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Reactive Sintering of Copper Nanoparticles Using Intense Pulsed Light for Printed Electronics

Journal of electronic materials, 2011-01, Vol.40 (1), p.42-50

2011

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GaN Technology for Power Electronic Applications: A Review

Journal of Electronic Materials, 2016-06, Vol.45 (6), p.2673-2682

2016

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Thermoelectric Modules Based on Half-Heusler Materials Produced in Large Quantities

Journal of electronic materials, 2014-06, Vol.43 (6), p.1775-1781

2014

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Microwave ferrites, part 1: fundamental properties

Journal of materials science. Materials in electronics, 2009-09, Vol.20 (9), p.789-834

2009

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Thermal Cycling, Mechanical Degradation, and the Effective Figure of Merit of a Thermoelectric Module

Journal of electronic materials, 2013-03, Vol.42 (3), p.372-381

2013

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Multilayered Low Temperature Cofired Ceramics (LTCC) Technology

Imanaka, Yoshihiko

1. Aufl., 2005

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Semiconductor Packaging : Materials Interaction and Reliability

1st edition., 2016

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Solar Thermoelectric Generator for Micropower Applications

Journal of electronic materials, 2010-09, Vol.39 (9), p.1735-1740

2010

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Thermoelectric Properties and Thermal Stability of PEDOT:PSS Films on a Polyimide Substrate and Application in Flexible Energy Conversion Devices

Journal of electronic materials, 2014-06, Vol.43 (6), p.2196-2201

2014

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Influence of Joining Conditions on Bonding Strength of Joints: Efficacy of Low-Temperature Bonding Using Cu Nanoparticle Paste

Journal of electronic materials, 2013-06, Vol.42 (6), p.1260-1267

2013

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Thermoelectric Generation Using Waste Heat in Steel Works

Journal of electronic materials, 2014-06, Vol.43 (6), p.2405-2410

2014

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Thermo-mechanical Characterization of Metal/Polymer Composite Filaments and Printing Parameter Study for Fused Deposition Modeling in the 3D Printing Process

Journal of electronic materials, 2015-03, Vol.44 (3), p.771-777

2015

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Physical, Mechanical, and Structural Properties of Highly Efficient Nanostructured n- and p-Silicides for Practical Thermoelectric Applications

Journal of electronic materials, 2014-06, Vol.43 (6), p.1703-1711

2014

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Thermal to Electrical Energy Conversion of Skutterudite-Based Thermoelectric Modules

Journal of electronic materials, 2013-07, Vol.42 (7), p.1389-1399

2013

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Thermal Stress Analysis and Structure Parameter Selection for a Bi2Te3-Based Thermoelectric Module

Journal of electronic materials, 2011-05, Vol.40 (5), p.884-888

2011

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CNTFET-Based Design of Ternary Logic Gates and Arithmetic Circuits

IEEE transactions on nanotechnology, 2011-03, Vol.10 (2), p.217-225

2011

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IEEE_Xplore

Amorphous Chalcogenide Semiconductors and Related Materials

1. Aufl., 2011

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High-Reliability Low-Ag-Content Sn-Ag-Cu Solder Joints for Electronics Applications

Journal of electronic materials, 2012-09, Vol.41 (9), p.2631-2658

2012

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Analysis of Thermoelectric Generator Performance by Use of Simulations and Experiments

Journal of electronic materials, 2014-06, Vol.43 (6), p.2247-2254

2014

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Nano-Bio- Electronic, Photonic and MEMS Packaging

1. Aufl., 2010

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Graphene based field effect transistors: Efforts made towards flexible electronics

Solid-state electronics, 2013-11, Vol.89, p.177-188

2013

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Die Attach Materials for High Temperature Applications: A Review

IEEE transactions on components, packaging, and manufacturing technology (2011), 2011-04, Vol.1 (4), p.457-478

2011

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IEEE_Xplore

Electronics Thermal Management in Information and Communications Technologies: Challenges and Future Directions

IEEE transactions on components, packaging, and manufacturing technology (2011), 2017-08, Vol.7 (8), p.1191-1205

2017

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IEEE_Xplore

Joint Energy Harvesting and Communication Analysis for Perpetual Wireless Nanosensor Networks in the Terahertz Band

IEEE transactions on nanotechnology, 2012-05, Vol.11 (3), p.570-580

2012

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IEEE_Xplore

Introduction to Thermoelectricity

Goldsmid, H. Julian

Second edition., 2009

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Reactive Sintering of Copper Nanoparticles Using Intense Pulsed Light for Printed Electronics

GaN Technology for Power Electronic Applications: A Review

Thermoelectric Modules Based on Half-Heusler Materials Produced in Large Quantities

Microwave ferrites, part 1: fundamental properties

Thermal Cycling, Mechanical Degradation, and the Effective Figure of Merit of a Thermoelectric Module

Multilayered Low Temperature Cofired Ceramics (LTCC) Technology

Semiconductor Packaging : Materials Interaction and Reliability

Solar Thermoelectric Generator for Micropower Applications

Thermoelectric Properties and Thermal Stability of PEDOT:PSS Films on a Polyimide Substrate and Application in Flexible Energy Conversion Devices

Influence of Joining Conditions on Bonding Strength of Joints: Efficacy of Low-Temperature Bonding Using Cu Nanoparticle Paste

Thermoelectric Generation Using Waste Heat in Steel Works

Thermo-mechanical Characterization of Metal/Polymer Composite Filaments and Printing Parameter Study for Fused Deposition Modeling in the 3D Printing Process

Physical, Mechanical, and Structural Properties of Highly Efficient Nanostructured n- and p-Silicides for Practical Thermoelectric Applications

Thermal to Electrical Energy Conversion of Skutterudite-Based Thermoelectric Modules

Thermal Stress Analysis and Structure Parameter Selection for a Bi2Te3-Based Thermoelectric Module

CNTFET-Based Design of Ternary Logic Gates and Arithmetic Circuits

Amorphous Chalcogenide Semiconductors and Related Materials

High-Reliability Low-Ag-Content Sn-Ag-Cu Solder Joints for Electronics Applications

Analysis of Thermoelectric Generator Performance by Use of Simulations and Experiments

Nano-Bio- Electronic, Photonic and MEMS Packaging

Graphene based field effect transistors: Efforts made towards flexible electronics

Die Attach Materials for High Temperature Applications: A Review

Electronics Thermal Management in Information and Communications Technologies: Challenges and Future Directions

Joint Energy Harvesting and Communication Analysis for Perpetual Wireless Nanosensor Networks in the Terahertz Band

Introduction to Thermoelectricity

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