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IEEE transactions on components, packaging, and manufacturing technology (2011), 2018-05, Vol.8 (5), p.709-710
2018
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IEEE transactions on components, packaging, and manufacturing technology (2011), 2018-05, Vol.8 (5), p.725-734
2018
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2010 Proceedings 60th Electronic Components and Technology Conference (ECTC), 2010, p.1309-1315
2010
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2012 Second International Conference on Advanced Computing & Communication Technologies, 2012, p.474-480
2012
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Electromigration Mechanisms of Solder Joints with Limited Sn Volume in Advanced Electronic Packaging
2021
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2017 International Conference on Infocom Technologies and Unmanned Systems (Trends and Future Directions) (ICTUS), 2017, p.818-824
2017
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2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 2020, p.473-478
2020
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2009 46th ACM/IEEE Design Automation Conference, 2009, p.460-465
2009
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2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 2018, p.440-447
2018
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Proceedings 19th International Conference on Data Engineering (Cat. No.03CH37405), 2003, p.455-466
2003
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2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 2018, p.2280-2287
2018
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2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 2016, p.755-765
2016
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2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 2017, p.441-447
2017
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2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 2015, p.99-105
2015
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2015 Fifth International Conference on Advanced Computing & Communication Technologies, 2015, p.340-346
2015
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2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 2016, p.1128-1134
2016
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2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 2011, p.1263-1268
2011
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2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 2017, p.1145-1152
2017
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2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 2014, p.1457-1463
2014
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2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 2015, p.432-437
2015
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2013 IEEE 63rd Electronic Components and Technology Conference, 2013, p.1031-1036
2013
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52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345), 2002, p.732-739
2002
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IEEE transactions on device and materials reliability, 2007-03, Vol.7 (1), p.3-4
2007
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IEEE access, 2020-01, Vol.8, p.91916-91923
2020
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2023 World Conference on Communication & Computing (WCONF), 2023, p.1-4
2023
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- Science & Technology
- Technology
- Engineering
- Engineering, Electrical & Electronic
- Computer Science
- Soldering
- Failure Analysis
- Substrates
- Nickel
- Computer Science, Theory & Methods
- Electromigration
- Fault Isolation
- Imc
- Metallization
- Predictive Models
- Routing
- Routing Protocols
- Telecommunications
- Three-Dimensional Displays
- X-Ray Imaging
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