si Substrates

IEEE electron device letters, 2014-05, Vol.35 (5), p.518-520

2014

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IEEE_Xplore

Extrinsic and Intrinsic Performance of Vertical InAs Nanowire MOSFETs on Si Substrates

IEEE transactions on electron devices, 2013-09, Vol.60 (9), p.2761-2767

2013

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IEEE_Xplore

GaN Technology for Power Electronic Applications: A Review

Journal of Electronic Materials, 2016-06, Vol.45 (6), p.2673-2682

2016

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Thermo-mechanical Characterization of Metal/Polymer Composite Filaments and Printing Parameter Study for Fused Deposition Modeling in the 3D Printing Process

Journal of electronic materials, 2015-03, Vol.44 (3), p.771-777

2015

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A review of high-temperature electronics technology and applications

Journal of Materials Science. Materials in Electronics, 2015-12, Vol.26 (12), p.9226-9235

2015

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Transfer printing techniques for flexible and stretchable inorganic electronics

Npj flexible electronics, 2018-10, Vol.2 (1), p.1-14, Article 26

2018

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Energy autonomous electronic skin

Npj flexible electronics, 2019-01, Vol.3 (1), p.1-24, Article 1

2019

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Flexible quantum dot light-emitting diodes for next-generation displays

Npj flexible electronics, 2018-04, Vol.2 (1), p.1-14, Article 10

2018

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Ultra-thin chips for high-performance flexible electronics

Npj flexible electronics, 2018-03, Vol.2 (1), p.1-17, Article 8

2018

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Modifying Poly(Vinyl Alcohol) (PVA) from Insulator to Small-Bandgap Polymer: A Novel Approach for Organic Solar Cells and Optoelectronic Devices

Journal of electronic materials, 2016-01, Vol.45 (1), p.736-745

Aziz, Shujahadeen B.

2016

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Die Attach Materials for High Temperature Applications: A Review

IEEE transactions on components, packaging, and manufacturing technology (2011), 2011-04, Vol.1 (4), p.457-478

2011

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IEEE_Xplore

Thermoelectric Modules Based on Half-Heusler Materials Produced in Large Quantities

Journal of electronic materials, 2014-06, Vol.43 (6), p.1775-1781

2014

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A tailored, electronic textile conformable suit for large-scale spatiotemporal physiological sensing in vivo

Npj flexible electronics, 2020-01, Vol.4 (1), p.5-5, Article 5

2020

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Inkjet printing of conductive materials: a review

Circuit world, 2012-11, Vol.38 (4), p.193-213

2012

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Review of carbon nanotube nanoelectronics and macroelectronics

Semiconductor science and technology, 2014-07, Vol.29 (7), p.73001

2014

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Sensitivity of Threshold Voltage to Nanowire Width Variation in Junctionless Transistors

IEEE electron device letters, 2011-02, Vol.32 (2), p.125-127

2011

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IEEE_Xplore

Flexible, transparent nanocellulose paper-based perovskite solar cells

Npj flexible electronics, 2019-02, Vol.3 (1), p.1-8, Article 4

2019

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CNTFET-Based Design of Ternary Logic Gates and Arithmetic Circuits

IEEE transactions on nanotechnology, 2011-03, Vol.10 (2), p.217-225

2011

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IEEE_Xplore

Reactive Sintering of Copper Nanoparticles Using Intense Pulsed Light for Printed Electronics

Journal of electronic materials, 2011-01, Vol.40 (1), p.42-50

2011

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Physical, Mechanical, and Structural Properties of Highly Efficient Nanostructured n- and p-Silicides for Practical Thermoelectric Applications

Journal of electronic materials, 2014-06, Vol.43 (6), p.1703-1711

2014

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Compact AC Modeling and Performance Analysis of Through-Silicon Vias in 3-D ICs

IEEE transactions on electron devices, 2010-12, Vol.57 (12), p.3405-3417

2010

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IEEE_Xplore

Joint Energy Harvesting and Communication Analysis for Perpetual Wireless Nanosensor Networks in the Terahertz Band

IEEE transactions on nanotechnology, 2012-05, Vol.11 (3), p.570-580

2012

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IEEE_Xplore

Inorganic semiconducting materials for flexible and stretchable electronics

Npj flexible electronics, 2017-09, Vol.1 (1), p.1-14, Article 4

2017

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Review on Joint Shear Strength of Nano-Silver Paste and Its Long-Term High Temperature Reliability

Journal of electronic materials, 2014-07, Vol.43 (7), p.2459-2466

2014

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High-Current GaSb/InAs(Sb) Nanowire Tunnel Field-Effect Transistors

High-Frequency Gate-All-Around Vertical InAs Nanowire MOSFETs on Si Substrates

Extrinsic and Intrinsic Performance of Vertical InAs Nanowire MOSFETs on Si Substrates

GaN Technology for Power Electronic Applications: A Review

Thermo-mechanical Characterization of Metal/Polymer Composite Filaments and Printing Parameter Study for Fused Deposition Modeling in the 3D Printing Process

A review of high-temperature electronics technology and applications

Transfer printing techniques for flexible and stretchable inorganic electronics

Energy autonomous electronic skin

Flexible quantum dot light-emitting diodes for next-generation displays

Ultra-thin chips for high-performance flexible electronics

Modifying Poly(Vinyl Alcohol) (PVA) from Insulator to Small-Bandgap Polymer: A Novel Approach for Organic Solar Cells and Optoelectronic Devices

Die Attach Materials for High Temperature Applications: A Review

Thermoelectric Modules Based on Half-Heusler Materials Produced in Large Quantities

A tailored, electronic textile conformable suit for large-scale spatiotemporal physiological sensing in vivo

Inkjet printing of conductive materials: a review

Review of carbon nanotube nanoelectronics and macroelectronics

Sensitivity of Threshold Voltage to Nanowire Width Variation in Junctionless Transistors

Flexible, transparent nanocellulose paper-based perovskite solar cells

CNTFET-Based Design of Ternary Logic Gates and Arithmetic Circuits

Reactive Sintering of Copper Nanoparticles Using Intense Pulsed Light for Printed Electronics

Physical, Mechanical, and Structural Properties of Highly Efficient Nanostructured n- and p-Silicides for Practical Thermoelectric Applications

Compact AC Modeling and Performance Analysis of Through-Silicon Vias in 3-D ICs

Joint Energy Harvesting and Communication Analysis for Perpetual Wireless Nanosensor Networks in the Terahertz Band

Inorganic semiconducting materials for flexible and stretchable electronics

Review on Joint Shear Strength of Nano-Silver Paste and Its Long-Term High Temperature Reliability

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