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2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), 2022, p.1-7
2022
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2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2020, p.402-409
2020
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2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2020, p.389-395
2020
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2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), 2021, p.518-523
2021
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2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), 2021, p.402-409
2021
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International journal of refrigeration, 2016-01, Vol.61, p.185-203
2016
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International journal of refrigeration, 2016-01, Vol.61, p.166-184
2016
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2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), 2021, p.1131-1139
2021
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2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2019, p.159-166
2019
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2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2020, p.396-401
2020
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2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), 2022, p.1-6
2022
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2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2019, p.243-250
2019
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2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2019, p.1296-1306
2019
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2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), 2021, p.423-430
2021
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2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2018, p.487-496
2018
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2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2019, p.232-242
2019
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2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2018, p.905-914
2018
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2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2017, p.678-686
2017
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2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2017, p.687-695
2017
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2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2017, p.667-677
2017
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2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2017, p.696-705
2017
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Thema
- Engineering
- Heat Transfer
- Science & Technology
- Technology
- Thermosyphon
- Two-Phase Flow
- Electronics Cooling
- Engineering, Electrical & Electronic
- Cooling
- Engineering, Mechanical
- Physical Sciences
- Thermal Resistance
- Thermodynamics
- Electronic Systems
- Resistance Heating
- Thermosyphons
- Data Centers
- Passive Cooling
- Refrigerants
- Water Heating
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