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On the wafer/pad friction of chemical-mechanical planarization (CMP) processes - Part I: modeling and analysis
IEEE transactions on semiconductor manufacturing, 2005-08, Vol.18 (3), p.359-370
2005
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Pad Conditioning Density Distribution in CMP Process With Diamond Dresser
IEEE transactions on semiconductor manufacturing, 2007-11, Vol.20 (4), p.464-475
2007
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The Effect of Cu CMP Pad Clean on Defectivity and Reliability
IEEE transactions on semiconductor manufacturing, 2013-08, Vol.26 (3), p.344-349
2013
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Material removal regions in chemical mechanical planarization for submicron integrated circuit fabrication: coupling effects of slurry chemicals, abrasive size distribution,and wafer-pad contact area
IEEE transactions on semiconductor manufacturing, 2003-02, Vol.16 (1), p.45-56
2003
Open Access
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On the wafer/pad friction of chemical-mechanical planarization (CMP) processes- Part II: experiments and applications
IEEE transactions on semiconductor manufacturing, 2005-08, Vol.18 (3), p.371-383
2005
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Nonuniformity of Wafer and Pad in CMP: Kinematic Aspects of View
IEEE transactions on semiconductor manufacturing, 2007-11, Vol.20 (4), p.451-463
2007
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Pad Deflection-Based Model of Chemical-Mechanical Polishing for Use in CAD IC Layout
IEEE transactions on semiconductor manufacturing, 2010-02, Vol.23 (1), p.121-131
2010
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A stochastic model for the effects of pad surface topography evolution on material removal rate decay in chemical-mechanical planarization
IEEE transactions on semiconductor manufacturing, 2005-11, Vol.18 (4), p.695-708
2005
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Study on the Mechanical Properties of CMP Pads
IEEE transactions on semiconductor manufacturing, 2008-08, Vol.21 (3), p.454-463
2008
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In situ endpoint detection by pad temperature in chemical-mechanical polishing of copper overlay
IEEE transactions on semiconductor manufacturing, 2004-05, Vol.17 (2), p.180-187
2004
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Uniform Square Polycrystalline Silicon Fabricated by Employing Periodic Metallic Pads and SiON Absorption Layer for Thin Film Transistors
IEEE transactions on electron devices, 2008-08, Vol.55 (8), p.2212-2217
2008
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Nondestructive characterization of CMP pads using statistical design analysis
IEEE transactions on semiconductor manufacturing, 2005-11, Vol.18 (4), p.664-671
2005
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The Improvement of Polycrystalline Silicon TFTs Fabricated by Employing Periodic Metal Pads
IEEE transactions on electron devices, 2006-08, Vol.53 (8), p.1939-1943
2006
Open Access
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Polymer Light Emitting Diodes Powered via Paper-Mounted Electronics
Journal of display technology, 2016-06, Vol.12 (6), p.583-588
2016
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Analysis of energy process window of laser metal pad cut link structure
IEEE transactions on semiconductor manufacturing, 2003-05, Vol.16 (2), p.299-306
2003
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Visualized characterization of slurry film between wafer and pad during chemical mechanical planarization
IEEE transactions on semiconductor manufacturing, 2002-02, Vol.15 (1), p.45-50
2002
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Probing and wire bonding of aluminum capped copper pads
2002 IEEE International Reliability Physics Symposium. Proceedings. 40th Annual (Cat. No.02CH37320), 2002, p.140-143
2002
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Uncertainty Analysis of Two-Step and Three-Step Methods for Deembedding On-Wafer RF Transistor Measurements
IEEE transactions on electron devices, 2008-08, Vol.55 (8), p.2195-2201
2008
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Electromigration-limited lifetime of aluminum bond pads
IEEE International Integrated Reliability Workshop Final Report, 2004, 2004, p.86-89
2004
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Flying characteristics of shallow step pads slider for low flying
IEEE transactions on magnetics, 1999-09, Vol.35 (5), p.2475-2477
1999
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Greenwood-Williamson Model Combining Pattern-Density and Pattern-Size Effects in CMP
IEEE transactions on semiconductor manufacturing, 2011-05, Vol.24 (2), p.338-347
2011
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A new lossy substrate de-embedding method for sub-100 nm RF CMOS noise extraction and modeling
IEEE transactions on electron devices, 2006-02, Vol.53 (2), p.339-347
2006
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Comparison of numerical and experimental flying characteristics of tri-pad sliders
IEEE transactions on magnetics, 1995-11, Vol.31 (6), p.2970-2972
1995
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Investigation and Modeling of Hot Carrier Effects on Performance of 45- and 55-nm NMOSFETs With RF Automatic Measurement
IEEE transactions on electron devices, 2008-06, Vol.55 (6), p.1541-1546
2008
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Complementary-SCR ESD protection circuit with interdigitated finger-type layout for input pads of submicron CMOS IC's
IEEE transactions on electron devices, 1995-07, Vol.42 (7), p.1297-1304
1995
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