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A review of high-temperature electronics technology and applications

Journal of Materials Science. Materials in Electronics, 2015-12, Vol.26 (12), p.9226-9235

2015

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A review of lead-free solders for electronics applications

Microelectronics and reliability, 2017-08, Vol.75, p.77-95

2017

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GaN Technology for Power Electronic Applications: A Review

Journal of Electronic Materials, 2016-06, Vol.45 (6), p.2673-2682

2016

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III-Nitride Based Light Emitting Diodes and Applications

2017

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Thermo-mechanical Characterization of Metal/Polymer Composite Filaments and Printing Parameter Study for Fused Deposition Modeling in the 3D Printing Process

Journal of electronic materials, 2015-03, Vol.44 (3), p.771-777

2015

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Synthesis and characterization of NiO nanoparticles by sol–gel method

Journal of materials science. Materials in electronics, 2012-03, Vol.23 (3), p.728-732

2012

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High-Temperature Superconductors

Saxena, Ajay Kumar

1, 2009

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Measurement of stresses in Cu and Si around through-silicon via by synchrotron X-ray microdiffraction for 3-dimensional integrated circuits

Microelectronics and reliability, 2012-03, Vol.52 (3), p.530-533

2012

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Failure and reliability analysis of STT-MRAM

Microelectronics and reliability, 2012-09, Vol.52 (9-10), p.1848-1852

2012

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Digital Electronics and Analog Photonics for Convolutional Neural Networks (DEAP-CNNs)

IEEE journal of selected topics in quantum electronics, 2020-01, Vol.26 (1), p.1-13

2020

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Stochastic charge trapping in oxides: From random telegraph noise to bias temperature instabilities

Microelectronics and reliability, 2012, Vol.52 (1), p.39-70

Grasser, Tibor

2012

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Thiophene-based molecular and polymeric semiconductors for organic field effect transistors and organic thin film transistors

Journal of materials science. Materials in electronics, 2018-11, Vol.29 (21), p.17975-18010

2018

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Reactive Sintering of Copper Nanoparticles Using Intense Pulsed Light for Printed Electronics

Journal of electronic materials, 2011-01, Vol.40 (1), p.42-50

2011

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Optimized Cu-Sn Wafer-Level Bonding Using Intermetallic Phase Characterization

Journal of electronic materials, 2013-12, Vol.42 (12), p.3582-3592

2013

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Ammonia gas sensing behavior of graphene surface decorated with gold nanoparticles

Solid-state electronics, 2012-12, Vol.78, p.159-165

2012

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Modifying Poly(Vinyl Alcohol) (PVA) from Insulator to Small-Bandgap Polymer: A Novel Approach for Organic Solar Cells and Optoelectronic Devices

Journal of electronic materials, 2016-01, Vol.45 (1), p.736-745

Aziz, Shujahadeen B.

2016

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Properties and Printability of Inkjet and Screen-Printed Silver Patterns for RFID Antennas

Journal of electronic materials, 2014-02, Vol.43 (2), p.604-617

2014

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Are Sintered Silver Joints Ready for Use as Interconnect Material in Microelectronic Packaging?

Journal of electronic materials, 2014-04, Vol.43 (4), p.947-961

Siow, Kim S.

2014

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Junctionless Nanowire Transistor (JNT): Properties and design guidelines

Solid-state electronics, 2011-11, Vol.65-66, p.33-37

2011

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GaSb: A New Alternative Substrate for Epitaxial Growth of HgCdTe

Journal of electronic materials, 2014-08, Vol.43 (8), p.2788-2794

2014

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Two-Dimensional Transition-Metal Dichalcogenides

1, 2016

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Optical Metamaterials: Fundamentals and Applications

1. Aufl., 2010

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Photolithographic properties of tin-oxo clusters using extreme ultraviolet light (13.5nm)

Microelectronic engineering, 2014-09, Vol.127, p.44-50

2014

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Revisiting MOSFET threshold voltage extraction methods

Microelectronics and reliability, 2013-01, Vol.53 (1), p.90-104

2013

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Analytical model for ultra-thin body junctionless symmetric double gate MOSFETs in subthreshold regime

Solid-state electronics, 2013-04, Vol.82, p.103-110

2013

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A review of high-temperature electronics technology and applications

A review of lead-free solders for electronics applications

GaN Technology for Power Electronic Applications: A Review

III-Nitride Based Light Emitting Diodes and Applications

Thermo-mechanical Characterization of Metal/Polymer Composite Filaments and Printing Parameter Study for Fused Deposition Modeling in the 3D Printing Process

Synthesis and characterization of NiO nanoparticles by sol–gel method

High-Temperature Superconductors

Measurement of stresses in Cu and Si around through-silicon via by synchrotron X-ray microdiffraction for 3-dimensional integrated circuits

Failure and reliability analysis of STT-MRAM

Digital Electronics and Analog Photonics for Convolutional Neural Networks (DEAP-CNNs)

Stochastic charge trapping in oxides: From random telegraph noise to bias temperature instabilities

Thiophene-based molecular and polymeric semiconductors for organic field effect transistors and organic thin film transistors

Reactive Sintering of Copper Nanoparticles Using Intense Pulsed Light for Printed Electronics

Optimized Cu-Sn Wafer-Level Bonding Using Intermetallic Phase Characterization

Ammonia gas sensing behavior of graphene surface decorated with gold nanoparticles

Modifying Poly(Vinyl Alcohol) (PVA) from Insulator to Small-Bandgap Polymer: A Novel Approach for Organic Solar Cells and Optoelectronic Devices

Properties and Printability of Inkjet and Screen-Printed Silver Patterns for RFID Antennas

Are Sintered Silver Joints Ready for Use as Interconnect Material in Microelectronic Packaging?

Junctionless Nanowire Transistor (JNT): Properties and design guidelines

GaSb: A New Alternative Substrate for Epitaxial Growth of HgCdTe

Two-Dimensional Transition-Metal Dichalcogenides

Optical Metamaterials: Fundamentals and Applications

Photolithographic properties of tin-oxo clusters using extreme ultraviolet light (13.5nm)

Revisiting MOSFET threshold voltage extraction methods

Analytical model for ultra-thin body junctionless symmetric double gate MOSFETs in subthreshold regime

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