Sie befinden Sich nicht im Netzwerk der Universität Paderborn. Der Zugriff auf elektronische Ressourcen ist gegebenenfalls nur via VPN oder Shibboleth (DFN-AAI) möglich. mehr Informationen...
Sortiert nach
    Datensatz exportieren als...
  • BibTeX
Repeatedly Bendable Paper Touch Pad via Direct Stamping of Silver Nanoink With Pressure-Induced Low-Temperature Annealing
IEEE transactions on nanotechnology, 2013-11, Vol.12 (6), p.1139-1143
2013
    Datensatz exportieren als...
  • BibTeX
Electroplated Nickel/Tin Solder Pads for Rear Metallization of Solar Cells
IEEE journal of photovoltaics, 2016-03, Vol.6 (2), p.404-411
2016
Open Access
    Datensatz exportieren als...
  • BibTeX
Forced Motion Activated Self-Alignment of Micro-CPV Solar Cells
IEEE journal of photovoltaics, 2024-03, Vol.14 (2), p.288-295
2024
Link zum Volltext
Verfügbarkeit prüfen
    Datensatz exportieren als...
  • BibTeX
The GSG-PAD Layout Optimization for Test-Key of mm-Wave Devices
2019 China Semiconductor Technology International Conference (CSTIC), 2019, p.1-4
2019
Link zum Volltext
Verfügbarkeit prüfen
    Datensatz exportieren als...
  • BibTeX
Chemical Mechanical Material Removal of Silicon Dioxide by a Single Pad Asperity
2019 China Semiconductor Technology International Conference (CSTIC), 2019, p.1-3
2019
Link zum Volltext
Verfügbarkeit prüfen
    Datensatz exportieren als...
  • BibTeX
A high density pad-on-pad connector utilizing a flexible circuit
Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93), 1993, p.461-464
1993
    Datensatz exportieren als...
  • BibTeX
Effects of ball pad configuration on joint reliability in BGA chip-scale packages
Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971), 2004, p.735-739
2004
    Datensatz exportieren als...
  • BibTeX
Bump non-wet issue in large-die flip chip package with eutectic Sn/Pb solder bump and SOP substrate pad
Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971), 2004, p.438-443
2004
    Datensatz exportieren als...
  • BibTeX
The effect of pretreatment process on electroless nickel bumping for different Al pads
Proceedings. 7th International Conference on Solid-State and Integrated Circuits Technology, 2004, 2004, Vol.1, p.603-606 vol.1
2004
    Datensatz exportieren als...
  • BibTeX
Effects of Cu/Al intermetallic compound (IMC) on copper wire and aluminum pad bondability
Advances in Electronic Materials and Packaging 2001 (Cat. No.01EX506), 2001, p.44-51
2001
    Datensatz exportieren als...
  • BibTeX
Influences of pad shape and solder microstructure on shear force of low cost flip chip bumps
International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458), 2000, p.91-98
2000
    Datensatz exportieren als...
  • BibTeX
The effect of ultrasonic power on bonding pad and IMD layers in ultrasonic wire bonding
Advances in Electronic Materials and Packaging 2001 (Cat. No.01EX506), 2001, p.235-242
2001
    Datensatz exportieren als...
  • BibTeX
Fine pitch wire bonding development using a new multipurpose, multi-pad pitch test die
1991 Proceedings 41st Electronic Components & Technology Conference, 1991, p.511-518
1991
    Datensatz exportieren als...
  • BibTeX
Transfer-Length Method Measurements Under Variable Illumination to Investigate Hole-Selective Passivating Contacts on c-Si(p) and c-Si(n) Wafers
IEEE journal of photovoltaics, 2023-05, Vol.13 (3), p.1-10
2023
Open Access
    Datensatz exportieren als...
  • BibTeX
Dark Lock-in Thermography Identifies Solder Bond Failure as the Root Cause of Series Resistance Increase in Fielded Solar Modules
IEEE journal of photovoltaics, 2020-09, Vol.10 (5), p.1409-1416
2020
Open Access
    Datensatz exportieren als...
  • BibTeX
Graphene-Based Plasmonic Tunable Low-Pass Filters in the Terahertz Band
IEEE transactions on nanotechnology, 2014-11, Vol.13 (6), p.1145-1153
2014
    Datensatz exportieren als...
  • BibTeX
Effects of probe damage on wire bond integrity
2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220), 2001, p.1175-1180
2001
    Datensatz exportieren als...
  • BibTeX
Room Temperature Air Pollutants Sensors Using Printed ZnO Single-Nanowire Schottky Diodes
IEEE transactions on nanotechnology, 2021, Vol.20, p.338-345
2021
    Datensatz exportieren als...
  • BibTeX
Development of Innovative Application Films for Silicon Solar Cells Using a Copper-Phosphorus Alloy by an Atmospheric Sintering Process
IEEE journal of photovoltaics, 2013-10, Vol.3 (4), p.1178-1183
2013
    Datensatz exportieren als...
  • BibTeX
AlGaN/GaN HEMT Based pH Detection Using Atomic Layer Deposition of Al2O3 as Sensing Membrane and Passivation
IEEE transactions on nanotechnology, 2023-01, Vol.22, p.466
2023
Link zum Volltext
Verfügbarkeit prüfen
    Datensatz exportieren als...
  • BibTeX
Novel Biosensor Based on Electrospun Nanofiber and Magnetic Nanoparticles for the Detection of E. coli O157:H7
IEEE transactions on nanotechnology, 2012-07, Vol.11 (4), p.676-681
2012
    Datensatz exportieren als...
  • BibTeX
Microscale Hybrid Flexible Circuit Printed With Aerosol Jet Technique
IEEE transactions on nanotechnology, 2018-09, Vol.17 (5), p.979-984
2018
    Datensatz exportieren als...
  • BibTeX
Anodic Niobia Column-like 3-D Nanostructures for Semiconductor Devices
IEEE transactions on nanotechnology, 2019, Vol.18, p.790-797
2019
    Datensatz exportieren als...
  • BibTeX
Modeling of Carbon Nanotube-Based Differential Through-Silicon Vias in 3-D ICs
IEEE transactions on nanotechnology, 2020, Vol.19, p.492-499
2020
    Datensatz exportieren als...
  • BibTeX
Novel Piezoelectric Polymer Composites for Flexible Electronic Device
2021 IEEE International Symposium on Applications of Ferroelectrics (ISAF), 2021, p.1-6
2021
1 – 25 von 130
Suche als RSS-Feed
Aktive Filter
Zeitschrift / SerieIeee Transactions On Applied Superconductivity
KollektionIEEE Xplore
ThemaMaterials Science, Multidisciplinary
ThemaPhysical Sciences
Suchergebnisse filtern
Filter anzeigen