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GaN Technology for Power Electronic Applications: A Review

Journal of Electronic Materials, 2016-06, Vol.45 (6), p.2673-2682

2016

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Thermo-mechanical Characterization of Metal/Polymer Composite Filaments and Printing Parameter Study for Fused Deposition Modeling in the 3D Printing Process

Journal of electronic materials, 2015-03, Vol.44 (3), p.771-777

2015

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A review of high-temperature electronics technology and applications

Journal of Materials Science. Materials in Electronics, 2015-12, Vol.26 (12), p.9226-9235

2015

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Modifying Poly(Vinyl Alcohol) (PVA) from Insulator to Small-Bandgap Polymer: A Novel Approach for Organic Solar Cells and Optoelectronic Devices

Journal of electronic materials, 2016-01, Vol.45 (1), p.736-745

Aziz, Shujahadeen B.

2016

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Thermoelectric Modules Based on Half-Heusler Materials Produced in Large Quantities

Journal of electronic materials, 2014-06, Vol.43 (6), p.1775-1781

2014

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Reactive Sintering of Copper Nanoparticles Using Intense Pulsed Light for Printed Electronics

Journal of electronic materials, 2011-01, Vol.40 (1), p.42-50

2011

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Physical, Mechanical, and Structural Properties of Highly Efficient Nanostructured n- and p-Silicides for Practical Thermoelectric Applications

Journal of electronic materials, 2014-06, Vol.43 (6), p.1703-1711

2014

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Review on Joint Shear Strength of Nano-Silver Paste and Its Long-Term High Temperature Reliability

Journal of electronic materials, 2014-07, Vol.43 (7), p.2459-2466

2014

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Microwave ferrites, part 1: fundamental properties

Journal of materials science. Materials in electronics, 2009-09, Vol.20 (9), p.789-834

2009

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Transport Properties of Bulk Thermoelectrics: An International Round-Robin Study, Part II: Thermal Diffusivity, Specific Heat, and Thermal Conductivity

Journal of electronic materials, 2013-06, Vol.42 (6), p.1073-1084

2013

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Thermoelectric Generation Using Waste Heat in Steel Works

Journal of electronic materials, 2014-06, Vol.43 (6), p.2405-2410

2014

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Transport Properties of Bulk Thermoelectrics—An International Round-Robin Study, Part I: Seebeck Coefficient and Electrical Resistivity

Journal of electronic materials, 2013-04, Vol.42 (4), p.654-664

2013

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Properties and Printability of Inkjet and Screen-Printed Silver Patterns for RFID Antennas

Journal of electronic materials, 2014-02, Vol.43 (2), p.604-617

2014

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Thiophene-based molecular and polymeric semiconductors for organic field effect transistors and organic thin film transistors

Journal of materials science. Materials in electronics, 2018-11, Vol.29 (21), p.17975-18010

2018

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Thermoelectric Properties and Thermal Stability of PEDOT:PSS Films on a Polyimide Substrate and Application in Flexible Energy Conversion Devices

Journal of electronic materials, 2014-06, Vol.43 (6), p.2196-2201

2014

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Thermal Cycling, Mechanical Degradation, and the Effective Figure of Merit of a Thermoelectric Module

Journal of electronic materials, 2013-03, Vol.42 (3), p.372-381

2013

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Effect of Copper TSV Annealing on Via Protrusion for TSV Wafer Fabrication

Journal of electronic materials, 2012-09, Vol.41 (9), p.2533-2542

2012

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Synthesis and characterization of NiO nanoparticles by sol–gel method

Journal of materials science. Materials in electronics, 2012-03, Vol.23 (3), p.728-732

2012

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Determination of Thermoelectric Module Efficiency: A Survey

Journal of electronic materials, 2014-06, Vol.43 (6), p.2274-2286

2014

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Thin-film solar cells : review of materials, technologies and commercial status

Journal of materials science. Materials in electronics, 2007-10, Vol.18 (S1), p.15-19

GREEN, Martin A

2007

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Solar Thermoelectric Generator for Micropower Applications

Journal of electronic materials, 2010-09, Vol.39 (9), p.1735-1740

2010

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Influence of Joining Conditions on Bonding Strength of Joints: Efficacy of Low-Temperature Bonding Using Cu Nanoparticle Paste

Journal of electronic materials, 2013-06, Vol.42 (6), p.1260-1267

2013

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Design of a Concentration Solar Thermoelectric Generator

Journal of electronic materials, 2010-09, Vol.39 (9), p.1522-1530

2010

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Cu-Sn Intermetallic Compound Joints for High-Temperature Power Electronics Applications

Journal of electronic materials, 2018-01, Vol.47 (1), p.430-435

2018

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Silver Nanoparticle Paste for Low-Temperature Bonding of Copper

Journal of electronic materials, 2011-06, Vol.40 (6), p.1394-1402

2011

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GaN Technology for Power Electronic Applications: A Review

Thermo-mechanical Characterization of Metal/Polymer Composite Filaments and Printing Parameter Study for Fused Deposition Modeling in the 3D Printing Process

A review of high-temperature electronics technology and applications

Modifying Poly(Vinyl Alcohol) (PVA) from Insulator to Small-Bandgap Polymer: A Novel Approach for Organic Solar Cells and Optoelectronic Devices

Thermoelectric Modules Based on Half-Heusler Materials Produced in Large Quantities

Reactive Sintering of Copper Nanoparticles Using Intense Pulsed Light for Printed Electronics

Physical, Mechanical, and Structural Properties of Highly Efficient Nanostructured n- and p-Silicides for Practical Thermoelectric Applications

Review on Joint Shear Strength of Nano-Silver Paste and Its Long-Term High Temperature Reliability

Microwave ferrites, part 1: fundamental properties

Transport Properties of Bulk Thermoelectrics: An International Round-Robin Study, Part II: Thermal Diffusivity, Specific Heat, and Thermal Conductivity

Thermoelectric Generation Using Waste Heat in Steel Works

Transport Properties of Bulk Thermoelectrics—An International Round-Robin Study, Part I: Seebeck Coefficient and Electrical Resistivity

Properties and Printability of Inkjet and Screen-Printed Silver Patterns for RFID Antennas

Thiophene-based molecular and polymeric semiconductors for organic field effect transistors and organic thin film transistors

Thermoelectric Properties and Thermal Stability of PEDOT:PSS Films on a Polyimide Substrate and Application in Flexible Energy Conversion Devices

Thermal Cycling, Mechanical Degradation, and the Effective Figure of Merit of a Thermoelectric Module

Effect of Copper TSV Annealing on Via Protrusion for TSV Wafer Fabrication

Synthesis and characterization of NiO nanoparticles by sol–gel method

Determination of Thermoelectric Module Efficiency: A Survey

Thin-film solar cells : review of materials, technologies and commercial status

Solar Thermoelectric Generator for Micropower Applications

Influence of Joining Conditions on Bonding Strength of Joints: Efficacy of Low-Temperature Bonding Using Cu Nanoparticle Paste

Design of a Concentration Solar Thermoelectric Generator

Cu-Sn Intermetallic Compound Joints for High-Temperature Power Electronics Applications

Silver Nanoparticle Paste for Low-Temperature Bonding of Copper

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