UB Paderborn / Katalog / Suche / in CDI

1 – 25 von 185

Sortiert nach

Etching characteristics of silicon oxide using amorphous carbon hard mask in dual-frequency capacitively coupled plasma

Thin solid films, 2012-10, Vol.521, p.83-88

2012

Volltextzugriff (PDF)

Enhancement of flexural stress and reduction of surface roughness through changes in gas concentrations during high-speed chemical dry thinning of silicon wafers

Thin solid films, 2013-11, Vol.547, p.173-177

2013

Volltextzugriff (PDF)

Fast release process of metal structure using chemical dry etching of sacrificial Si layer

Thin solid films, 2011-08, Vol.519 (20), p.6769-6772

2011

Volltextzugriff (PDF)

Enhanced critical current density in GdBa2Cu3O7−δ thin films with substrate surface decoration using Gd2O3 nanoparticles

Thin solid films, 2012-12, Vol.526, p.241-245

2012

Volltextzugriff (PDF)

Polymer thin film transistor with electroplated source and drain electrodes on a flexible substrate

Thin solid films, 2006-10, Vol.515 (2), p.805-809

2006

Volltextzugriff (PDF)

Development of surface coating technology of TiO2 powder and improvement of photocatalytic activity by surface modification

Thin solid films, 2005-03, Vol.475 (1-2), p.171-177

2005

Volltextzugriff (PDF)

The effects of gas flow rates on the etch characteristics of silicon nitride with an extreme ultra-violet resist pattern in CH2F2/N2/Ar capacitively coupled plasmas

Thin solid films, 2011-08, Vol.519 (20), p.6741-6745

2011

Volltextzugriff (PDF)

Highly selective dry etching of alternating phase-shift mask (PSM) structures for extreme ultraviolet lithography (EUVL) using inductively coupled plasmas (ICP)

Thin solid films, 2009-05, Vol.517 (14), p.3938-3941

2009

Volltextzugriff (PDF)

Physical properties and etching characteristics of metal (Al, Ag, Li) doped ZnO films grown by RF magnetron sputtering

Thin solid films, 2008-08, Vol.516 (19), p.6598-6603

2008

Volltextzugriff (PDF)

Electrical characteristics of poly(3-hexylthiophene) organic thin film transistor with electroplated metal gate electrodes on polyimide

Thin solid films, 2007-04, Vol.515 (12), p.5065-5069

2007

Volltextzugriff (PDF)

Effect of doping elements on ZnO etching characteristics with CH4/H2/Ar plasma

Thin solid films, 2007-04, Vol.515 (12), p.4950-4954

2007

Volltextzugriff (PDF)

Superconformal copper filling of a nano-scale trench by nucleation suppression at the trench entrance during metal organic chemical vapor deposition

Thin solid films, 2010-09, Vol.518 (22), p.6455-6459

2010

Volltextzugriff (PDF)

Improvement in etch selectivity of SiO2 to CVD amorphous carbon mask in dual-frequency capacitively coupled C4F8/CH2F2/O2/Ar plasmas

Thin solid films, 2010-09, Vol.518 (22), p.6451-6454

2010

Volltextzugriff (PDF)

Infinitely high etch selectivity during CH4/H2/Ar inductively coupled plasma (ICP) etching of indium tin oxide (ITO) with photoresist mask

Thin solid films, 2008-04, Vol.516 (11), p.3512-3516

2008

Volltextzugriff (PDF)

Micro-scale metallization on flexible polyimide substrate by Cu electroplating using SU-8 photoresist mask

Thin solid films, 2005-03, Vol.475 (1-2), p.68-71

2005

Volltextzugriff (PDF)

Comparison of line edge roughness and profile angles of chemical vapor deposited amorphous carbon etched in O2/N2/Ar and H2/N2/Ar inductively coupled plasmas

Thin solid films, 2011-08, Vol.519 (20), p.6755-6758

2011

Volltextzugriff (PDF)

Comparison of line edge roughness and profile angles of chemical vapor deposited amorphous carbon etched in O 2/N 2/Ar and H 2/N 2/Ar inductively coupled plasmas

Thin solid films, 2011-08, Vol.519 (20), p.6755-6758

2011

Volltextzugriff (PDF)

Deposition of ZnO thin films by magnetron sputtering for a film bulk acoustic resonator

Thin solid films, 2003-07, Vol.435 (1), p.179-185

2003

Volltextzugriff (PDF)

Sputter deposition modeling of Ti thin film on a sharp tip

Thin solid films, 2005-03, Vol.475 (1-2), p.144-149

2005

Volltextzugriff (PDF)

Effects of various additive gases on chemical dry etching rate enhancement of low- k SiOCH layer in F 2/Ar remote plasmas

Thin solid films, 2008-04, Vol.516 (11), p.3549-3553

2008

Volltextzugriff (PDF)

Effects of oxygen radical on the properties of indium tin oxide thin films deposited at room temperature by oxygen ion beam assisted evaporation

Thin solid films, 2000-12, Vol.377, p.103-108

2000

Volltextzugriff (PDF)

Chemical dry etching of silicon oxide in F2/Ar remote plasmas

Thin solid films, 2007-04, Vol.515 (12), p.4945-4949

2007

Volltextzugriff (PDF)

Increase of cleaning rate and reduction in global warming effect during C4F8O/O2 remote plasma cleaning of silicon nitride by adding NO and N2O

Thin solid films, 2003-07, Vol.435 (1-2), p.264-269

2003

Volltextzugriff (PDF)

NH3 effect on the growth of carbon nanotubes on glass substrate in plasma enhanced chemical vapor deposition

Thin solid films, 2002-04, Vol.409 (1), p.120-125

2002

Volltextzugriff (PDF)

Structural and electrical characteristics of epitaxial CoSi2 grown on n-Si0.83Ge0.17/n-Si(001) by reactive chemical vapor deposition using a Si capping layer

Thin solid films, 2004-06, Vol.458 (1-2), p.269-273

2004

Volltextzugriff (PDF)

1 – 25 von 185

Suche als RSS-Feed

Aktive Filter

Zeitschrift / SeriePhysical Review Letters

Zeitschrift / SerieThin Solid Films

ThemaPhysics

Suchergebnisse filtern

Filter anzeigen

Nur zeigen

Geprüft (Peer-Review)
(185)
Mit Volltextzugriff
(185)

Publikationsform

Artikel
(185)

Sprache

Englisch
(185)
Japanisch
(40)

Erscheinungsjahr

n.n

Kollektion

Elsevier Journal Backfiles on ScienceDirect (DFG Nationallizenzen)
(185)
IngentaConnect
(185)
Elsevier ScienceDirect Journals Complete
(185)
IngentaConnect Journals
(12)

Menü

Weitere Dienste

Einstellungen

Etching characteristics of silicon oxide using amorphous carbon hard mask in dual-frequency capacitively coupled plasma

Enhancement of flexural stress and reduction of surface roughness through changes in gas concentrations during high-speed chemical dry thinning of silicon wafers

Fast release process of metal structure using chemical dry etching of sacrificial Si layer

Enhanced critical current density in GdBa2Cu3O7−δ thin films with substrate surface decoration using Gd2O3 nanoparticles

Polymer thin film transistor with electroplated source and drain electrodes on a flexible substrate

Development of surface coating technology of TiO2 powder and improvement of photocatalytic activity by surface modification

The effects of gas flow rates on the etch characteristics of silicon nitride with an extreme ultra-violet resist pattern in CH2F2/N2/Ar capacitively coupled plasmas

Highly selective dry etching of alternating phase-shift mask (PSM) structures for extreme ultraviolet lithography (EUVL) using inductively coupled plasmas (ICP)

Physical properties and etching characteristics of metal (Al, Ag, Li) doped ZnO films grown by RF magnetron sputtering

Electrical characteristics of poly(3-hexylthiophene) organic thin film transistor with electroplated metal gate electrodes on polyimide

Effect of doping elements on ZnO etching characteristics with CH4/H2/Ar plasma

Superconformal copper filling of a nano-scale trench by nucleation suppression at the trench entrance during metal organic chemical vapor deposition

Improvement in etch selectivity of SiO2 to CVD amorphous carbon mask in dual-frequency capacitively coupled C4F8/CH2F2/O2/Ar plasmas

Infinitely high etch selectivity during CH4/H2/Ar inductively coupled plasma (ICP) etching of indium tin oxide (ITO) with photoresist mask

Micro-scale metallization on flexible polyimide substrate by Cu electroplating using SU-8 photoresist mask

Comparison of line edge roughness and profile angles of chemical vapor deposited amorphous carbon etched in O2/N2/Ar and H2/N2/Ar inductively coupled plasmas

Comparison of line edge roughness and profile angles of chemical vapor deposited amorphous carbon etched in O 2/N 2/Ar and H 2/N 2/Ar inductively coupled plasmas

Deposition of ZnO thin films by magnetron sputtering for a film bulk acoustic resonator

Sputter deposition modeling of Ti thin film on a sharp tip

Effects of various additive gases on chemical dry etching rate enhancement of low- k SiOCH layer in F 2/Ar remote plasmas

Effects of oxygen radical on the properties of indium tin oxide thin films deposited at room temperature by oxygen ion beam assisted evaporation

Chemical dry etching of silicon oxide in F2/Ar remote plasmas

Increase of cleaning rate and reduction in global warming effect during C4F8O/O2 remote plasma cleaning of silicon nitride by adding NO and N2O

NH3 effect on the growth of carbon nanotubes on glass substrate in plasma enhanced chemical vapor deposition

Structural and electrical characteristics of epitaxial CoSi2 grown on n-Si0.83Ge0.17/n-Si(001) by reactive chemical vapor deposition using a Si capping layer

Aktive Filter

Suchergebnisse filtern