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Metal Matrix Composites Using Diamond-like Carbon-Coated Particles Fabricated by Cold Spray Technique

Journal of thermal spray technology, 2020-10, Vol.29 (7), p.1660-1668

2020

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Trichoketides A and B, two new protein tyrosine phosphatase 1B inhibitors from the marine-derived fungus Trichoderma sp

Journal of antibiotics, 2015-10, Vol.68 (10), p.628-632

2015

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Verruculides A and B, two new protein tyrosine phosphatase 1B inhibitors from an Indonesian ascidian-derived Penicillium verruculosum

Bioorganic & medicinal chemistry letters, 2015-08, Vol.25 (16), p.3087-3090

2015

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A Card Stack Model to Elucidate Key Challenges in the Development of Future Generation Supercomputers

IEEE access, 2013, Vol.1, p.436-448

Nakayama, W.

2013

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Fabrication of a Highly Conductive Ordered Porous Electrode by Carbon-Coating of a Continuous Mesoporous Silica Film

Chemistry of materials, 2011-07, Vol.23 (13), p.3144-3151

2011

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Heat in Computers: Applied Heat Transfer in Information Technology

Journal of heat transfer, 2014-01, Vol.136 (1)

Nakayama, Wataru

2014

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Max Jakob Award Paper—Heat in Computers: Applied Heat Transfer in Information Technology

Journal of heat transfer, 2014, Vol.136 (1)

NAKAYAMA, Wataru

2014

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Design of Heat Conduction Panel: The Case of Multiple Heating Elements Cooled by a Displaced Heat Sink

Journal of electronic packaging, 2008-12, Vol.130 (4)

Nakayama, Wataru

2008

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Evolution of Hardware Morphology of Large-Scale Computers and the Trend of Space Allocation for Thermal Management

Journal of electronic packaging, 2017-03, Vol.139 (1)

Nakayama, Wataru

2017

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Improving the Direct Electron Transfer in Monolithic Bioelectrodes Prepared by Immobilization of FDH Enzyme on Carbon-Coated Anodic Aluminum Oxide Films

Frontiers in materials, 2016-02, Vol.3

2016

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Study on Heat Conduction in a Simulated Multicore Processor Chip—Part II: Case Studies

Journal of electronic packaging, 2013-06, Vol.135 (2)

Nakayama, Wataru

2013

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Study on Heat Conduction in a Simulated Multicore Processor Chip—Part I: Analytical Modeling

Journal of electronic packaging, 2013-06, Vol.135 (2)

Nakayama, Wataru

2013

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Heat Conduction in Mobile Electronic Equipment: Study on the Effects of Some Key Parameters on Heat Source Temperature Based on a Three-Layer Model

Journal of electronic packaging, 2013-09, Vol.135 (3)

Nakayama, Wataru

2013

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The Heat Transfer Society of Japan, the 50th Anniversary: Retrospect and Prospect

Heat transfer engineering, 2013-01, Vol.34 (5-6), p.409-419

Nakayama, Wataru

2013

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Deposition of High-Density Carbon Nanotube-Containing Nickel-Based Composite Films by Low-Pressure Cold Spray

Journal of thermal spray technology, 2020-12, Vol.29 (8), p.1902-1909

2020

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Slip history of the 1994 Sanriku-Haruka-Oki, Japan, earthquake deduced from strong-motion data

Bulletin of the Seismological Society of America, 1997-08, Vol.87 (4), p.918-931

1997

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Development of Neuromorphic Locomotion Generator with Switching Gait by Light Stimulation for Microrobots

2023 International Conference on IC Design and Technology (ICICDT), 2023, p.16-19

2023

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Heat Conduction in Printed Circuit Boards: A Mesoscale Modeling Approach

Journal of electronic packaging, 2008-12, Vol.130 (4)

Nakayama, Wataru

2008

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A New Role of CFD Simulation in Thermal Design of Compact Electronic Equipment: Application of the Build-up Approach to Thermal Analysis of a Benchmark Model

Journal of electronic packaging, 2004-12, Vol.126 (4), p.440-448

2004

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Experimental investigation of a heat switch based on the precise regulation of a liquid bridge

Applied thermal engineering, 2012-06, Vol.39, p.151-156

2012

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A methodology to work on geometrically complex heat transfer systems: the cases of heat conduction through composite slabs

International journal of heat and mass transfer, 2003-08, Vol.46 (18), p.3397-3409

Nakayama, Wataru

2003

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New design of a liquid bridge heat switch to ensure repetitive operation during changes in thermal conditions

Applied thermal engineering, 2013-09, Vol.59 (1-2), p.283-289

2013

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How to Beat Geometric Complexity

Heat transfer engineering, 2006-04, Vol.27 (3), p.1-4

Nakayama, Wataru

2006

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Professor Yasuo Mori (1923–2012)

International journal of heat and mass transfer, 2012-11, Vol.55 (23-24), p.6293-6294

2012

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Micro-Scale Technologies for Electronics Cooling

Heat transfer engineering, 2004-01, Vol.25 (1), p.1-3

NAKAYAMA, WATARU

2004

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Metal Matrix Composites Using Diamond-like Carbon-Coated Particles Fabricated by Cold Spray Technique

Trichoketides A and B, two new protein tyrosine phosphatase 1B inhibitors from the marine-derived fungus Trichoderma sp

Verruculides A and B, two new protein tyrosine phosphatase 1B inhibitors from an Indonesian ascidian-derived Penicillium verruculosum

A Card Stack Model to Elucidate Key Challenges in the Development of Future Generation Supercomputers

Fabrication of a Highly Conductive Ordered Porous Electrode by Carbon-Coating of a Continuous Mesoporous Silica Film

Heat in Computers: Applied Heat Transfer in Information Technology

Max Jakob Award Paper—Heat in Computers: Applied Heat Transfer in Information Technology

Design of Heat Conduction Panel: The Case of Multiple Heating Elements Cooled by a Displaced Heat Sink

Evolution of Hardware Morphology of Large-Scale Computers and the Trend of Space Allocation for Thermal Management

Improving the Direct Electron Transfer in Monolithic Bioelectrodes Prepared by Immobilization of FDH Enzyme on Carbon-Coated Anodic Aluminum Oxide Films

Study on Heat Conduction in a Simulated Multicore Processor Chip—Part II: Case Studies

Study on Heat Conduction in a Simulated Multicore Processor Chip—Part I: Analytical Modeling

Heat Conduction in Mobile Electronic Equipment: Study on the Effects of Some Key Parameters on Heat Source Temperature Based on a Three-Layer Model

The Heat Transfer Society of Japan, the 50th Anniversary: Retrospect and Prospect

Deposition of High-Density Carbon Nanotube-Containing Nickel-Based Composite Films by Low-Pressure Cold Spray

Slip history of the 1994 Sanriku-Haruka-Oki, Japan, earthquake deduced from strong-motion data

Development of Neuromorphic Locomotion Generator with Switching Gait by Light Stimulation for Microrobots

Heat Conduction in Printed Circuit Boards: A Mesoscale Modeling Approach

A New Role of CFD Simulation in Thermal Design of Compact Electronic Equipment: Application of the Build-up Approach to Thermal Analysis of a Benchmark Model

Experimental investigation of a heat switch based on the precise regulation of a liquid bridge

A methodology to work on geometrically complex heat transfer systems: the cases of heat conduction through composite slabs

New design of a liquid bridge heat switch to ensure repetitive operation during changes in thermal conditions

How to Beat Geometric Complexity

Professor Yasuo Mori (1923–2012)

Micro-Scale Technologies for Electronics Cooling

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