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Optimized Cu-Sn Wafer-Level Bonding Using Intermetallic Phase Characterization

Journal of electronic materials, 2013-12, Vol.42 (12), p.3582-3592

2013

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Are Sintered Silver Joints Ready for Use as Interconnect Material in Microelectronic Packaging?

Journal of electronic materials, 2014-04, Vol.43 (4), p.947-961

Siow, Kim S.

2014

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Properties and Printability of Inkjet and Screen-Printed Silver Patterns for RFID Antennas

Journal of electronic materials, 2014-02, Vol.43 (2), p.604-617

2014

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GaSb: A New Alternative Substrate for Epitaxial Growth of HgCdTe

Journal of electronic materials, 2014-08, Vol.43 (8), p.2788-2794

2014

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GaN Technology for Power Electronic Applications: A Review

Journal of Electronic Materials, 2016-06, Vol.45 (6), p.2673-2682

2016

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Evaluation of Diffusion Barrier Between Lead-Free Solder Systems and Thermoelectric Materials

Journal of electronic materials, 2012, Vol.41 (1), p.153-158

2012

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Thermo-mechanical Characterization of Metal/Polymer Composite Filaments and Printing Parameter Study for Fused Deposition Modeling in the 3D Printing Process

Journal of electronic materials, 2015-03, Vol.44 (3), p.771-777

2015

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A Critical Review of the Role of Carbon Nanotubes in the Progress of Next-Generation Electronic Applications

Journal of electronic materials, 2022, Vol.51 (6), p.2786-2800

2022

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Fabrication of a Flexible Bismuth Telluride Power Generation Module Using Microporous Polyimide Films as Substrates

Journal of electronic materials, 2014-06, Vol.43 (6), p.1733-1739

2014

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MBE HgCdTe Technology: A Very General Solution to IR Detection, Described by “Rule 07”, a Very Convenient Heuristic

Journal of electronic materials, 2008-09, Vol.37 (9), p.1406-1410

2008

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Suitable Thicknesses of Base Metal and Interlayer, and Evolution of Phases for Ag/Sn/Ag Transient liquid-phase Joints Used for Power Die Attachment

Journal of electronic materials, 2014-04, Vol.43 (4), p.983-995

2014

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A Review on Printed Electronics with Digital 3D Printing: Fabrication Techniques, Materials, Challenges and Future Opportunities

Journal of electronic materials, 2022-06, Vol.51 (6), p.2747-2765

2022

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Reactive Sintering of Copper Nanoparticles Using Intense Pulsed Light for Printed Electronics

Journal of electronic materials, 2011-01, Vol.40 (1), p.42-50

2011

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Sintering of Inkjet-Printed Silver Nanoparticles at Room Temperature Using Intense Pulsed Light

Journal of electronic materials, 2011-11, Vol.40 (11), p.2268-2277

2011

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Antimonide-Based Type II Superlattices: A Superior Candidate for the Third Generation of Infrared Imaging Systems

Journal of electronic materials, 2014-08, Vol.43 (8), p.2802-2807

2014

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Thermoelectric Generation Using Waste Heat in Steel Works

Journal of electronic materials, 2014-06, Vol.43 (6), p.2405-2410

2014

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Modifying Poly(Vinyl Alcohol) (PVA) from Insulator to Small-Bandgap Polymer: A Novel Approach for Organic Solar Cells and Optoelectronic Devices

Journal of electronic materials, 2016-01, Vol.45 (1), p.736-745

Aziz, Shujahadeen B.

2016

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A Simple Process for Synthesis of Ag Nanoparticles and Sintering of Conductive Ink for Use in Printed Electronics

Journal of electronic materials, 2012-01, Vol.41 (1), p.115-121

2012

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A Review of the Characterization Techniques for the Analysis of Etch Processed Surfaces of HgCdTe and Related Compounds

Journal of electronic materials, 2014-09, Vol.43 (9), p.3708-3717

2014

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High-Temperature Capacitor Polymer Films

Journal of electronic materials, 2014-12, Vol.43 (12), p.4569-4575

2014

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Bulk Growth of CdZnTe: Quality Improvement and Size Increase

Journal of electronic materials, 2014-08, Vol.43 (8), p.2901-2907

2014

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Growth of ZnSnN2 by Molecular Beam Epitaxy

Journal of electronic materials, 2014-04, Vol.43 (4), p.884-888

2014

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“Rule 07” Revisited: Still a Good Heuristic Predictor of p/n HgCdTe Photodiode Performance?

Journal of electronic materials, 2010-07, Vol.39 (7), p.1030-1035

Tennant, W. E.

2010

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Studies on Conducting Polypyrrole/Graphene Oxide Composites as Supercapacitor Electrode

Journal of electronic materials, 2011-11, Vol.40 (11), p.2248-2255

2011

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Thermal Parameters, Microstructure, and Mechanical Properties of Directionally Solidified Sn-0.7 wt.%Cu Solder Alloys Containing 0 ppm to 1000 ppm Ni

Journal of electronic materials, 2013-01, Vol.42 (1), p.179-191

2013

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Optimized Cu-Sn Wafer-Level Bonding Using Intermetallic Phase Characterization

Are Sintered Silver Joints Ready for Use as Interconnect Material in Microelectronic Packaging?

Properties and Printability of Inkjet and Screen-Printed Silver Patterns for RFID Antennas

GaSb: A New Alternative Substrate for Epitaxial Growth of HgCdTe

GaN Technology for Power Electronic Applications: A Review

Evaluation of Diffusion Barrier Between Lead-Free Solder Systems and Thermoelectric Materials

Thermo-mechanical Characterization of Metal/Polymer Composite Filaments and Printing Parameter Study for Fused Deposition Modeling in the 3D Printing Process

A Critical Review of the Role of Carbon Nanotubes in the Progress of Next-Generation Electronic Applications

Fabrication of a Flexible Bismuth Telluride Power Generation Module Using Microporous Polyimide Films as Substrates

MBE HgCdTe Technology: A Very General Solution to IR Detection, Described by “Rule 07”, a Very Convenient Heuristic

Suitable Thicknesses of Base Metal and Interlayer, and Evolution of Phases for Ag/Sn/Ag Transient liquid-phase Joints Used for Power Die Attachment

A Review on Printed Electronics with Digital 3D Printing: Fabrication Techniques, Materials, Challenges and Future Opportunities

Reactive Sintering of Copper Nanoparticles Using Intense Pulsed Light for Printed Electronics

Sintering of Inkjet-Printed Silver Nanoparticles at Room Temperature Using Intense Pulsed Light

Antimonide-Based Type II Superlattices: A Superior Candidate for the Third Generation of Infrared Imaging Systems

Thermoelectric Generation Using Waste Heat in Steel Works

Modifying Poly(Vinyl Alcohol) (PVA) from Insulator to Small-Bandgap Polymer: A Novel Approach for Organic Solar Cells and Optoelectronic Devices

A Simple Process for Synthesis of Ag Nanoparticles and Sintering of Conductive Ink for Use in Printed Electronics

A Review of the Characterization Techniques for the Analysis of Etch Processed Surfaces of HgCdTe and Related Compounds

High-Temperature Capacitor Polymer Films

Bulk Growth of CdZnTe: Quality Improvement and Size Increase

Growth of ZnSnN2 by Molecular Beam Epitaxy

“Rule 07” Revisited: Still a Good Heuristic Predictor of p/n HgCdTe Photodiode Performance?

Studies on Conducting Polypyrrole/Graphene Oxide Composites as Supercapacitor Electrode

Thermal Parameters, Microstructure, and Mechanical Properties of Directionally Solidified Sn-0.7 wt.%Cu Solder Alloys Containing 0 ppm to 1000 ppm Ni

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